JPS6362096B2 - - Google Patents

Info

Publication number
JPS6362096B2
JPS6362096B2 JP11919782A JP11919782A JPS6362096B2 JP S6362096 B2 JPS6362096 B2 JP S6362096B2 JP 11919782 A JP11919782 A JP 11919782A JP 11919782 A JP11919782 A JP 11919782A JP S6362096 B2 JPS6362096 B2 JP S6362096B2
Authority
JP
Japan
Prior art keywords
soldering
piece
connecting piece
curved
connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP11919782A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5870563A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS5870563A publication Critical patent/JPS5870563A/ja
Publication of JPS6362096B2 publication Critical patent/JPS6362096B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/481—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H01L2224/401—Disposition
    • H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/40225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H10W72/07141—
    • H10W72/07636—
    • H10W72/07652—
    • H10W72/627—
    • H10W72/631—
    • H10W72/652—
    • H10W72/655—
    • H10W72/926—
    • H10W90/754—
    • H10W90/764—

Landscapes

  • Thyristors (AREA)
  • Wire Bonding (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
JP57119197A 1981-07-11 1982-07-10 半導体部品のための電気接続片 Granted JPS5870563A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19813127458 DE3127458A1 (de) 1981-07-11 1981-07-11 Elektrische verbindungslasche fuer halbleiterbauelemente
DE3127458.7 1981-07-11

Publications (2)

Publication Number Publication Date
JPS5870563A JPS5870563A (ja) 1983-04-27
JPS6362096B2 true JPS6362096B2 (cg-RX-API-DMAC10.html) 1988-12-01

Family

ID=6136701

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57119197A Granted JPS5870563A (ja) 1981-07-11 1982-07-10 半導体部品のための電気接続片

Country Status (5)

Country Link
US (1) US4502750A (cg-RX-API-DMAC10.html)
EP (1) EP0069903B1 (cg-RX-API-DMAC10.html)
JP (1) JPS5870563A (cg-RX-API-DMAC10.html)
AT (1) ATE23003T1 (cg-RX-API-DMAC10.html)
DE (1) DE3127458A1 (cg-RX-API-DMAC10.html)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3406537A1 (de) * 1984-02-23 1985-08-29 Brown, Boveri & Cie Ag, 6800 Mannheim Anordnung eines leistungshalbleiterbauelementes auf einem isolierenden und mit leiterbahnen versehenen substrat
DE3406538A1 (de) * 1984-02-23 1985-08-29 Bbc Brown Boveri & Cie Leistungshalbleitermodul und verfahren zur herstellung
DE3528427A1 (de) * 1985-08-08 1987-04-02 Bbc Brown Boveri & Cie Elektrische verbindungslasche fuer halbleiterbauelemente
DE4300516C2 (de) * 1993-01-12 2001-05-17 Ixys Semiconductor Gmbh Leistungshalbleitermodul
US6485603B1 (en) * 1999-07-01 2002-11-26 Applied Materials, Inc. Method and apparatus for conserving energy within a process chamber
US6267630B1 (en) 1999-08-04 2001-07-31 Antaya Technologies Corporation Circular connector with blade terminal
TW201819790A (zh) 2016-11-16 2018-06-01 日商日本精工股份有限公司 滾動軸承用保持器及滾動軸承

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE950068C (de) * 1953-01-20 1956-10-04 Nelken Kg Dr Ewald Elektrischer Schienenverbinder
DE1514805B2 (de) * 1965-04-03 1971-08-19 Telefunken Patentverwertungsgesellschaft Mbh, 7900 Ulm Verfahren zum kontaktieren von halbleiterbauelementen
US4023008A (en) * 1972-12-28 1977-05-10 Saint-Gobain Industries Terminal connection for electric heaters for vehicle windows
US4129243A (en) * 1975-07-30 1978-12-12 General Electric Company Double side cooled, pressure mounted semiconductor package and process for the manufacture thereof
US4054238A (en) * 1976-03-23 1977-10-18 Western Electric Company, Inc. Method, apparatus and lead frame for assembling leads with terminals on a substrate
DE2728330A1 (de) * 1977-06-23 1979-01-11 Siemens Ag Verfahren zum verloeten von kontaktteilen und/oder halbleiterplaettchen
US4151544A (en) * 1977-12-27 1979-04-24 Motorola, Inc. Lead terminal for button diode
US4246467A (en) * 1979-07-20 1981-01-20 Ford Motor Company Electric terminal for connecting a heating grid on a thermal window

Also Published As

Publication number Publication date
EP0069903A2 (de) 1983-01-19
DE3127458C2 (cg-RX-API-DMAC10.html) 1987-06-25
JPS5870563A (ja) 1983-04-27
EP0069903B1 (de) 1986-10-15
DE3127458A1 (de) 1983-02-03
US4502750A (en) 1985-03-05
EP0069903A3 (en) 1984-11-28
ATE23003T1 (de) 1986-11-15

Similar Documents

Publication Publication Date Title
JP3758408B2 (ja) セラミック電子部品
JP2504610B2 (ja) 電力用半導体装置
JPH0799766B2 (ja) 半導体素子
US5291178A (en) Film-type resistor assembly with full encapsulation except at the bottom surface
JPH077038A (ja) 電子パッケージ
JPS6362096B2 (cg-RX-API-DMAC10.html)
US4327370A (en) Resilient contact ring for providing a low impedance connection to the base region of a semiconductor device
JPS637030B2 (cg-RX-API-DMAC10.html)
JP2000068102A (ja) 抵抗器
JPH0422496Y2 (cg-RX-API-DMAC10.html)
JPS629722Y2 (cg-RX-API-DMAC10.html)
JPS5814611Y2 (ja) 半導体装置
JPH1140716A (ja) 半導体装置およびその製造方法
JPH0436106Y2 (cg-RX-API-DMAC10.html)
JPH02244530A (ja) 基板型温度ヒューズ及びその製造方法
JPH0142353Y2 (cg-RX-API-DMAC10.html)
JPS58100967A (ja) 金属部品の製造方法
JP2771567B2 (ja) 混成集積回路
JPH0246043Y2 (cg-RX-API-DMAC10.html)
JPH0546281Y2 (cg-RX-API-DMAC10.html)
JPS5915386B2 (ja) 半導体装置用ヘッダの製造方法
JPS62183149A (ja) ピン・グリツド・アレイパツケ−ジ
JPS6010701A (ja) 正特性サ−ミスタ
JP2583198B2 (ja) 電子部品用金属端子付き基板
JPS5844510Y2 (ja) ヒユ−ズ構造体