JPH02137031U - - Google Patents
Info
- Publication number
- JPH02137031U JPH02137031U JP4312589U JP4312589U JPH02137031U JP H02137031 U JPH02137031 U JP H02137031U JP 4312589 U JP4312589 U JP 4312589U JP 4312589 U JP4312589 U JP 4312589U JP H02137031 U JPH02137031 U JP H02137031U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor manufacturing
- chemical liquid
- liquid bottle
- piping
- nozzle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011248 coating agent Substances 0.000 claims description 7
- 238000000576 coating method Methods 0.000 claims description 7
- 239000004065 semiconductor Substances 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 239000000126 substance Substances 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 239000007788 liquid Substances 0.000 claims 3
- 238000010586 diagram Methods 0.000 description 2
- 238000005057 refrigeration Methods 0.000 description 1
Landscapes
- Coating Apparatus (AREA)
Description
第１図は本考案の半導体製造用塗布装置の一実
施例の概略図、第２図は従来の塗布装置の概略図
、を示す。
２：薬液瓶、３：ノズル、４：配管、５：ポン
プ、６：レジスト溶液、７：基板、８：冷蔵部、
９：加温部、１０：半導体製造用塗布装置、１０
Ａ：半導体製造用塗布装置の筐体。
FIG. 1 is a schematic diagram of an embodiment of a coating apparatus for semiconductor manufacturing according to the present invention, and FIG. 2 is a schematic diagram of a conventional coating apparatus. 2: Chemical solution bottle, 3: Nozzle, 4: Piping, 5: Pump, 6: Resist solution, 7: Substrate, 8: Refrigeration section,
9: Heating section, 10: Coating device for semiconductor manufacturing, 10
A: Housing of coating equipment for semiconductor manufacturing.
Claims (1)
を載置する基板を半導体製造用塗布装置の筐体内
に収納し、前記薬液瓶、ポンプ、およびノズル間
を配管で連結してなる半導体製造用塗布装置にお
いて、冷蔵部を設けて前記薬液瓶を収納し、前記
配管の一部に加熱部を配設したことを特徴とする
半導体製造用塗布装置。 A coating device for semiconductor manufacturing, in which a chemical liquid bottle, a pump, a nozzle, and a substrate on which a semiconductor to be processed is placed are housed in a housing of the semiconductor manufacturing coating device, and the chemical liquid bottle, pump, and nozzle are connected by piping. A coating apparatus for semiconductor manufacturing, characterized in that a refrigerating section is provided to house the chemical liquid bottle, and a heating section is disposed in a part of the piping.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4312589U JPH02137031U (en) | 1989-04-13 | 1989-04-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4312589U JPH02137031U (en) | 1989-04-13 | 1989-04-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02137031U true JPH02137031U (en) | 1990-11-15 |
Family
ID=31555275
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4312589U Pending JPH02137031U (en) | 1989-04-13 | 1989-04-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02137031U (en) |
-
1989
- 1989-04-13 JP JP4312589U patent/JPH02137031U/ja active Pending
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