JPS58170045A - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法

Info

Publication number
JPS58170045A
JPS58170045A JP5309282A JP5309282A JPS58170045A JP S58170045 A JPS58170045 A JP S58170045A JP 5309282 A JP5309282 A JP 5309282A JP 5309282 A JP5309282 A JP 5309282A JP S58170045 A JPS58170045 A JP S58170045A
Authority
JP
Japan
Prior art keywords
lead
lead frame
semiconductor
cut
cap
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5309282A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6347269B2 (enrdf_load_stackoverflow
Inventor
Marehide Yamauchi
山内　希英
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP5309282A priority Critical patent/JPS58170045A/ja
Publication of JPS58170045A publication Critical patent/JPS58170045A/ja
Publication of JPS6347269B2 publication Critical patent/JPS6347269B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H01L23/49551—Cross section geometry characterised by bent parts
    • H01L23/49555—Cross section geometry characterised by bent parts the bent parts being the outer leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP5309282A 1982-03-31 1982-03-31 半導体装置の製造方法 Granted JPS58170045A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5309282A JPS58170045A (ja) 1982-03-31 1982-03-31 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5309282A JPS58170045A (ja) 1982-03-31 1982-03-31 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS58170045A true JPS58170045A (ja) 1983-10-06
JPS6347269B2 JPS6347269B2 (enrdf_load_stackoverflow) 1988-09-21

Family

ID=12933133

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5309282A Granted JPS58170045A (ja) 1982-03-31 1982-03-31 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS58170045A (enrdf_load_stackoverflow)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5325360A (en) * 1976-08-23 1978-03-09 Hitachi Ltd Production of semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5325360A (en) * 1976-08-23 1978-03-09 Hitachi Ltd Production of semiconductor device

Also Published As

Publication number Publication date
JPS6347269B2 (enrdf_load_stackoverflow) 1988-09-21

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