JPS63257236A - ワイヤボンデイング方法 - Google Patents

ワイヤボンデイング方法

Info

Publication number
JPS63257236A
JPS63257236A JP62092716A JP9271687A JPS63257236A JP S63257236 A JPS63257236 A JP S63257236A JP 62092716 A JP62092716 A JP 62092716A JP 9271687 A JP9271687 A JP 9271687A JP S63257236 A JPS63257236 A JP S63257236A
Authority
JP
Japan
Prior art keywords
capillary
wire
bonding
point
bonding point
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62092716A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0523498B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
Masamitsu Okamura
将光 岡村
Toyomi Oshige
大重　豊実
Hideo Ichimura
英男 市村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP62092716A priority Critical patent/JPS63257236A/ja
Publication of JPS63257236A publication Critical patent/JPS63257236A/ja
Publication of JPH0523498B2 publication Critical patent/JPH0523498B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8512—Aligning
    • H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
    • H01L2224/85169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
    • H01L2224/8518—Translational movements
    • H01L2224/85181—Translational movements connecting first on the semiconductor or solid-state body, i.e. on-chip, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP62092716A 1987-04-14 1987-04-14 ワイヤボンデイング方法 Granted JPS63257236A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62092716A JPS63257236A (ja) 1987-04-14 1987-04-14 ワイヤボンデイング方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62092716A JPS63257236A (ja) 1987-04-14 1987-04-14 ワイヤボンデイング方法

Publications (2)

Publication Number Publication Date
JPS63257236A true JPS63257236A (ja) 1988-10-25
JPH0523498B2 JPH0523498B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1993-04-02

Family

ID=14062179

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62092716A Granted JPS63257236A (ja) 1987-04-14 1987-04-14 ワイヤボンデイング方法

Country Status (1)

Country Link
JP (1) JPS63257236A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02310937A (ja) * 1989-05-26 1990-12-26 Marine Instr Co Ltd ワイヤボンディング方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5212571A (en) * 1975-07-21 1977-01-31 Hitachi Ltd Wire bonding device
JPS5326668A (en) * 1976-08-25 1978-03-11 Nec Corp Connection for electronic parts
JPS55166934A (en) * 1979-06-15 1980-12-26 Hitachi Ltd Automatic wire bonding method
JPS5787143A (en) * 1980-11-19 1982-05-31 Shinkawa Ltd Method for wire bonding
JPS58220436A (ja) * 1982-06-17 1983-12-22 Shinkawa Ltd ワイヤボンデイング方法
JPS6098634A (ja) * 1983-11-04 1985-06-01 Toshiba Corp ワイヤボンデイング方法
JPS61290731A (ja) * 1985-06-19 1986-12-20 Hitachi Ltd ワイヤボンデイング装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5212571A (en) * 1975-07-21 1977-01-31 Hitachi Ltd Wire bonding device
JPS5326668A (en) * 1976-08-25 1978-03-11 Nec Corp Connection for electronic parts
JPS55166934A (en) * 1979-06-15 1980-12-26 Hitachi Ltd Automatic wire bonding method
JPS5787143A (en) * 1980-11-19 1982-05-31 Shinkawa Ltd Method for wire bonding
JPS58220436A (ja) * 1982-06-17 1983-12-22 Shinkawa Ltd ワイヤボンデイング方法
JPS6098634A (ja) * 1983-11-04 1985-06-01 Toshiba Corp ワイヤボンデイング方法
JPS61290731A (ja) * 1985-06-19 1986-12-20 Hitachi Ltd ワイヤボンデイング装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02310937A (ja) * 1989-05-26 1990-12-26 Marine Instr Co Ltd ワイヤボンディング方法

Also Published As

Publication number Publication date
JPH0523498B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1993-04-02

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