JPS6345460B2 - - Google Patents

Info

Publication number
JPS6345460B2
JPS6345460B2 JP21594985A JP21594985A JPS6345460B2 JP S6345460 B2 JPS6345460 B2 JP S6345460B2 JP 21594985 A JP21594985 A JP 21594985A JP 21594985 A JP21594985 A JP 21594985A JP S6345460 B2 JPS6345460 B2 JP S6345460B2
Authority
JP
Japan
Prior art keywords
processing liquid
brush
etching
processing
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP21594985A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6274088A (ja
Inventor
Yoshihiro Hojo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JTEKT Column Systems Corp
Original Assignee
Fuji Kiko Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Kiko Co Ltd filed Critical Fuji Kiko Co Ltd
Priority to JP21594985A priority Critical patent/JPS6274088A/ja
Publication of JPS6274088A publication Critical patent/JPS6274088A/ja
Publication of JPS6345460B2 publication Critical patent/JPS6345460B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/068—Apparatus for etching printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP21594985A 1985-09-27 1985-09-27 超微細パタ−ンの形成処理方法 Granted JPS6274088A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21594985A JPS6274088A (ja) 1985-09-27 1985-09-27 超微細パタ−ンの形成処理方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21594985A JPS6274088A (ja) 1985-09-27 1985-09-27 超微細パタ−ンの形成処理方法

Publications (2)

Publication Number Publication Date
JPS6274088A JPS6274088A (ja) 1987-04-04
JPS6345460B2 true JPS6345460B2 (online.php) 1988-09-09

Family

ID=16680921

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21594985A Granted JPS6274088A (ja) 1985-09-27 1985-09-27 超微細パタ−ンの形成処理方法

Country Status (1)

Country Link
JP (1) JPS6274088A (online.php)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015021182A (ja) * 2013-07-23 2015-02-02 大日本印刷株式会社 金属薄板の液処理装置

Also Published As

Publication number Publication date
JPS6274088A (ja) 1987-04-04

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