KR0161548B1 - 와이어 본딩방법 - Google Patents

와이어 본딩방법 Download PDF

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Publication number
KR0161548B1
KR0161548B1 KR1019940017274A KR19940017274A KR0161548B1 KR 0161548 B1 KR0161548 B1 KR 0161548B1 KR 1019940017274 A KR1019940017274 A KR 1019940017274A KR 19940017274 A KR19940017274 A KR 19940017274A KR 0161548 B1 KR0161548 B1 KR 0161548B1
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bonding
wire
capillary
bonding point
point
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KR1019940017274A
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KR950009995A (ko
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요시미츠 데라카도
가즈오 스기우라
도오루 모치다
다츠나리 미이
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아라이 가즈오
가부시키가이샤 신가와
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Abstract

목적 : 루핑 직선성의 향상 및 본딩성의 향상을 도모한다.
구성 : 제 2본딩점(2a)에의 본딩시의 초음파진동인가와 동시에 캐필러리(4)를 루핑방향으로 이동시킨다.

Description

와이어 본딩방법
제1도는 본 발명으로 이루어지는 와이어 본딩방법의 1실시예를 나타내는 와이어 접속 상태도.
제2도는 와이어 본딩된 시료의 평면도.
제3도는 가장 일반적인 와이어 본딩방법을 나타내고, (a) 내지 (g)는 공정도.
* 도면의 주요부분에 대한 부호의 설명
1a : 제 1본딩점 2a : 제 2본딩덤
3 : 와이어 4 : 캐필러리
[산업상의 이용 분야]
본 발명은 제 1본딩점과 제 2본딩점의 사이를 와이어로 접속하는 와이어 본딩방법에 관한 것이다.
[종래의 기술]
IC 등의 반도체 조립장치의 제조공정에는 와이어 본딩공정이 있다. 이 공정에 의해 제2도에 도시하는 바와같이 펠릿(1)의 패드(제 1본딩점;1a)와 리드프레임(2)의 리드(제 2본딩점;2a)에 와이어(3)가 접속된다.
또한, 화살표(A)는 루핑방향을 나타낸다.
상기 와이어 본딩공정에 있어서의 와이어 본딩방법에는 여러종류의 방법이 제안되고 있으나, 가장 일반적인 방법을 제3도에 도시한다. 제3도에 있어서, 우선 (a)에 도시하는 바와같이 캐필러리(4) 하단에서 뻗어있는 와이어(3)에 전기토치(5)에 의한 스파크 방전에 의해 볼(3a)을 만든다. 그후, 전기토치(5)는 화살표방향으로 이동한다. 다음에, (b)에 도시하는 바와같이 캐필러리(4)는 제 1본딩점(1a)의 상방으로 이동한다. 이어서, (c)에 도시하는 바와같이 캐필러리(4)가 하강하여 와이어(3) 선단의 볼(3a)을 제 1본딩점(1a)으로 가압하고, 캐필러리(4)를 유지하는 혼에 의해 그 캐필러리(4)에 초음파진동을 인가하여 볼(3a)을 본딩한다.
그후, (d)에 도시하는 바와같이 캐필러리(4)는 상승한다. 이어서, (e)에 도시하는 바와같이 캐필러리(4)는 루핑방향(A)의 제 2본딩점(2a)상방으로 이동한다. 다음에, (f)에 도시하는 바와같이 캐필러리(4)가 하강하여 제 2본딩점(2a)으로 와이어(3)를 가압하고, 혼에 의해 캐필러리(4)에 초음파 진동을 인가하여 와이어(3)를 본딩한다. 그후, 캐필러리(4)가 일정 위치에 상승한 후, 클램프(6)가 닫히고, 캐필러리(4)와 클램프(6)가 함께 상승하여 (g)에 도시하는 바와같이 와이어(3)를 절단한다. 이에 의해 1개의 와이어 접속이 완료된다. 또한 이 종류의 와이어 본딩방법에 관련하는 것으로서, 가령 일본국 특개소 57-87143호공보, 특공평 1-26531호공보 등을 들 수 있다.
[발명이 해결하고자 하는 과제]
상기 종래기술의 와이어 본딩방법에서는 제 2본딩점(2a)에의 본딩에 있어서의 초음파 진동인가시에 와이어(3)가 제 1본딩점(1a)측으로 압출되고, 와이어 굽힘이 발생하고, 루핑직선성(제 1본딩점에서 제 2본딩점으로 뻗어진 와이어를 평면에서 본 형상)이 나빠진다. 또, 제 2본딩점(2a)측은 일반적으로 리드이고, 리드폭이 가늘고 또 리드표면상태가 나쁜(페이스트 등에 의한 오염산화등을 나타냄) 경우에는 초음파진동인가만으로는 본딩성(接着性)이 나쁘고 안정적인 본딩성능이 얻어지지 않는다.
본 발명의 목적은 루핑직선성 향상 및 본딩성 향상이 도모되는 와이어 본딩방법을 제공함에 있다.
[과제를 해결하기 위한 수단]
상기 목적을 달성하기 위한 본 발명의 구성은 제 1본딩점과 제 2본딩점의 사이를 와이어로 접속하는 와이어 본딩방법에 있어서, 제 2본딩덤에서의 본딩시의 초음파진동인가와 동시에 캐필러리를 제 1본딩점과 반대방향으로 이동시키는 것을 특징으로 한다.
[작용]
제 2본딩점에의 본딩시의 초음파진동인가와 동시에 제 1본딩점과 반대방향으로 캐필러리를 이동시키면 와이어를 제 1본딩점 방향으로 되돌려 가압하는 것이 억제되고, 직선성이 좋은 루핑이 얻어진다. 또 와이어를 가압한 상태로 캐필러리를 이동시키므로 제 2본딩점의 리드와 와이어의 접합강도가 커지고, 리드표면 상태가 나쁜 경우나 가느다란 리드도 안정된 접합강도가 얻어진다.
[실시예]
이하, 본 발명의 1실시예를 제3도를 참조하면서 제1도에 의해 설명한다. 또한 본 발명은 제 2본딩점(2a)에 와이어를 본딩할때에 있어서의 과제를 해결하는 것이므로 제 1본딩점(1a)에서 제 2본딩점(2a)까지 캐필러리(4)를 이동시키는 궤적에 대해서는 그 설명을 생략한다. 즉, 제 1본딩점(1a)에서 제 2본딩점(2a)까지로 캐필러리(4)를 이동시키는 궤적은 어떠한 궤적이라도 좋다.
캐필러리(4)가 하강하여 와이어(3)를 캐필러리(4)로 제 2본딩점(2a)로 가압하고, 이 가압한 상태로 캐필러리(4)에 초음파진동인가와 동시에 제 1본딩점(1a)과 반대방향(A)으로 캐필러리(4)를 약간(△L=2.5~20㎛) 이동시켜서 본딩한다. 제 2본딩점(2a)의 본딩완료후는 종래와 동일하게 캐필러리(4)가 일정 위치에 상승한 후, 클램프(6)가 닫히고, 캐필러리(4)와 클램프(6)가 함께 상승하여 와이어(3)를 절단한다.
이와같이 초음파진동인가와 동시에 제 1본딩점(1a)과 반대방향(A)으로 캐필러리(4)를 △L 만큼 이동시키면 와이어(3)를 제 1본딩점(1a)방향으로 되돌려 가압하는 것이 억제되고, 직선성이 좋은 루핑이 얻어진다.
또, 와이어(3)를 가압한 상태로 캐필러리(4)를 이동시키므로 제 2본딩점(2a)의 리드와 와이어(3)의 접합강도가 커지고, 리드표면 상태가 나쁜 경우나 가느다란 리드로 안정된 접합강도가 얻어진다.
[발명의 효과]
본 발명에 의하면 제 2본딩점에의 본딩시의 초음파진동인가와 동시에 캐필러리를 제 1본딩점과 반대방향으로 동시에 이동시키므로 루핑 직선성의 향상 및 본딩성 향상이 도모된다.

