JPS6347265B2 - - Google Patents
Info
- Publication number
- JPS6347265B2 JPS6347265B2 JP57020917A JP2091782A JPS6347265B2 JP S6347265 B2 JPS6347265 B2 JP S6347265B2 JP 57020917 A JP57020917 A JP 57020917A JP 2091782 A JP2091782 A JP 2091782A JP S6347265 B2 JPS6347265 B2 JP S6347265B2
- Authority
- JP
- Japan
- Prior art keywords
- card
- module
- chip
- view
- cards
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000004382 potting Methods 0.000 claims description 12
- 229920000915 polyvinyl chloride Polymers 0.000 claims description 10
- 239000004800 polyvinyl chloride Substances 0.000 claims description 10
- 239000003822 epoxy resin Substances 0.000 claims description 7
- 229920000647 polyepoxide Polymers 0.000 claims description 7
- 238000000465 moulding Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 description 14
- 239000000463 material Substances 0.000 description 13
- 239000000853 adhesive Substances 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 7
- 238000003466 welding Methods 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000015654 memory Effects 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000003522 acrylic cement Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000007645 offset printing Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000009824 pressure lamination Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- -1 salt vinyl acetate Chemical class 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57020917A JPS58138057A (ja) | 1982-02-12 | 1982-02-12 | Ｉｃカ−ド |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57020917A JPS58138057A (ja) | 1982-02-12 | 1982-02-12 | Ｉｃカ−ド |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58138057A JPS58138057A (ja) | 1983-08-16 |
| JPS6347265B2 true JPS6347265B2 (de) | 1988-09-21 |
Family
ID=12040571
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57020917A Granted JPS58138057A (ja) | 1982-02-12 | 1982-02-12 | Ｉｃカ−ド |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58138057A (de) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0380359U (de) * | 1989-12-07 | 1991-08-16 |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5914084A (ja) * | 1982-07-15 | 1984-01-24 | Toppan Printing Co Ltd | Ｉｃ等を内蔵するカ−ドの製造方法 |
| DE3235650A1 (de) * | 1982-09-27 | 1984-03-29 | Philips Patentverwaltung Gmbh, 2000 Hamburg | Informationskarte und verfahren zu ihrer herstellung |
| DE3248385A1 (de) * | 1982-12-28 | 1984-06-28 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | Ausweiskarte mit integriertem schaltkreis |
| JPS60126864U (ja) * | 1984-01-30 | 1985-08-26 | 共同印刷株式会社 | Ｉｃカ−ド |
| JPS60126863U (ja) * | 1984-01-30 | 1985-08-26 | 共同印刷株式会社 | Ｉｃカ−ド |
| JPS6121097U (ja) * | 1984-03-09 | 1986-02-06 | ソニー株式会社 | 回路装置 |
| JPS611850U (ja) * | 1984-06-08 | 1986-01-08 | 松島工業株式会社 | 半導体素子 |
| FR2599893B1 (fr) * | 1986-05-23 | 1996-08-02 | Ricoh Kk | Procede de montage d'un module electronique sur un substrat et carte a circuit integre |
| JPS63132460A (ja) * | 1986-11-21 | 1988-06-04 | Mitsubishi Electric Corp | 薄型半導体モジユ−ル基板 |
| US4943708A (en) * | 1988-02-01 | 1990-07-24 | Motorola, Inc. | Data device module having locking groove |
| JPH03114789A (ja) * | 1989-09-29 | 1991-05-15 | Mitsubishi Electric Corp | 半導体装置カード |
| EP0431493A3 (en) * | 1989-12-04 | 1992-01-08 | Konica Corporation | Method of preparing an ic card, and the apparatus for preparing the same |
| KR950704758A (ko) * | 1993-10-18 | 1995-11-20 | 가나미야지 준 | IC 모듈과 그것을 사용한 데이터 커리어(Ic module using it on data carrier) |
| FR2838850B1 (fr) * | 2002-04-18 | 2005-08-05 | Framatome Connectors Int | Procede de conditionnement de microcircuits electroniques pour carte a puce et microcircuit electronique ainsi obtenu |
-
1982
- 1982-02-12 JP JP57020917A patent/JPS58138057A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0380359U (de) * | 1989-12-07 | 1991-08-16 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58138057A (ja) | 1983-08-16 |
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