JPS6352462B2 - - Google Patents

Info

Publication number
JPS6352462B2
JPS6352462B2 JP61149512A JP14951286A JPS6352462B2 JP S6352462 B2 JPS6352462 B2 JP S6352462B2 JP 61149512 A JP61149512 A JP 61149512A JP 14951286 A JP14951286 A JP 14951286A JP S6352462 B2 JPS6352462 B2 JP S6352462B2
Authority
JP
Japan
Prior art keywords
wire
clamper
bonding
capillary
gold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP61149512A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6211242A (ja
Inventor
Juzo Taniguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP61149512A priority Critical patent/JPS6211242A/ja
Publication of JPS6211242A publication Critical patent/JPS6211242A/ja
Publication of JPS6352462B2 publication Critical patent/JPS6352462B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01551—Changing the shapes of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07511—Treating the bonding area before connecting, e.g. by applying flux or cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
JP61149512A 1986-06-27 1986-06-27 ワイヤボンデイング装置 Granted JPS6211242A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61149512A JPS6211242A (ja) 1986-06-27 1986-06-27 ワイヤボンデイング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61149512A JPS6211242A (ja) 1986-06-27 1986-06-27 ワイヤボンデイング装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP8135879A Division JPS567442A (en) 1979-06-29 1979-06-29 Wire bonding device

Publications (2)

Publication Number Publication Date
JPS6211242A JPS6211242A (ja) 1987-01-20
JPS6352462B2 true JPS6352462B2 (enExample) 1988-10-19

Family

ID=15476761

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61149512A Granted JPS6211242A (ja) 1986-06-27 1986-06-27 ワイヤボンデイング装置

Country Status (1)

Country Link
JP (1) JPS6211242A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4467631B1 (ja) 2009-01-07 2010-05-26 株式会社新川 ワイヤボンディング方法
JP4658224B2 (ja) * 2010-01-26 2011-03-23 株式会社新川 ワイヤボンディング装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5366168A (en) * 1976-11-26 1978-06-13 Hitachi Ltd Detection method for wire disconnection
JPS5466770A (en) * 1977-11-08 1979-05-29 Shinkawa Seisakusho Kk Device for bonding wires

Also Published As

Publication number Publication date
JPS6211242A (ja) 1987-01-20

Similar Documents

Publication Publication Date Title
JP4382281B2 (ja) 電気的な接続部を形成するための方法およびコンタクト部
KR101378324B1 (ko) 와이어 상호 연결부를 형성하기 위한 와이어 본딩 방법 및 와이어 본딩용 장치
US6244499B1 (en) Structure of a ball bump for wire bonding and the formation thereof
US20050092815A1 (en) Semiconductor device and wire bonding method
US20050167473A1 (en) Method for producing wedge-wedge wire connection
JPS6352462B2 (enExample)
US6467677B1 (en) Method and contact point for producing an electrical connection
US6270000B1 (en) Wire bonding method
JP2885242B1 (ja) ワイヤボンディング方法及び装置
JP2894344B1 (ja) ワイヤボンディング方法
JP3322642B2 (ja) 半導体装置の製造方法
JP2977990B2 (ja) ワイヤボンディング方法
JP3457196B2 (ja) ボールボンディング方法
JP3202193B2 (ja) ワイヤボンディング方法
JPS62150854A (ja) 電極形成方法および装置
JP3296505B2 (ja) バンプ電極形成装置
JP2579833B2 (ja) ワイヤボンディング方法
JPH025533Y2 (enExample)
JPH0236064B2 (enExample)
JP3615934B2 (ja) バンプ形成方法及びバンプボンダー
JPS6081835A (ja) 自動ボンデイングワイヤ−通し機構
JP2006013306A (ja) ボールボンディング方法およびボールボンディング装置
JPH06132344A (ja) ワイヤボンディング装置
JPH03263844A (ja) ワイヤボンダにおけるキャピラリへのワイヤの挿通方法
JPS61234044A (ja) ワイヤボンデイング方法