JPS61221223A - 半導体封止用エポキシ樹脂組成物 - Google Patents

半導体封止用エポキシ樹脂組成物

Info

Publication number
JPS61221223A
JPS61221223A JP6094985A JP6094985A JPS61221223A JP S61221223 A JPS61221223 A JP S61221223A JP 6094985 A JP6094985 A JP 6094985A JP 6094985 A JP6094985 A JP 6094985A JP S61221223 A JPS61221223 A JP S61221223A
Authority
JP
Japan
Prior art keywords
epoxy resin
parts
resin
weight
epoxy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6094985A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6325608B2 (enExample
Inventor
Shinetsu Fujieda
新悦 藤枝
Hisashi Hirai
久之 平井
Akira Yoshizumi
善積　章
Michiya Azuma
東　道也
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP6094985A priority Critical patent/JPS61221223A/ja
Publication of JPS61221223A publication Critical patent/JPS61221223A/ja
Publication of JPS6325608B2 publication Critical patent/JPS6325608B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
JP6094985A 1985-03-27 1985-03-27 半導体封止用エポキシ樹脂組成物 Granted JPS61221223A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6094985A JPS61221223A (ja) 1985-03-27 1985-03-27 半導体封止用エポキシ樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6094985A JPS61221223A (ja) 1985-03-27 1985-03-27 半導体封止用エポキシ樹脂組成物

Publications (2)

Publication Number Publication Date
JPS61221223A true JPS61221223A (ja) 1986-10-01
JPS6325608B2 JPS6325608B2 (enExample) 1988-05-26

Family

ID=13157151

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6094985A Granted JPS61221223A (ja) 1985-03-27 1985-03-27 半導体封止用エポキシ樹脂組成物

Country Status (1)

Country Link
JP (1) JPS61221223A (enExample)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63245947A (ja) * 1987-03-31 1988-10-13 Nitto Electric Ind Co Ltd 半導体装置
JPS6473652A (en) * 1987-09-14 1989-03-17 Nitto Denko Corp Semiconductor device
JPS6473749A (en) * 1987-09-16 1989-03-20 Nitto Denko Corp Semiconductor device
JPS6473748A (en) * 1987-09-16 1989-03-20 Nitto Denko Corp Semiconductor device
JPH01101658A (ja) * 1987-10-15 1989-04-19 Nitto Denko Corp 半導体装置
JP2001354836A (ja) * 2000-06-14 2001-12-25 Asahi Denka Kogyo Kk 難燃性エポキシ樹脂組成物

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56130953A (en) * 1980-03-17 1981-10-14 Shin Etsu Chem Co Ltd Epoxy resin composition for sealing semiconductor device
JPS572329A (en) * 1980-06-05 1982-01-07 Toshiba Corp Epoxy resin type composition and semiconductor device of resin sealing type
JPS5710255A (en) * 1980-06-20 1982-01-19 Toshiba Corp Epoxy resin composition and resin sealed type semiconductor device
JPS58108220A (ja) * 1981-12-21 1983-06-28 Mitsubishi Gas Chem Co Inc 半導体封止用エポキシ樹脂組成物
JPS58121653A (ja) * 1982-01-12 1983-07-20 Hitachi Ltd 半導体装置封止用エポキシ樹脂組成物とその製法
JPS5975922A (ja) * 1982-10-23 1984-04-28 Denki Kagaku Kogyo Kk エポキシ樹脂系成形材料

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56130953A (en) * 1980-03-17 1981-10-14 Shin Etsu Chem Co Ltd Epoxy resin composition for sealing semiconductor device
JPS572329A (en) * 1980-06-05 1982-01-07 Toshiba Corp Epoxy resin type composition and semiconductor device of resin sealing type
JPS5710255A (en) * 1980-06-20 1982-01-19 Toshiba Corp Epoxy resin composition and resin sealed type semiconductor device
JPS58108220A (ja) * 1981-12-21 1983-06-28 Mitsubishi Gas Chem Co Inc 半導体封止用エポキシ樹脂組成物
JPS58121653A (ja) * 1982-01-12 1983-07-20 Hitachi Ltd 半導体装置封止用エポキシ樹脂組成物とその製法
JPS5975922A (ja) * 1982-10-23 1984-04-28 Denki Kagaku Kogyo Kk エポキシ樹脂系成形材料

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63245947A (ja) * 1987-03-31 1988-10-13 Nitto Electric Ind Co Ltd 半導体装置
JPS6473652A (en) * 1987-09-14 1989-03-17 Nitto Denko Corp Semiconductor device
JPS6473749A (en) * 1987-09-16 1989-03-20 Nitto Denko Corp Semiconductor device
JPS6473748A (en) * 1987-09-16 1989-03-20 Nitto Denko Corp Semiconductor device
JPH01101658A (ja) * 1987-10-15 1989-04-19 Nitto Denko Corp 半導体装置
JP2001354836A (ja) * 2000-06-14 2001-12-25 Asahi Denka Kogyo Kk 難燃性エポキシ樹脂組成物

Also Published As

Publication number Publication date
JPS6325608B2 (enExample) 1988-05-26

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Legal Events

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EXPY Cancellation because of completion of term