JPS6341036A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS6341036A
JPS6341036A JP61185531A JP18553186A JPS6341036A JP S6341036 A JPS6341036 A JP S6341036A JP 61185531 A JP61185531 A JP 61185531A JP 18553186 A JP18553186 A JP 18553186A JP S6341036 A JPS6341036 A JP S6341036A
Authority
JP
Japan
Prior art keywords
bumps
input
connection bumps
row
output terminals
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61185531A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0533532B2 (enrdf_load_html_response
Inventor
Mutsuo Saito
齋藤　睦男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP61185531A priority Critical patent/JPS6341036A/ja
Publication of JPS6341036A publication Critical patent/JPS6341036A/ja
Publication of JPH0533532B2 publication Critical patent/JPH0533532B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Wire Bonding (AREA)
JP61185531A 1986-08-06 1986-08-06 半導体装置 Granted JPS6341036A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61185531A JPS6341036A (ja) 1986-08-06 1986-08-06 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61185531A JPS6341036A (ja) 1986-08-06 1986-08-06 半導体装置

Publications (2)

Publication Number Publication Date
JPS6341036A true JPS6341036A (ja) 1988-02-22
JPH0533532B2 JPH0533532B2 (enrdf_load_html_response) 1993-05-19

Family

ID=16172430

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61185531A Granted JPS6341036A (ja) 1986-08-06 1986-08-06 半導体装置

Country Status (1)

Country Link
JP (1) JPS6341036A (enrdf_load_html_response)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09172039A (ja) * 1995-12-18 1997-06-30 Nec Corp 半導体装置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0943304A (ja) * 1995-07-26 1997-02-14 Nec Corp 半導体試験装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53123074A (en) * 1977-04-01 1978-10-27 Nec Corp Semiconductor device
JPS5512791A (en) * 1978-07-14 1980-01-29 Nec Corp Semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53123074A (en) * 1977-04-01 1978-10-27 Nec Corp Semiconductor device
JPS5512791A (en) * 1978-07-14 1980-01-29 Nec Corp Semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09172039A (ja) * 1995-12-18 1997-06-30 Nec Corp 半導体装置

Also Published As

Publication number Publication date
JPH0533532B2 (enrdf_load_html_response) 1993-05-19

Similar Documents

Publication Publication Date Title
KR100209250B1 (ko) 반도체 장치 및 그 제조방법
EP0073149B1 (en) Semiconductor chip mounting module
US5177439A (en) Probe card for testing unencapsulated semiconductor devices
KR900007231B1 (ko) 반도체집적회로장치
JPS5880857A (ja) 電子回路パツケ−ジング部材
JP2568748B2 (ja) 半導体装置
US20090091019A1 (en) Memory Packages Having Stair Step Interconnection Layers
JP3927783B2 (ja) 半導体部品
US6121690A (en) Semiconductor device having two pluralities of electrode pads, pads of different pluralities having different widths and respective pads of different pluralities having an aligned transverse edge
US5399904A (en) Array type semiconductor device having insulating circuit board
JP2987088B2 (ja) Ｍｏｓ技術電力デバイスチィップ及びパッケージ組立体
JPH057868B2 (enrdf_load_html_response)
JPH1065044A (ja) スタガ配列されたボンド・パッドを有する半導体ダイ
US20080083984A1 (en) Wiring board
JPS6341036A (ja) 半導体装置
JPS62188333A (ja) 集積回路装置
JPH04196253A (ja) 半導体装置用パッケージ
JP2935356B2 (ja) 半導体装置および基板ならびに半導体装置の実装構造
JPS63137439A (ja) 集積回路チツプ
JP2002270723A (ja) 半導体装置、半導体チップおよび実装基板
JPS5980957A (ja) 半導体装置
JPS6387749A (ja) 半導体装置
JPS6393134A (ja) 集積回路装置
JPS5944798B2 (ja) 電子部品の配線装置
JPH03185730A (ja) 半導体装置