JPS6344059B2 - - Google Patents

Info

Publication number
JPS6344059B2
JPS6344059B2 JP2129281A JP2129281A JPS6344059B2 JP S6344059 B2 JPS6344059 B2 JP S6344059B2 JP 2129281 A JP2129281 A JP 2129281A JP 2129281 A JP2129281 A JP 2129281A JP S6344059 B2 JPS6344059 B2 JP S6344059B2
Authority
JP
Japan
Prior art keywords
aluminum plate
heat
acid
aluminum
polyimide resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP2129281A
Other languages
English (en)
Japanese (ja)
Other versions
JPS57135154A (en
Inventor
Kunisuke Sakamoto
Kunihiro Takenaka
Yukio Yanaga
Yoshiji Kikuchi
Yoshuki Shirosaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Chemical Corp
Original Assignee
Mitsubishi Chemical Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Chemical Industries Ltd filed Critical Mitsubishi Chemical Industries Ltd
Priority to JP2129281A priority Critical patent/JPS57135154A/ja
Publication of JPS57135154A publication Critical patent/JPS57135154A/ja
Publication of JPS6344059B2 publication Critical patent/JPS6344059B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Laminated Bodies (AREA)
JP2129281A 1981-02-16 1981-02-16 Heat-resisting laminate Granted JPS57135154A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2129281A JPS57135154A (en) 1981-02-16 1981-02-16 Heat-resisting laminate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2129281A JPS57135154A (en) 1981-02-16 1981-02-16 Heat-resisting laminate

Publications (2)

Publication Number Publication Date
JPS57135154A JPS57135154A (en) 1982-08-20
JPS6344059B2 true JPS6344059B2 (enrdf_load_stackoverflow) 1988-09-02

Family

ID=12051057

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2129281A Granted JPS57135154A (en) 1981-02-16 1981-02-16 Heat-resisting laminate

Country Status (1)

Country Link
JP (1) JPS57135154A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013251515A (ja) * 2012-06-04 2013-12-12 Mitsubishi Alum Co Ltd プリント基板

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59142138A (ja) * 1983-02-01 1984-08-15 イビデン株式会社 絶縁放熱シートの製造方法
AU2011345486A1 (en) * 2010-12-23 2013-06-13 Anomax Sdn Bhd Integrated plated circuit heat sink and method of manufacture
WO2018139146A1 (ja) * 2017-01-27 2018-08-02 積水化学工業株式会社 フレキシブル太陽電池

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013251515A (ja) * 2012-06-04 2013-12-12 Mitsubishi Alum Co Ltd プリント基板

Also Published As

Publication number Publication date
JPS57135154A (en) 1982-08-20

Similar Documents

Publication Publication Date Title
TWI462826B (zh) Flexible copper clad sheet
TWI455671B (zh) 印刷電路板之製造方法
TWI424012B (zh) Method for surface modification of polyimide resin layer and method for manufacturing sheet metal paste
TWI433879B (zh) Method for surface modification of polyimide resin layer and method for manufacturing sheet metal paste
TW201111165A (en) Resin composite electrolyzed copper foil, copper clad laminate and print wiring board
KR20090040253A (ko) 프라이머 수지층을 갖는 동박 및 그것을 사용한 적층판
US6916544B2 (en) Laminate type materials for flexible circuits or similar-type assemblies and methods relating thereto
JP5469578B2 (ja) プライマー層を有する銅張積層板及びそれを用いた配線基板
JP3641952B2 (ja) ポリイミドフィルム及びフレキシブル基板
CN101396895A (zh) 两面挠性覆铜叠层基板及带载体的所述基板的制造方法
WO2006129526A1 (ja) ポリイミドフィルム、ポリイミド金属積層体及びその製造方法
US20080292878A1 (en) Polyimide film with improved adhesion, process for its fabrication and laminated body
JP5042729B2 (ja) ポリイミド樹脂層の表面改質方法及び金属張積層板の製造方法
US3652355A (en) Metallic laminated structure and method
US8518550B2 (en) Polyimide, polyimide film and laminated body
JPS6344059B2 (enrdf_load_stackoverflow)
TW200528265A (en) Flexible metal foil-polyimide laminate and making method
JPS6116618B2 (enrdf_load_stackoverflow)
JP5042728B2 (ja) ポリイミド樹脂層の表面改質方法及び金属張積層板の製造方法
TWI282759B (en) Electro-conductive metal plated polyimide substrate
JP2005135985A (ja) プリント配線板の製造方法
JP2008031448A (ja) ポリイミドフィルムの製造方法及び積層板の製造方法
JP5237578B2 (ja) 芳香族ポリアミド積層フィルム
TW201338970A (zh) 具有底覆層之覆銅積層板及使用該積層板之配線基板
TWI889867B (zh) 多層聚醯亞胺膜