JPS6336448B2 - - Google Patents
Info
- Publication number
- JPS6336448B2 JPS6336448B2 JP5849682A JP5849682A JPS6336448B2 JP S6336448 B2 JPS6336448 B2 JP S6336448B2 JP 5849682 A JP5849682 A JP 5849682A JP 5849682 A JP5849682 A JP 5849682A JP S6336448 B2 JPS6336448 B2 JP S6336448B2
- Authority
- JP
- Japan
- Prior art keywords
- lead wire
- copper tube
- capillary
- capillary copper
- sensor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 50
- 229910052802 copper Inorganic materials 0.000 claims description 50
- 239000010949 copper Substances 0.000 claims description 50
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 49
- 238000007789 sealing Methods 0.000 claims description 30
- 229910000679 solder Inorganic materials 0.000 claims description 13
- 238000005476 soldering Methods 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 6
- 238000003825 pressing Methods 0.000 claims description 5
- 239000011261 inert gas Substances 0.000 claims description 4
- 239000007788 liquid Substances 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 238000000605 extraction Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000008595 infiltration Effects 0.000 description 2
- 238000001764 infiltration Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/08—Protective devices, e.g. casings
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5849682A JPS58174822A (ja) | 1982-04-08 | 1982-04-08 | センサーの製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5849682A JPS58174822A (ja) | 1982-04-08 | 1982-04-08 | センサーの製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58174822A JPS58174822A (ja) | 1983-10-13 |
| JPS6336448B2 true JPS6336448B2 (US08197722-20120612-C00042.png) | 1988-07-20 |
Family
ID=13086025
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5849682A Granted JPS58174822A (ja) | 1982-04-08 | 1982-04-08 | センサーの製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58174822A (US08197722-20120612-C00042.png) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0754271B2 (ja) * | 1988-10-04 | 1995-06-07 | アメリカン スダンダード インコーポレーテッド | 液浸電子温度計 |
| JP2002174553A (ja) * | 2000-12-08 | 2002-06-21 | Oki Electric Ind Co Ltd | 検知部の保護方法 |
| JP4732160B2 (ja) * | 2005-12-15 | 2011-07-27 | 株式会社テイエルブイ | 温度表示器 |
| WO2021010107A1 (ja) * | 2019-07-18 | 2021-01-21 | Ｐｈｃホールディングス株式会社 | 冷凍装置、温度センサ取付管及び温度センサ取付構造 |
-
1982
- 1982-04-08 JP JP5849682A patent/JPS58174822A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58174822A (ja) | 1983-10-13 |
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