JPS6325608B2 - - Google Patents

Info

Publication number
JPS6325608B2
JPS6325608B2 JP60060949A JP6094985A JPS6325608B2 JP S6325608 B2 JPS6325608 B2 JP S6325608B2 JP 60060949 A JP60060949 A JP 60060949A JP 6094985 A JP6094985 A JP 6094985A JP S6325608 B2 JPS6325608 B2 JP S6325608B2
Authority
JP
Japan
Prior art keywords
parts
weight
epoxy
resin
epoxy resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP60060949A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61221223A (ja
Inventor
Shinetsu Fujeda
Hisashi Hirai
Akira Yoshizumi
Micha Azuma
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP6094985A priority Critical patent/JPS61221223A/ja
Publication of JPS61221223A publication Critical patent/JPS61221223A/ja
Publication of JPS6325608B2 publication Critical patent/JPS6325608B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
JP6094985A 1985-03-27 1985-03-27 半導体封止用エポキシ樹脂組成物 Granted JPS61221223A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6094985A JPS61221223A (ja) 1985-03-27 1985-03-27 半導体封止用エポキシ樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6094985A JPS61221223A (ja) 1985-03-27 1985-03-27 半導体封止用エポキシ樹脂組成物

Publications (2)

Publication Number Publication Date
JPS61221223A JPS61221223A (ja) 1986-10-01
JPS6325608B2 true JPS6325608B2 (enExample) 1988-05-26

Family

ID=13157151

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6094985A Granted JPS61221223A (ja) 1985-03-27 1985-03-27 半導体封止用エポキシ樹脂組成物

Country Status (1)

Country Link
JP (1) JPS61221223A (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63245947A (ja) * 1987-03-31 1988-10-13 Nitto Electric Ind Co Ltd 半導体装置
JP2558293B2 (ja) * 1987-09-14 1996-11-27 日東電工株式会社 半導体装置
JP2755383B2 (ja) * 1987-09-16 1998-05-20 日東電工株式会社 半導体装置
JP2568581B2 (ja) * 1987-09-16 1997-01-08 日東電工株式会社 半導体装置
JP2568584B2 (ja) * 1987-10-15 1997-01-08 日東電工株式会社 半導体装置
JP4548901B2 (ja) * 2000-06-14 2010-09-22 株式会社Adeka 難燃性エポキシ樹脂組成物

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5933125B2 (ja) * 1980-03-17 1984-08-14 信越化学工業株式会社 半導体装置封止用エポキシ樹脂組成物
JPS5710255A (en) * 1980-06-20 1982-01-19 Toshiba Corp Epoxy resin composition and resin sealed type semiconductor device
JPS572329A (en) * 1980-06-05 1982-01-07 Toshiba Corp Epoxy resin type composition and semiconductor device of resin sealing type
JPS58108220A (ja) * 1981-12-21 1983-06-28 Mitsubishi Gas Chem Co Inc 半導体封止用エポキシ樹脂組成物
JPS58121653A (ja) * 1982-01-12 1983-07-20 Hitachi Ltd 半導体装置封止用エポキシ樹脂組成物とその製法
JPS5975922A (ja) * 1982-10-23 1984-04-28 Denki Kagaku Kogyo Kk エポキシ樹脂系成形材料

Also Published As

Publication number Publication date
JPS61221223A (ja) 1986-10-01

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term