JPS6357734U - - Google Patents

Info

Publication number
JPS6357734U
JPS6357734U JP1986151468U JP15146886U JPS6357734U JP S6357734 U JPS6357734 U JP S6357734U JP 1986151468 U JP1986151468 U JP 1986151468U JP 15146886 U JP15146886 U JP 15146886U JP S6357734 U JPS6357734 U JP S6357734U
Authority
JP
Japan
Prior art keywords
semiconductor manufacturing
wafer transfer
operation unit
transfer area
area side
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986151468U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986151468U priority Critical patent/JPS6357734U/ja
Publication of JPS6357734U publication Critical patent/JPS6357734U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例である半導体製造装
置を示す平面図、第2図は第1図の制御部の接続
構成を示す構成ブロツク図である。 1……ウエハ搬送用エリア、2……メンテナン
スエリア、3……間仕切り、4……主操作部、6
……装置本体、7……副操作部、8……接続用コ
ネクタ。
FIG. 1 is a plan view showing a semiconductor manufacturing apparatus which is an embodiment of the present invention, and FIG. 2 is a block diagram showing the connection structure of the control section shown in FIG. 1... Wafer transfer area, 2... Maintenance area, 3... Partition, 4... Main operation section, 6
... Device main body, 7 ... Sub-operation section, 8 ... Connection connector.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] クリーンルーム内にウエハ搬送用エリアとメン
テナンスエリアとに間仕切りして設置される半導
体製造装置において、前記ウエハ搬送用エリア側
に設けられた操作部とは別に、前記メンテナンス
エリア側に副操作部を着脱可能に設けたことを特
徴とする半導体製造装置。
In semiconductor manufacturing equipment that is installed in a clean room partitioned into a wafer transfer area and a maintenance area, a sub-operation unit can be attached and detached to the maintenance area side in addition to the operation unit provided on the wafer transfer area side. 1. A semiconductor manufacturing device characterized by being provided with.
JP1986151468U 1986-10-03 1986-10-03 Pending JPS6357734U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986151468U JPS6357734U (en) 1986-10-03 1986-10-03

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986151468U JPS6357734U (en) 1986-10-03 1986-10-03

Publications (1)

Publication Number Publication Date
JPS6357734U true JPS6357734U (en) 1988-04-18

Family

ID=31068564

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986151468U Pending JPS6357734U (en) 1986-10-03 1986-10-03

Country Status (1)

Country Link
JP (1) JPS6357734U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02239611A (en) * 1989-03-14 1990-09-21 Fujitsu Ltd Semiconductor manufacturing equipment
JP2012231150A (en) * 2012-06-13 2012-11-22 Hitachi Ltd Vacuum processing apparatus and vacuum processing method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02239611A (en) * 1989-03-14 1990-09-21 Fujitsu Ltd Semiconductor manufacturing equipment
JP2012231150A (en) * 2012-06-13 2012-11-22 Hitachi Ltd Vacuum processing apparatus and vacuum processing method

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