JPS5979547A - 微小部品吸着装置 - Google Patents

微小部品吸着装置

Info

Publication number
JPS5979547A
JPS5979547A JP57191510A JP19151082A JPS5979547A JP S5979547 A JPS5979547 A JP S5979547A JP 57191510 A JP57191510 A JP 57191510A JP 19151082 A JP19151082 A JP 19151082A JP S5979547 A JPS5979547 A JP S5979547A
Authority
JP
Japan
Prior art keywords
nozzle
negative pressure
outer nozzle
suction
collar
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57191510A
Other languages
English (en)
Japanese (ja)
Other versions
JPS635900B2 (https=
Inventor
Hideo Ichimura
英男 市村
Hisashi Kato
恒 加藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP57191510A priority Critical patent/JPS5979547A/ja
Publication of JPS5979547A publication Critical patent/JPS5979547A/ja
Publication of JPS635900B2 publication Critical patent/JPS635900B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment

Landscapes

  • Supply And Installment Of Electrical Components (AREA)
  • Gripping Jigs, Holding Jigs, And Positioning Jigs (AREA)
  • Manipulator (AREA)
JP57191510A 1982-10-28 1982-10-28 微小部品吸着装置 Granted JPS5979547A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57191510A JPS5979547A (ja) 1982-10-28 1982-10-28 微小部品吸着装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57191510A JPS5979547A (ja) 1982-10-28 1982-10-28 微小部品吸着装置

Publications (2)

Publication Number Publication Date
JPS5979547A true JPS5979547A (ja) 1984-05-08
JPS635900B2 JPS635900B2 (https=) 1988-02-05

Family

ID=16275849

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57191510A Granted JPS5979547A (ja) 1982-10-28 1982-10-28 微小部品吸着装置

Country Status (1)

Country Link
JP (1) JPS5979547A (https=)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61112830U (https=) * 1984-12-26 1986-07-17
JPS61199697A (ja) * 1985-03-01 1986-09-04 日本電気株式会社 チツプ部品搭載機
JPS61267656A (ja) * 1985-05-20 1986-11-27 Matsushita Electric Ind Co Ltd 電子部品の突上げ装置
JPS6215891A (ja) * 1985-07-12 1987-01-24 松下電器産業株式会社 電子部品移載装置
JPS63107544U (https=) * 1986-12-27 1988-07-11
JPH01246899A (ja) * 1988-03-29 1989-10-02 Toshiba Corp 部品装着装置
JPH0627067U (ja) * 1992-09-05 1994-04-12 九州コマツ電子株式会社 真空チャック
WO2009056468A1 (en) * 2007-10-31 2009-05-07 Oerlikon Assembly Equipment Ag, Steinhausen Pick-up tool and method for grasping and mounting small dies
CN103872191A (zh) * 2014-02-26 2014-06-18 九江嘉远科技有限公司 一种led系列smt吸嘴及其制作工艺
WO2016001720A1 (en) * 2014-07-03 2016-01-07 Daems Giovanni Bvba Handling device for picking up a stone from a holder and for setting this stone in a workpiece
CN110733892A (zh) * 2015-12-01 2020-01-31 耐克创新有限合伙公司 制造的拾取工具
US12612267B2 (en) 2023-12-18 2026-04-28 Nike, Inc. Manufacturing pickup tool

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61112830U (https=) * 1984-12-26 1986-07-17
JPS61199697A (ja) * 1985-03-01 1986-09-04 日本電気株式会社 チツプ部品搭載機
JPS61267656A (ja) * 1985-05-20 1986-11-27 Matsushita Electric Ind Co Ltd 電子部品の突上げ装置
JPS6215891A (ja) * 1985-07-12 1987-01-24 松下電器産業株式会社 電子部品移載装置
JPS63107544U (https=) * 1986-12-27 1988-07-11
JPH01246899A (ja) * 1988-03-29 1989-10-02 Toshiba Corp 部品装着装置
JPH0627067U (ja) * 1992-09-05 1994-04-12 九州コマツ電子株式会社 真空チャック
WO2009056468A1 (en) * 2007-10-31 2009-05-07 Oerlikon Assembly Equipment Ag, Steinhausen Pick-up tool and method for grasping and mounting small dies
CN103872191A (zh) * 2014-02-26 2014-06-18 九江嘉远科技有限公司 一种led系列smt吸嘴及其制作工艺
CN103872191B (zh) * 2014-02-26 2017-04-05 九江嘉远科技有限公司 一种led系列smt吸嘴的制造方法
WO2016001720A1 (en) * 2014-07-03 2016-01-07 Daems Giovanni Bvba Handling device for picking up a stone from a holder and for setting this stone in a workpiece
CN110733892A (zh) * 2015-12-01 2020-01-31 耐克创新有限合伙公司 制造的拾取工具
US11078033B2 (en) 2015-12-01 2021-08-03 Nike, Inc. Manufacturing pickup tool
CN110733892B (zh) * 2015-12-01 2021-09-03 耐克创新有限合伙公司 制造的拾取工具
US11884496B2 (en) 2015-12-01 2024-01-30 Nike, Inc. Manufacturing pickup tool
US12612267B2 (en) 2023-12-18 2026-04-28 Nike, Inc. Manufacturing pickup tool

Also Published As

Publication number Publication date
JPS635900B2 (https=) 1988-02-05

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