JPS58155841U - Ｉｃパツケ−ジ - Google Patents

Ｉｃパツケ−ジ

Info

Publication number
JPS58155841U
JPS58155841U JP1982051890U JP5189082U JPS58155841U JP S58155841 U JPS58155841 U JP S58155841U JP 1982051890 U JP1982051890 U JP 1982051890U JP 5189082 U JP5189082 U JP 5189082U JP S58155841 U JPS58155841 U JP S58155841U
Authority
JP
Japan
Prior art keywords
package
solder
align
cap
assembled
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1982051890U
Other languages
English (en)
Inventor
関根　孝二
木村　克久
Original Assignee
株式会社日立製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社日立製作所 filed Critical 株式会社日立製作所
Priority to JP1982051890U priority Critical patent/JPS58155841U/ja
Publication of JPS58155841U publication Critical patent/JPS58155841U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Landscapes

  • Joining Of Glass To Other Materials (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は本考案の一実施例の断面図、第２図は本考案の
他の実施例の断面図である。 ２、　５．　８・・・段差部。

Claims (1)

    【実用新案登録請求の範囲】
  1. ハンダまたは低融点ガラスを封止材として使用する半導
    体集積回路のパッケージングにおいて、ベースおよびキ
    ャップの両者に、組合せた時に整合する段差部を設けた
    ことを特徴とするＩＣパッケージ。
JP1982051890U 1982-04-12 1982-04-12 Ｉｃパツケ−ジ Pending JPS58155841U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982051890U JPS58155841U (ja) 1982-04-12 1982-04-12 Ｉｃパツケ−ジ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982051890U JPS58155841U (ja) 1982-04-12 1982-04-12 Ｉｃパツケ−ジ

Publications (1)

Publication Number Publication Date
JPS58155841U true JPS58155841U (ja) 1983-10-18

Family

ID=30062601

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982051890U Pending JPS58155841U (ja) 1982-04-12 1982-04-12 Ｉｃパツケ−ジ

Country Status (1)

Country Link
JP (1) JPS58155841U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006054304A (ja) * 2004-08-11 2006-02-23 Sanyo Electric Co Ltd セラミックパッケージ、集合基板及びその製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006054304A (ja) * 2004-08-11 2006-02-23 Sanyo Electric Co Ltd セラミックパッケージ、集合基板及びその製造方法
JP4511278B2 (ja) * 2004-08-11 2010-07-28 三洋電機株式会社 セラミックパッケージ

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