JPS6116618B2 - - Google Patents
Info
- Publication number
- JPS6116618B2 JPS6116618B2 JP10909081A JP10909081A JPS6116618B2 JP S6116618 B2 JPS6116618 B2 JP S6116618B2 JP 10909081 A JP10909081 A JP 10909081A JP 10909081 A JP10909081 A JP 10909081A JP S6116618 B2 JPS6116618 B2 JP S6116618B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- acid
- aluminum
- polyimide resin
- diisocyanate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Laminated Bodies (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10909081A JPS5811137A (ja) | 1981-07-13 | 1981-07-13 | 耐熱性積層体の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10909081A JPS5811137A (ja) | 1981-07-13 | 1981-07-13 | 耐熱性積層体の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5811137A JPS5811137A (ja) | 1983-01-21 |
| JPS6116618B2 true JPS6116618B2 (enrdf_load_stackoverflow) | 1986-05-01 |
Family
ID=14501331
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10909081A Granted JPS5811137A (ja) | 1981-07-13 | 1981-07-13 | 耐熱性積層体の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5811137A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62138362U (enrdf_load_stackoverflow) * | 1986-02-22 | 1987-09-01 |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH082612B2 (ja) * | 1985-05-30 | 1996-01-17 | 三井東圧化学株式会社 | 金属ベースプリント配線基板及びその製造方法 |
| JPH0684060B2 (ja) * | 1986-05-07 | 1994-10-26 | 三菱化成株式会社 | 硬化ポリイミド樹脂被覆物の製造方法 |
| JPH05182991A (ja) * | 1991-11-07 | 1993-07-23 | Mitsubishi Electric Corp | ヘテロ接合ｆｅｔ及びその製造方法 |
-
1981
- 1981-07-13 JP JP10909081A patent/JPS5811137A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62138362U (enrdf_load_stackoverflow) * | 1986-02-22 | 1987-09-01 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5811137A (ja) | 1983-01-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP7469383B2 (ja) | 金属張積層板及び回路基板 | |
| TWI272183B (en) | Polyimide-metal layered products and polyamideimide-metal layered product | |
| CN107207747B (zh) | 利用交联型水溶性热塑性聚酰胺酸的热熔接多层聚酰亚胺膜及其制备方法 | |
| JP7509560B2 (ja) | 樹脂フィルム、金属張積層板及び回路基板 | |
| KR20100016403A (ko) | 수지층을 갖는 동박 | |
| JP2021161387A (ja) | ポリイミド、架橋ポリイミド、接着剤フィルム、積層体、カバーレイフィルム、樹脂付き銅箔、金属張積層板、回路基板及び多層回路基板 | |
| CN110871606A (zh) | 覆金属层叠板、粘接片、粘接性聚酰亚胺树脂组合物及电路基板 | |
| TWI753196B (zh) | 覆金屬層疊板、黏接片、黏接性聚醯亞胺樹脂組合物及電路基板 | |
| JP7713558B2 (ja) | ポリイミドフィルムの製造方法 | |
| JPS6116618B2 (enrdf_load_stackoverflow) | ||
| TW202446841A (zh) | 覆金屬積層板及電路基板 | |
| TW200528265A (en) | Flexible metal foil-polyimide laminate and making method | |
| KR101440276B1 (ko) | 전자기기 부품용 폴리이미드 필름 | |
| EP0308270B1 (en) | Processes for preparation of polyimide-isoindoquinazoline dione and precursor thereof | |
| TW200930563A (en) | Metal laminate | |
| JP2853218B2 (ja) | 積層体 | |
| JPS6344059B2 (enrdf_load_stackoverflow) | ||
| JPS645475B2 (enrdf_load_stackoverflow) | ||
| TWI837183B (zh) | 覆金屬積層板的製造方法及電路基板的製造方法 | |
| KR20120073267A (ko) | 기판의 제조 방법 및 그것에 이용되는 조성물 | |
| JP2022154637A (ja) | ポリイミド、金属張積層板及び回路基板 | |
| JP4435316B2 (ja) | フレキシブルプリント基板 | |
| JP2008279698A (ja) | 積層体及びその製造法 | |
| JPH11158276A (ja) | 接着性の改良されたポリイミドフィルム、その製法およびその積層体 | |
| JP7680242B2 (ja) | フレキシブル金属張積層板及びフレキシブル回路基板 |