KR970007598B1 - 와이어 본딩방법 - Google Patents

와이어 본딩방법 Download PDF

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KR970007598B1
KR970007598B1 KR1019920010573A KR920010573A KR970007598B1 KR 970007598 B1 KR970007598 B1 KR 970007598B1 KR 1019920010573 A KR1019920010573 A KR 1019920010573A KR 920010573 A KR920010573 A KR 920010573A KR 970007598 B1 KR970007598 B1 KR 970007598B1
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bond point
capillary
bond
wire
distance
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KR930001363A (ko
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구니유끼 다까하시
싱이찌 구마사와
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가부시끼가이샤 신가와
아라이 가즈오
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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Abstract

내요없음.

Description

와이어 본딩방법
제1도는 본 발명의 1실시예를 도시한 제2본드점에의 와이어 접속 상태도.
제2도는 와이어 본딩된 시료의 평면도.
제3도는 가장 일반적인 와이어 본딩방법을 도시한 것으로서, (a) 내지 (g)는 공정도.
제4도는 종래예를 도시한 제2본드점에의 와이어 접속상태도.
* 도면의 주요부분에 대한 부호의 설명
1a : 제1본드점 2a : 제2본드점
3 : 와이어 4 : 캐피러리
5 : 캐피러리의 본드면의 중심 6 : 캐피러리의 중심
L : 제1본드점으로부터 제2본드점까지의 거리
L : 캐피러리를 이동시키는 거리
△L : 많이 이동시키는 길이
R : 캐피러리의 하단외주반경치수
r : 캐피러리의 하단구멍반경치수
[산업상의 이용분야]
본 발명은 제1본드점과 제2본드점과의 사이를 와이어로 접속하는 와이어 본딩방법에 관한 것이다.
[종래의 기술]
IC 등의 반도체 조립장치의 제조공정에 와이어 본딩공정이 있다.
이 공정에 의하여 제2도에 도시한 바와 같이, 펠릿(1)의 패드(제1본드점)(1a)와 리드프레임(2)의 리드(제2본드점)(2a)에 와이어(3)가 접속된다.
상기 와이어 본딩공정에 있어서의 와이어 본딩방법에는 여러 가지 방법이 제안되어 있으나, 가장 일반적인 방법을 제3도에 도시하였다.
제3도에 있어서, 먼저 (a)에 도시한 바와 같이, 캐피러리(4)의 하단으로부터 뻗어있는 와이어(3)에 전기토오치(5)에 의한 불꽃방전에 의하여 볼(3a)을 만든다.
그후, 전기토오치(5)는 화살표 방향으로 이동한다.
다음에, (b)에 도시한 바와 같이 캐피러리(4)는 제1본드점(1a)의 윗쪽으로 이동한다. 이어서, (c)에 도시한 바와 같이 캐피러리(4)가 하강하여, 와이어(3)의 선단의 볼(3a)을 제1본드점(1a)에 접속한다. 그후, (d)에 도시한 바와 같이 캐피러리(4)는 상승한다. 이어서, (e)에 도시한 바와 같이 캐피러리(4)는 제2본드점(2a)의 윗쪽으로 이동한다. 다음에, (f)에 도시한 바와 같이 캐피러리(4)가 하강하여 제2본드점(2a)에 와이어(3)를 접속한다.
그후, 캐피러리(4)가 일정한 위치에 상승한 후, 클램퍼(6)가 닫히고, 캐피러리(4)와 클램퍼(6)가 함께 상승하여, (g)도에 도시한 바와 같이 와이어(3)를 절단한다. 이에 의하여 1개의 와이어 접속이 완료된다. 그리고, 이러한 종류의 와이어 본딩방법에 관련된 것으로서, 예컨대 일본국 특개소 57-87143호 공보, 동 특공평 1-26531호 공보 등을 들 수 있다.
[발명이 해결하려고 하는 과제]
상기 종래기술은 캐피러리(4)를 제1본드점(1a)으로부터 제2본드점(2a)으로 이동시키는 거리(L1)(제4도 참조)는 제1본드점(1a)과 제2본드점(2a)을 잇는 거리(L0)와 같다. 그런데, 제1본드점(1a)에의 접속(제3도(c) 참조)은 볼(3a)이 캐피러리(4)의 하단의 전둘레에 의하여 눌려 행하여진다. 그러나, 제2본드점(2a)에의 접속은 제4에 도시한 바와 같이 캐피러리(4)의 제1본드점(1a) 쪽의 하면에 의하여 행하여진다. 이 때문에, 종래기술과 같이 캐피러리(4)를 이동시키는 거리(L1)를 제1본드점(1a)과 제2본드점(2a)의 거리(L0)와 같게하면, 와이어(3)는 제2본드점(2a)으로부터 △L만큼 제1본드점(1a)쪽에 접속되어 본딩정밀도가 나쁘다.
