JPS634345B2 - - Google Patents

Info

Publication number
JPS634345B2
JPS634345B2 JP55096075A JP9607580A JPS634345B2 JP S634345 B2 JPS634345 B2 JP S634345B2 JP 55096075 A JP55096075 A JP 55096075A JP 9607580 A JP9607580 A JP 9607580A JP S634345 B2 JPS634345 B2 JP S634345B2
Authority
JP
Japan
Prior art keywords
layer
compound semiconductor
gaas
ion
gaalas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55096075A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5721824A (en
Inventor
Hidetoshi Nishi
Sukehisa Hyamizu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP9607580A priority Critical patent/JPS5721824A/ja
Publication of JPS5721824A publication Critical patent/JPS5721824A/ja
Publication of JPS634345B2 publication Critical patent/JPS634345B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02107Forming insulating materials on a substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Led Devices (AREA)
  • Formation Of Insulating Films (AREA)
  • Junction Field-Effect Transistors (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
  • Semiconductor Lasers (AREA)
JP9607580A 1980-07-14 1980-07-14 Manufacture of semiconductor device Granted JPS5721824A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9607580A JPS5721824A (en) 1980-07-14 1980-07-14 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9607580A JPS5721824A (en) 1980-07-14 1980-07-14 Manufacture of semiconductor device

Publications (2)

Publication Number Publication Date
JPS5721824A JPS5721824A (en) 1982-02-04
JPS634345B2 true JPS634345B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1988-01-28

Family

ID=14155276

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9607580A Granted JPS5721824A (en) 1980-07-14 1980-07-14 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5721824A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5974901U (ja) * 1982-11-11 1984-05-21 小片 進 連続袋を装着したごみ収納容器
JPS59149023A (ja) * 1983-02-16 1984-08-25 Nec Corp 半導体への不純物の導入方法
JPH0831426B2 (ja) * 1984-05-25 1996-03-27 日本電気株式会社 不純物の導入方法
JP2686764B2 (ja) * 1988-03-11 1997-12-08 国際電信電話株式会社 光半導体素子の製造方法
JP2789262B2 (ja) * 1991-03-01 1998-08-20 日本電信電話株式会社 GaAs基板中にイオン注入能動層を形成する方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3762968A (en) * 1971-04-07 1973-10-02 Rca Corp Method of forming region of a desired conductivity type in the surface of a semiconductor body
JPS5925396B2 (ja) * 1974-01-07 1984-06-16 株式会社日立製作所 半導体装置の製造方法
JPS52131453A (en) * 1976-04-28 1977-11-04 Hitachi Ltd Thermal treating method for chemical compound semiconductor

Also Published As

Publication number Publication date
JPS5721824A (en) 1982-02-04

Similar Documents

Publication Publication Date Title
JPS6393144A (ja) エピタキシャル累層のトランジスタ構造及びその製造方法
JPS62500414A (ja) 3−v及び2−6族化合物半導体の被覆
JPS5999717A (ja) 半導体装置の製造方法
EP0131379B1 (en) Semiconductor device having a heterojunction, and method for producing it
JPS634345B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPH0787187B2 (ja) GaAs化合物半導体基板の製造方法
JPS6362313A (ja) 半導体装置の製造方法
JPH05304202A (ja) 半導体装置の製造方法
JPH0322526A (ja) 炭化珪素半導体装置の製造方法
JP2633009B2 (ja) 化合物半導体電界効果トランジスタとその製造方法
JPS61145823A (ja) 分子線エピタキシ成長法
JPH0533527B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPS63148616A (ja) 半導体装置の製造方法
JPH0434821B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPS604209A (ja) 選択エピタキシヤル結晶成長方法
JPS63278217A (ja) 半導体基板の製造方法
JPS6189667A (ja) 半導体装置の製造方法
JPS6122872B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPS5814739B2 (ja) ハンドウタイソウチノセイゾウホウホウ
JPS61248461A (ja) スタツクドcmos fetの製造方法
JPS61123175A (ja) ヘテロ接合パイポ−ラトランジスタの製造方法
JPS61156820A (ja) 半導体装置の製造方法
JPS59194431A (ja) 半導体基板へのイオン注入方法
JPS6267827A (ja) 半導体装置の製造方法
JPS60257177A (ja) 化合物半導体素子の作製方法