JPS6324262U - - Google Patents
Info
- Publication number
- JPS6324262U JPS6324262U JP11643886U JP11643886U JPS6324262U JP S6324262 U JPS6324262 U JP S6324262U JP 11643886 U JP11643886 U JP 11643886U JP 11643886 U JP11643886 U JP 11643886U JP S6324262 U JPS6324262 U JP S6324262U
- Authority
- JP
- Japan
- Prior art keywords
- liquid
- etching
- manipulator
- liquid supply
- pump
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000007788 liquid Substances 0.000 claims description 18
- 238000005530 etching Methods 0.000 claims description 12
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000008367 deionised water Substances 0.000 claims description 3
- 229910021641 deionized water Inorganic materials 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- ing And Chemical Polishing (AREA)
Description
第１図はこの考案の一実施例によるエツチング
装置を示す図、第２図は実施例で示すＩＣの周辺
を拡大した断面図、第３図は従来のエツチング装
置を示す図、第４図はＩＣが処理液と反応してい
る様子を示す図である。
図において１は容器、２はヒータ、３はエツチ
ング液、４は集積回路、５は半導体素子、６は基
板、７は反応により発生したガス、８は給液マニ
ピユレータ、９は排液マニピユレータ、１０は給
液ポンプ、１１は排液ポンプ、１２はＯリング、
１３は切り換えバルブ、１４は脱イオン水である
。なお、各図中同一符号は同一または相当部分を
示す。
FIG. 1 is a diagram showing an etching apparatus according to an embodiment of this invention, FIG. 2 is an enlarged sectional view of the periphery of an IC shown in the embodiment, FIG. 3 is a diagram showing a conventional etching apparatus, and FIG. FIG. 3 is a diagram showing how an IC reacts with a processing liquid. In the figure, 1 is a container, 2 is a heater, 3 is an etching liquid, 4 is an integrated circuit, 5 is a semiconductor element, 6 is a substrate, 7 is a gas generated by the reaction, 8 is a liquid supply manipulator, 9 is a drain manipulator, 10 is a liquid supply pump, 11 is a drain pump, 12 is an O-ring,
13 is a switching valve, and 14 is deionized water. Note that the same reference numerals in each figure indicate the same or corresponding parts.
Claims (1)
る装置において、半導体素子の取り付け面にあつ
て半導体素子を囲み、エツチング液を溜めるため
のＯリングと、このＯリングの内側にエツチング
液を注入する給液マニピユレータと、この給液マ
ニピユレータに接続されエツチング液を供給する
給液ポンプと、Ｏリング内のエツチング液を吸引
する排液マニピユレータと、この排液マニピユレ
ータに接続されエツチング液を排除する排液ポン
プと、この排液ポンプに接続され排液を受ける容
器と、エツチング液の入つた容器と、この容器を
加熱するヒータと、脱イオン水の入つた容器と、
これらの容器と給液ポンプとの間にあつて、これ
ら容器を接続しさらに給液ポンプに接続され、給
液ポンプへの供給をエツチング液か脱イオン水の
いずれか一方に選択する切り換えバルブとを備え
たエツチング装置。 In an apparatus for etching the surface of a semiconductor element in an integrated circuit, an O-ring is provided on the mounting surface of the semiconductor element, surrounds the semiconductor element, and is used to store an etching solution, and a liquid supply for injecting the etching solution into the inside of the O-ring. A manipulator, a liquid supply pump connected to the liquid supply manipulator to supply etching liquid, a liquid drain manipulator that sucks the etching liquid inside the O-ring, and a liquid drain pump connected to the liquid drain manipulator to remove the etching liquid. , a container connected to the drainage pump to receive the drainage liquid, a container containing the etching solution, a heater for heating the container, and a container containing deionized water.
A switching valve is provided between these containers and the liquid supply pump, which connects these vessels and is further connected to the liquid supply pump, and selects either the etching liquid or deionized water to be supplied to the liquid supply pump. Etching equipment equipped with
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11643886U JPS6324262U (en) | 1986-07-29 | 1986-07-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11643886U JPS6324262U (en) | 1986-07-29 | 1986-07-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6324262U true JPS6324262U (en) | 1988-02-17 |
Family
ID=31001026
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11643886U Pending JPS6324262U (en) | 1986-07-29 | 1986-07-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6324262U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9074626B2 (en) | 2011-10-19 | 2015-07-07 | Mitsubishi Electric Corporation | AC generator for vehicle |
-
1986
- 1986-07-29 JP JP11643886U patent/JPS6324262U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9074626B2 (en) | 2011-10-19 | 2015-07-07 | Mitsubishi Electric Corporation | AC generator for vehicle |
| US9243666B2 (en) | 2011-10-19 | 2016-01-26 | Mitsubishi Electric Corporation | AC generator for vehicle |
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