JPS6351480U - - Google Patents
Info
- Publication number
- JPS6351480U JPS6351480U JP1986146170U JP14617086U JPS6351480U JP S6351480 U JPS6351480 U JP S6351480U JP 1986146170 U JP1986146170 U JP 1986146170U JP 14617086 U JP14617086 U JP 14617086U JP S6351480 U JPS6351480 U JP S6351480U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- package
- printed circuit
- electronic component
- copper foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図ａは本考案の第１の実施例に適用される
パツケージ型電子部品の斜視図、第１図ｂは本考
案の第２の実施例の説明図、第２図ａ，ｂは従来
装置の説明図、第３図ａ，ｂは他の従来装置の説
明図である。
１……包装体、１ａ……側辺、２……リード、
３，３ａ，３ｂ……パツケージ型電子部品、４…
…プリント基板、５……銅箔パターン、６……孔
部、７……曲折部。
Figure 1a is a perspective view of a package type electronic component applied to the first embodiment of the present invention, Figure 1b is an explanatory diagram of the second embodiment of the present invention, and Figures 2a and b are conventional 3A and 3B are explanatory diagrams of another conventional device. 1...Packaging body, 1a...Side side, 2...Lead,
3, 3a, 3b...Package type electronic component, 4...
...Printed circuit board, 5...Copper foil pattern, 6...Hole, 7...Bending part.
Claims (1)
から複数のリードが突出するパツケージ型電子部
品の該リードがプリント基板の銅箔パターンに半
田付けされるプリント基板の電子部品接続装置に
おいて、 該リードは該包装体の一側辺のみから突出され
、かつ、該リード先端がほぼ垂直に曲折され、該
曲折部が該銅箔パターン上面に半田付けされるこ
とを特徴とするプリント基板の電子部品接続装置
。[Scope of Claim for Utility Model Registration] A printed circuit board in which a plurality of electronic components are housed in a package and a plurality of leads protrude from the package, and the leads are soldered to the copper foil pattern of the printed circuit board. In the electronic component connecting device, the lead protrudes from only one side of the package, the tip of the lead is bent almost vertically, and the bent part is soldered to the upper surface of the copper foil pattern. A featured printed circuit board electronic component connection device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986146170U JPS6351480U (en) | 1986-09-24 | 1986-09-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986146170U JPS6351480U (en) | 1986-09-24 | 1986-09-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6351480U true JPS6351480U (en) | 1988-04-07 |
Family
ID=31058393
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986146170U Pending JPS6351480U (en) | 1986-09-24 | 1986-09-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6351480U (en) |
-
1986
- 1986-09-24 JP JP1986146170U patent/JPS6351480U/ja active Pending
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