JPS635900B2 - - Google Patents

Info

Publication number
JPS635900B2
JPS635900B2 JP57191510A JP19151082A JPS635900B2 JP S635900 B2 JPS635900 B2 JP S635900B2 JP 57191510 A JP57191510 A JP 57191510A JP 19151082 A JP19151082 A JP 19151082A JP S635900 B2 JPS635900 B2 JP S635900B2
Authority
JP
Japan
Prior art keywords
nozzle
negative pressure
micro
outer nozzle
introduction pipe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57191510A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5979547A (ja
Inventor
Hideo Ichimura
Hisashi Kato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP57191510A priority Critical patent/JPS5979547A/ja
Publication of JPS5979547A publication Critical patent/JPS5979547A/ja
Publication of JPS635900B2 publication Critical patent/JPS635900B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment

Landscapes

  • Supply And Installment Of Electrical Components (AREA)
  • Gripping Jigs, Holding Jigs, And Positioning Jigs (AREA)
  • Manipulator (AREA)
JP57191510A 1982-10-28 1982-10-28 微小部品吸着装置 Granted JPS5979547A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57191510A JPS5979547A (ja) 1982-10-28 1982-10-28 微小部品吸着装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57191510A JPS5979547A (ja) 1982-10-28 1982-10-28 微小部品吸着装置

Publications (2)

Publication Number Publication Date
JPS5979547A JPS5979547A (ja) 1984-05-08
JPS635900B2 true JPS635900B2 (https=) 1988-02-05

Family

ID=16275849

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57191510A Granted JPS5979547A (ja) 1982-10-28 1982-10-28 微小部品吸着装置

Country Status (1)

Country Link
JP (1) JPS5979547A (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0417306Y2 (https=) * 1984-12-26 1992-04-17
JPS61199697A (ja) * 1985-03-01 1986-09-04 日本電気株式会社 チツプ部品搭載機
JPH0671155B2 (ja) * 1985-05-20 1994-09-07 松下電器産業株式会社 電子部品の突上げ装置
JPH0666560B2 (ja) * 1985-07-12 1994-08-24 松下電器産業株式会社 電子部品移載装置
JPS63107544U (https=) * 1986-12-27 1988-07-11
JP2693473B2 (ja) * 1988-03-29 1997-12-24 株式会社東芝 部品装着装置
JPH0627067U (ja) * 1992-09-05 1994-04-12 九州コマツ電子株式会社 真空チャック
WO2009056468A1 (en) * 2007-10-31 2009-05-07 Oerlikon Assembly Equipment Ag, Steinhausen Pick-up tool and method for grasping and mounting small dies
CN103872191B (zh) * 2014-02-26 2017-04-05 九江嘉远科技有限公司 一种led系列smt吸嘴的制造方法
WO2016001720A1 (en) * 2014-07-03 2016-01-07 Daems Giovanni Bvba Handling device for picking up a stone from a holder and for setting this stone in a workpiece
TWI711572B (zh) * 2015-12-01 2020-12-01 荷蘭商耐克創新有限合夥公司 拾取工具、材料拾取系統以及藉由拾取工具移動材料的方法

Also Published As

Publication number Publication date
JPS5979547A (ja) 1984-05-08

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