JPS635252Y2 - - Google Patents
Info
- Publication number
- JPS635252Y2 JPS635252Y2 JP13003783U JP13003783U JPS635252Y2 JP S635252 Y2 JPS635252 Y2 JP S635252Y2 JP 13003783 U JP13003783 U JP 13003783U JP 13003783 U JP13003783 U JP 13003783U JP S635252 Y2 JPS635252 Y2 JP S635252Y2
- Authority
- JP
- Japan
- Prior art keywords
- frame
- lead
- lead frame
- guide
- external
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 description 12
- 238000005452 bending Methods 0.000 description 10
- 239000000463 material Substances 0.000 description 6
- 239000002699 waste material Substances 0.000 description 5
- 239000008188 pellet Substances 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13003783U JPS6037252U (ja) | 1983-08-23 | 1983-08-23 | 半導体装置用リ−ドフレ−ム |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13003783U JPS6037252U (ja) | 1983-08-23 | 1983-08-23 | 半導体装置用リ−ドフレ−ム |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6037252U JPS6037252U (ja) | 1985-03-14 |
| JPS635252Y2 true JPS635252Y2 (h) | 1988-02-12 |
Family
ID=30294451
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13003783U Granted JPS6037252U (ja) | 1983-08-23 | 1983-08-23 | 半導体装置用リ−ドフレ−ム |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6037252U (h) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0669077B2 (ja) * | 1984-11-22 | 1994-08-31 | 株式会社日立製作所 | 半導体装置の組立方法 |
-
1983
- 1983-08-23 JP JP13003783U patent/JPS6037252U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6037252U (ja) | 1985-03-14 |
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