JPS6350838A - 剥離液 - Google Patents

剥離液

Info

Publication number
JPS6350838A
JPS6350838A JP61193901A JP19390186A JPS6350838A JP S6350838 A JPS6350838 A JP S6350838A JP 61193901 A JP61193901 A JP 61193901A JP 19390186 A JP19390186 A JP 19390186A JP S6350838 A JPS6350838 A JP S6350838A
Authority
JP
Japan
Prior art keywords
stripping solution
group
carbon atoms
weight
imidazolidinones
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61193901A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0524498B2 (enExample
Inventor
Chozo Okuda
奥田　長蔵
Hitoshi Oka
岡　仁志
Takao Miura
孝夫 三浦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JSR Corp
Original Assignee
Japan Synthetic Rubber Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Synthetic Rubber Co Ltd filed Critical Japan Synthetic Rubber Co Ltd
Priority to JP61193901A priority Critical patent/JPS6350838A/ja
Publication of JPS6350838A publication Critical patent/JPS6350838A/ja
Publication of JPH0524498B2 publication Critical patent/JPH0524498B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • G03F7/425—Stripping or agents therefor using liquids only containing mineral alkaline compounds; containing organic basic compounds, e.g. quaternary ammonium compounds; containing heterocyclic basic compounds containing nitrogen

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP61193901A 1986-08-21 1986-08-21 剥離液 Granted JPS6350838A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61193901A JPS6350838A (ja) 1986-08-21 1986-08-21 剥離液

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61193901A JPS6350838A (ja) 1986-08-21 1986-08-21 剥離液

Publications (2)

Publication Number Publication Date
JPS6350838A true JPS6350838A (ja) 1988-03-03
JPH0524498B2 JPH0524498B2 (enExample) 1993-04-08

Family

ID=16315624

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61193901A Granted JPS6350838A (ja) 1986-08-21 1986-08-21 剥離液

Country Status (1)

Country Link
JP (1) JPS6350838A (enExample)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02131239A (ja) * 1988-11-11 1990-05-21 Nagase Denshi Kagaku Kk 水性剥離剤組成物
US5759973A (en) * 1996-09-06 1998-06-02 Olin Microelectronic Chemicals, Inc. Photoresist stripping and cleaning compositions
US5780406A (en) * 1996-09-06 1998-07-14 Honda; Kenji Non-corrosive cleaning composition for removing plasma etching residues
US5817610A (en) * 1996-09-06 1998-10-06 Olin Microelectronic Chemicals, Inc. Non-corrosive cleaning composition for removing plasma etching residues
US6030932A (en) * 1996-09-06 2000-02-29 Olin Microelectronic Chemicals Cleaning composition and method for removing residues
US6413923B2 (en) 1999-11-15 2002-07-02 Arch Specialty Chemicals, Inc. Non-corrosive cleaning composition for removing plasma etching residues
WO2002055645A1 (fr) * 2001-01-05 2002-07-18 Arakawa Chemical Industries, Ltd. Composition detergente
JP2004155821A (ja) * 2002-11-01 2004-06-03 Tosoh Corp 洗浄剤
WO2005022268A1 (ja) * 2003-08-28 2005-03-10 Sony Corporation 銀及び／又は銀合金を含む基板のフォトレジスト剥離液組成物、それを用いたパターンの製造方法ならびにそれを含む表示装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56115368A (en) * 1980-02-15 1981-09-10 San Ei Chem Ind Ltd Releasing agent of photosensitive polymer
JPS5960438A (ja) * 1982-09-07 1984-04-06 ジエイ　ティー　ベイカー　インコーポレーテッド ストリッピング組成物
JPS6191299A (ja) * 1984-10-12 1986-05-09 川研ファインケミカル株式会社 硬質表面洗浄剤

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56115368A (en) * 1980-02-15 1981-09-10 San Ei Chem Ind Ltd Releasing agent of photosensitive polymer
JPS5960438A (ja) * 1982-09-07 1984-04-06 ジエイ　ティー　ベイカー　インコーポレーテッド ストリッピング組成物
JPS6191299A (ja) * 1984-10-12 1986-05-09 川研ファインケミカル株式会社 硬質表面洗浄剤

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02131239A (ja) * 1988-11-11 1990-05-21 Nagase Denshi Kagaku Kk 水性剥離剤組成物
US6191086B1 (en) 1996-09-06 2001-02-20 Arch Specialty Chemicals, Inc. Cleaning composition and method for removing residues
US5780406A (en) * 1996-09-06 1998-07-14 Honda; Kenji Non-corrosive cleaning composition for removing plasma etching residues
US5817610A (en) * 1996-09-06 1998-10-06 Olin Microelectronic Chemicals, Inc. Non-corrosive cleaning composition for removing plasma etching residues
US6020292A (en) * 1996-09-06 2000-02-01 Olin Microelectronic Chemicals, Inc. Non-corrosive cleaning composition for removing plasma etching residues
US6030932A (en) * 1996-09-06 2000-02-29 Olin Microelectronic Chemicals Cleaning composition and method for removing residues
US5759973A (en) * 1996-09-06 1998-06-02 Olin Microelectronic Chemicals, Inc. Photoresist stripping and cleaning compositions
US6413923B2 (en) 1999-11-15 2002-07-02 Arch Specialty Chemicals, Inc. Non-corrosive cleaning composition for removing plasma etching residues
US7001874B2 (en) 1999-11-15 2006-02-21 Arch Specialty Chemicals, Inc. Non-corrosive cleaning composition for removing plasma etching residues
US7402552B2 (en) 1999-11-15 2008-07-22 Fujifilm Electronic Materials U.S.A., Inc. Non-corrosive cleaning composition for removing plasma etching residues
WO2002055645A1 (fr) * 2001-01-05 2002-07-18 Arakawa Chemical Industries, Ltd. Composition detergente
US7018964B2 (en) 2001-01-05 2006-03-28 Arakawa Chemical Industries, Ltd. Detergent composition
JP2004155821A (ja) * 2002-11-01 2004-06-03 Tosoh Corp 洗浄剤
WO2005022268A1 (ja) * 2003-08-28 2005-03-10 Sony Corporation 銀及び／又は銀合金を含む基板のフォトレジスト剥離液組成物、それを用いたパターンの製造方法ならびにそれを含む表示装置

Also Published As

Publication number Publication date
JPH0524498B2 (enExample) 1993-04-08

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