본 발명의 목적은 고정밀도의 본딩이 행하여지는 와이어 본딩방법을 제공하는데 있다.
[과제를 해결하기 위한 수단]
상기 목적을 달성하기 위한 본 발명의 구성은 제1본드점과 제2본드점과의 사이를 와이어로 접속하는 와이어 본딩방법에 있어서, 캐피러리를 제1본드점으로부터 제2본드점으로 이동시키는 거리를 캐피러리의 하단외주반경치수에 캐피러리의 하단구멍반경치수를 더한 길이의 절반의 길이만큼, 제1본드점으로부터 제2본드점까지의 거리보다 많이 이동시켜 제2본드점에 와이어를 접속하는 것을 특징으로 한다.
[작용]
캐피러리를 제1본드점으로부터 제2본드점으로 이동시키는 거리는 캐피러리의 하단외주반경치수에 캐피러리의 하단구멍반경치수를 더한 길이의 절반의 길이만큼, 제1본드점으로부터 제2본드점까지의 거리보다 많이 이동시킨다. 이에 의하여 캐피러리가 제2본드점상으로 이동하면, 캐피러리의 제1본드점쪽의 하면의 본드면의 중심이 제2본드점에 위치한다. 이 때문에 본딩정밀도가 향상된다.
[실시예]
이하, 본 발명의 1실시예를 제1도에 의하여 설명한다.
캐피러리(4)를 제1본드점(1a)으로부터 제2본드점(2a)으로 이동시켜 와이어(3)를 제2본드점(2a)에 접속한다.
이 경우, 캐피러리(4)를 제1본드점(1a)으로부터 제2본드점(2a)으로 이동시키는 거리(L2)는 제1본드점(1a)으로부터 제2본드점(2a)까지의 거리(L0)보다 △L0만큼 길다.
여기서, △L0는 제2본드점(2a)에의 본딩시에 있어서의 캐피러리(4)의 본드면의 대략 중심(5)으로부터 캐피러리(4)의 중심(6)까지의 길이로 하거나, 또는 캐피러리(4)의 하단 외주반경치수(R)로부터 캐피러리(4)의 하단구멍반경치수(r)를 뺀 길이의 절반의 길이에 하단구멍반경치수(r)를 더한 길이로 한다. 이 관계를 수직으로 표시하면 [수1]과 같이 된다. 즉, 캐피러리(4)를 제1본드점(1a)으로부터 제2본드점(2a)으로 이동시키는 거리(L2)는 캐피러리(4)의 하단외주반경치수(R)에 캐피러리(4)의 하단구멍 반경치수를 더한 길이의 절반의 길이 △L0=(R+r)/2 만큼 제1본드점(1a)으로부터 제2본드점(2a)까지의 거리(L0)보다 많이 이동시킨다.
△L0=(R-r)/2+r=(R+r)/2 [수1]
이와 같이, 캐피러리(4)를 L2이동시키면, 캐피러리(4)의 본드면의 중심(5)은 제2본드점(2a)에 일치하므로, 본딩 정밀도가 향상된다.
그리고, 상기 실시예는 캐피러리(4)의 본드면이 평면인 경우에 대하여 설명하였으나, 본드면이 원호로 형성되어 있는 경우에도 적용할 수 있는 것은 물론이다.
[발명의 효과]
본 발명에 의하면, 캐피러리를 제1본드점으로부터 제2본드점으로 이동시키는 거리는 캐피러리의 하단외주반경치수에 캐피러리의 하단구멍반경치수를 더한 길이의 절반의 길이만큼, 제1본드점으로부터 제2본드점까지의 거리보다 많이 이동시키므로, 캐피러리의 제1본드점쪽의 하면의 본드면의 중심이 제2본드점에 위치하여, 본딩 정밀도가 향상된다.

Claims (1)

  1. 제1본드점(1a)과 제2본드점(2a)과의 사이를 와이어(3)로 접속하는 와이어 본딩방법에 있어서, 캐피러리(4)를 제1본드점(1a)으로부터 제2본드점(2a)으로 이동시키는 거리(L2)를 캐피러리(4)의 하단외주반경치수(R)에 캐피러리(4)의 하단구멍반경치수(r)를 더한 길이의 절반의 길이(△L0=(R+r)/2)만큼, 제1본드점(1a)으로부터 제2본드점(2a)까지의 거리보다 많이 이동시켜 제2본드점(2a)에 와이어(3)를 접속하는 것을 특징으로 하는 와이어 본딩 방법.
KR1019920010573A 1991-06-19 1992-06-18 와이어 본딩방법 KR970007598B1 (ko)

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JP91-173398 1991-06-19
JP3173398A JP2789395B2 (ja) 1991-06-19 1991-06-19 ワイヤボンデイング方法

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KR970007598B1 true KR970007598B1 (ko) 1997-05-13

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KR100479919B1 (ko) * 1997-12-29 2005-05-16 삼성테크윈 주식회사 와이어본딩헤드의와이어루프형성방법
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