JPS6348946B2 - - Google Patents

Info

Publication number
JPS6348946B2
JPS6348946B2 JP24419484A JP24419484A JPS6348946B2 JP S6348946 B2 JPS6348946 B2 JP S6348946B2 JP 24419484 A JP24419484 A JP 24419484A JP 24419484 A JP24419484 A JP 24419484A JP S6348946 B2 JPS6348946 B2 JP S6348946B2
Authority
JP
Japan
Prior art keywords
forging
cut
plate material
subjected
longitudinal direction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP24419484A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61124566A (ja
Inventor
Hideaki Yoshida
Tateaki Sahira
Masaki Morikawa
Terushi Mishima
Akira Mori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Metal Corp
Original Assignee
Mitsubishi Metal Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Metal Corp filed Critical Mitsubishi Metal Corp
Priority to JP24419484A priority Critical patent/JPS61124566A/ja
Publication of JPS61124566A publication Critical patent/JPS61124566A/ja
Publication of JPS6348946B2 publication Critical patent/JPS6348946B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Forging (AREA)
  • Physical Vapour Deposition (AREA)
JP24419484A 1984-11-19 1984-11-19 スパツタリング用Ａｌ−Ｓｉ系合金タ−ゲツト板材の製造法 Granted JPS61124566A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24419484A JPS61124566A (ja) 1984-11-19 1984-11-19 スパツタリング用Ａｌ−Ｓｉ系合金タ−ゲツト板材の製造法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24419484A JPS61124566A (ja) 1984-11-19 1984-11-19 スパツタリング用Ａｌ−Ｓｉ系合金タ−ゲツト板材の製造法

Publications (2)

Publication Number Publication Date
JPS61124566A JPS61124566A (ja) 1986-06-12
JPS6348946B2 true JPS6348946B2 (enrdf_load_stackoverflow) 1988-10-03

Family

ID=17115170

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24419484A Granted JPS61124566A (ja) 1984-11-19 1984-11-19 スパツタリング用Ａｌ−Ｓｉ系合金タ−ゲツト板材の製造法

Country Status (1)

Country Link
JP (1) JPS61124566A (enrdf_load_stackoverflow)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2568826B2 (ja) * 1986-06-16 1997-01-08 セイコーエプソン株式会社 スパツタリング用タ−ゲツトの製造方法
JPS6333563A (ja) * 1986-07-25 1988-02-13 Tanaka Kikinzoku Kogyo Kk スパツタリング用Ｐｔ−Ｎｉ合金タ−ゲツトの製造方法
JPS63238268A (ja) * 1987-03-27 1988-10-04 Hitachi Ltd スパツタリング用タ−ゲツトの製造法
FR2664618B1 (fr) * 1990-07-10 1993-10-08 Pechiney Aluminium Procede de fabrication de cathodes pour pulverisation cathodique a base d'aluminium de tres haute purete.
JP3769761B2 (ja) * 1994-04-28 2006-04-26 住友化学株式会社 アルミニウム合金単結晶ターゲットおよびその製造方法
JPH10330927A (ja) * 1997-06-05 1998-12-15 Riyouka Massey Kk アルミニウム合金製スパッタリングターゲット材
JP3973857B2 (ja) 2001-04-16 2007-09-12 日鉱金属株式会社 マンガン合金スパッタリングターゲットの製造方法
JP4685059B2 (ja) * 2001-04-16 2011-05-18 Ｊｘ日鉱日石金属株式会社 マンガン合金スパッタリングターゲット
JP4883546B2 (ja) * 2002-09-20 2012-02-22 Ｊｘ日鉱日石金属株式会社 タンタルスパッタリングターゲットの製造方法
DE10253319B3 (de) * 2002-11-14 2004-05-27 W. C. Heraeus Gmbh & Co. Kg Verfahren zum Herstellen eines Sputtertargets aus einer Si-Basislegierung, sowie die Verwendung des Sputtertargets
PT1444993E (pt) 2003-02-10 2007-01-31 Heraeus Gmbh W C Liga metálica melhorada para dispositivos médicos e implantes
CN104451566A (zh) * 2014-12-17 2015-03-25 重庆大学 一种高纯铝硅靶材的制备方法
CN113897566B (zh) * 2021-09-27 2022-07-29 宁波江丰电子材料股份有限公司 一种高纯铝靶材的制备方法

Also Published As

Publication number Publication date
JPS61124566A (ja) 1986-06-12

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