JPS6351538B2 - - Google Patents

Info

Publication number
JPS6351538B2
JPS6351538B2 JP16236282A JP16236282A JPS6351538B2 JP S6351538 B2 JPS6351538 B2 JP S6351538B2 JP 16236282 A JP16236282 A JP 16236282A JP 16236282 A JP16236282 A JP 16236282A JP S6351538 B2 JPS6351538 B2 JP S6351538B2
Authority
JP
Japan
Prior art keywords
metal
metal plate
solder
heat
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP16236282A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5952854A (ja
Inventor
Yasutoshi Kurihara
Tadashi Minagawa
Komei Yatsuno
Kenji Nakamura
Kenichi Hironaka
Masayoshi Sunada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP16236282A priority Critical patent/JPS5952854A/ja
Publication of JPS5952854A publication Critical patent/JPS5952854A/ja
Publication of JPS6351538B2 publication Critical patent/JPS6351538B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4882—Assembly of heatsink parts

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Adhesive Tapes (AREA)
JP16236282A 1982-09-20 1982-09-20 絶縁型半導体装置の製法 Granted JPS5952854A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16236282A JPS5952854A (ja) 1982-09-20 1982-09-20 絶縁型半導体装置の製法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16236282A JPS5952854A (ja) 1982-09-20 1982-09-20 絶縁型半導体装置の製法

Publications (2)

Publication Number Publication Date
JPS5952854A JPS5952854A (ja) 1984-03-27
JPS6351538B2 true JPS6351538B2 (da) 1988-10-14

Family

ID=15753121

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16236282A Granted JPS5952854A (ja) 1982-09-20 1982-09-20 絶縁型半導体装置の製法

Country Status (1)

Country Link
JP (1) JPS5952854A (da)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0537530Y2 (da) * 1985-05-27 1993-09-22
IN168174B (da) * 1986-04-22 1991-02-16 Siemens Ag
JPS62203511U (da) * 1986-06-16 1987-12-25
JPH0821599B2 (ja) * 1987-04-06 1996-03-04 株式会社巴川製紙所 半導体装置
JPH01120131A (ja) * 1987-11-02 1989-05-12 Kokusai Electric Co Ltd 送信負荷安定化制御回路
JP2518716B2 (ja) * 1989-05-29 1996-07-31 株式会社巴川製紙所 接着シ―ト及び半導体装置
JP2665988B2 (ja) * 1990-04-14 1997-10-22 株式会社 巴川製紙所 接着シート
JP2622768B2 (ja) * 1990-04-14 1997-06-18 株式会社 巴川製紙所 接着シート
JPH0587956U (ja) * 1992-04-30 1993-11-26 太陽誘電株式会社 放熱フィンを備えた回路基板
JP2872531B2 (ja) * 1993-04-30 1999-03-17 日立電線株式会社 半導体モジュール基板，及びそれを用いた半導体装置
JP4640089B2 (ja) * 2005-10-03 2011-03-02 日産自動車株式会社 電力変換装置

Also Published As

Publication number Publication date
JPS5952854A (ja) 1984-03-27

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