JPS6347269B2 - - Google Patents
Info
- Publication number
- JPS6347269B2 JPS6347269B2 JP57053092A JP5309282A JPS6347269B2 JP S6347269 B2 JPS6347269 B2 JP S6347269B2 JP 57053092 A JP57053092 A JP 57053092A JP 5309282 A JP5309282 A JP 5309282A JP S6347269 B2 JPS6347269 B2 JP S6347269B2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- base
- cap
- lead frame
- leads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49548—Cross section geometry
- H01L23/49551—Cross section geometry characterised by bent parts
- H01L23/49555—Cross section geometry characterised by bent parts the bent parts being the outer leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
- H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Geometry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5309282A JPS58170045A (ja) | 1982-03-31 | 1982-03-31 | 半導体装置の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5309282A JPS58170045A (ja) | 1982-03-31 | 1982-03-31 | 半導体装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS58170045A JPS58170045A (ja) | 1983-10-06 |
JPS6347269B2 true JPS6347269B2 (enrdf_load_stackoverflow) | 1988-09-21 |
Family
ID=12933133
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5309282A Granted JPS58170045A (ja) | 1982-03-31 | 1982-03-31 | 半導体装置の製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58170045A (enrdf_load_stackoverflow) |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5325360A (en) * | 1976-08-23 | 1978-03-09 | Hitachi Ltd | Production of semiconductor device |
-
1982
- 1982-03-31 JP JP5309282A patent/JPS58170045A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS58170045A (ja) | 1983-10-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4477827A (en) | Lead frame for leaded semiconductor chip carriers | |
US4801997A (en) | High packing density lead frame and integrated circuit | |
US4378902A (en) | Apparatus for preventing wire sag in the wire bonding process for producing semiconductor devices | |
JPS6347269B2 (enrdf_load_stackoverflow) | ||
CA1145860A (en) | Leadframe for leaded semiconductor chip carriers | |
JPH0831556B2 (ja) | 半導体装置用リードフレーム | |
KR970007598B1 (ko) | 와이어 본딩방법 | |
JP2861350B2 (ja) | 半導体装置の製造方法 | |
JPS6342155A (ja) | 半導体装置 | |
JPH0653399A (ja) | 樹脂封止型半導体装置 | |
JP2591328B2 (ja) | Icリード成形方法 | |
JP2723855B2 (ja) | 樹脂封止型半導体装置の製造方法 | |
KR200142844Y1 (ko) | 리드프레임 | |
JPS6218057A (ja) | リ−ドフレ−ム加工方法 | |
JPH02253646A (ja) | リードフレーム | |
JPS613434A (ja) | 半導体装置の製造方法 | |
JPH02280360A (ja) | 半導体パッケージ | |
JPS629641A (ja) | 半導体装置 | |
JPS6230497B2 (enrdf_load_stackoverflow) | ||
JPH08162488A (ja) | 電子部品製造方法 | |
JPH02859B2 (enrdf_load_stackoverflow) | ||
JPS60121754A (ja) | リードの折り曲げ装置 | |
JPH0697357A (ja) | リードフレームとこれを用いた半導体装置の製造方法 | |
JPH0131687B2 (enrdf_load_stackoverflow) | ||
JPH0480948A (ja) | 半導体製造装置 |