JPS6343898B2 - - Google Patents

Info

Publication number
JPS6343898B2
JPS6343898B2 JP57092777A JP9277782A JPS6343898B2 JP S6343898 B2 JPS6343898 B2 JP S6343898B2 JP 57092777 A JP57092777 A JP 57092777A JP 9277782 A JP9277782 A JP 9277782A JP S6343898 B2 JPS6343898 B2 JP S6343898B2
Authority
JP
Japan
Prior art keywords
plating layer
lead frame
gold
silver
gold plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57092777A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5825251A (ja
Inventor
Tomoaki Kojima
Tomoichi Oku
Hitoshi Wada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP57092777A priority Critical patent/JPS5825251A/ja
Publication of JPS5825251A publication Critical patent/JPS5825251A/ja
Publication of JPS6343898B2 publication Critical patent/JPS6343898B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
    • H01L23/49582—Metallic layers on lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP57092777A 1982-05-31 1982-05-31 リ−ドフレ−ム Granted JPS5825251A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57092777A JPS5825251A (ja) 1982-05-31 1982-05-31 リ−ドフレ−ム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57092777A JPS5825251A (ja) 1982-05-31 1982-05-31 リ−ドフレ−ム

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP6578175A Division JPS51140839A (en) 1975-05-30 1975-05-30 Method of forming coatings of different metals

Publications (2)

Publication Number Publication Date
JPS5825251A JPS5825251A (ja) 1983-02-15
JPS6343898B2 true JPS6343898B2 (cg-RX-API-DMAC7.html) 1988-09-01

Family

ID=14063847

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57092777A Granted JPS5825251A (ja) 1982-05-31 1982-05-31 リ−ドフレ−ム

Country Status (1)

Country Link
JP (1) JPS5825251A (cg-RX-API-DMAC7.html)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5317976B2 (cg-RX-API-DMAC7.html) * 1972-05-03 1978-06-12

Also Published As

Publication number Publication date
JPS5825251A (ja) 1983-02-15

Similar Documents

Publication Publication Date Title
US5776801A (en) Leadframe having contact pads defined by a polymer insulating film
JPH0249021B2 (cg-RX-API-DMAC7.html)
DE19801488A1 (de) Halbleiterbaustein und Verfahren zur Herstellung desselben
JP2011108818A (ja) リードフレームの製造方法および半導体装置の製造方法
JPS6343898B2 (cg-RX-API-DMAC7.html)
JPS5827353A (ja) 半導体装置用リ−ドフレ−ム
JPS63204620A (ja) ハイブリッド厚膜回路におけるボンデイングワイヤとコンタクト領域との間の接続形成方法
JP2626033B2 (ja) 半導体装置の製造方法
JPH02102563A (ja) 半導体装置とその製法
JPS62122157A (ja) 光半導体用ヒ−トシンクの電極構造
JPH01244653A (ja) 半導体装置
JP3049478B2 (ja) 半導体装置用リードフレーム及びその製造方法
JPS607139A (ja) ボンデイング方法
JPH06291232A (ja) リードフレーム及びその製造方法
JPS621249A (ja) 半導体装置
JP2654677B2 (ja) 半導体装置の製造方法
JPS6148953A (ja) 樹脂封止形半導体装置の製造方法
JPS6050337B2 (ja) 半導体装置の製造方法
JPS641058B2 (cg-RX-API-DMAC7.html)
JPS61225839A (ja) バンプ電極の形成方法
JPS6225906Y2 (cg-RX-API-DMAC7.html)
JPH03155067A (ja) 半田付け端子
JPS633462B2 (cg-RX-API-DMAC7.html)
JPS6115131A (ja) 液晶表示素子の製造方法
JPH01259289A (ja) プラスチックメッキ時計ケ―スへのプラスチック風防の溶着固定の方法