Claims (1)

  1. 제 1본딩점과 제 2본딩점의 사이를 와이어로 접속하는 와이어 본딩방법에 있어서, 제 2본딩점에의 본딩시의 초음파진동인가와 동시에 캐필러리를 제 1본딩점과 반대방향으로 이동시키는 것을 특징으로 하는 와이어 본딩방법.
KR1019940017274A 1993-09-21 1994-07-18 와이어 본딩방법 KR0161548B1 (ko)

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JP05257644A JP3128718B2 (ja) 1993-09-21 1993-09-21 ワイヤボンデイング方法
JP93-257644 1993-09-21

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KR0161548B1 true KR0161548B1 (ko) 1999-02-01

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Publication number Priority date Publication date Assignee Title
US8033838B2 (en) 1996-02-21 2011-10-11 Formfactor, Inc. Microelectronic contact structure
KR100479919B1 (ko) * 1997-12-29 2005-05-16 삼성테크윈 주식회사 와이어본딩헤드의와이어루프형성방법
KR100263253B1 (ko) * 1998-02-23 2001-01-15 송희 폐 유리병을 이용한 아트유리패널 제조방법
JP4176292B2 (ja) * 2000-07-27 2008-11-05 株式会社新川 シングルポイントボンディング装置
KR100403756B1 (ko) * 2001-02-12 2003-10-30 송 희 폐유리를 이용한 장식용 유리판재의 제조방법
JP4467631B1 (ja) 2009-01-07 2010-05-26 株式会社新川 ワイヤボンディング方法
WO2013111452A1 (ja) * 2012-01-26 2013-08-01 株式会社新川 酸化防止ガス吹き出しユニット

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JPS5787143A (en) * 1980-11-19 1982-05-31 Shinkawa Ltd Method for wire bonding
JPH0228587B2 (ja) * 1987-07-22 1990-06-25 Nippon Light Metal Co Shibosankuroraidonoseizohoho
US5111989A (en) * 1991-09-26 1992-05-12 Kulicke And Soffa Investments, Inc. Method of making low profile fine wire interconnections

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