JPS62126843U - - Google Patents
Info
- Publication number
- JPS62126843U JPS62126843U JP1986013243U JP1324386U JPS62126843U JP S62126843 U JPS62126843 U JP S62126843U JP 1986013243 U JP1986013243 U JP 1986013243U JP 1324386 U JP1324386 U JP 1324386U JP S62126843 U JPS62126843 U JP S62126843U
- Authority
- JP
- Japan
- Prior art keywords
- liquid
- container
- boiling cooling
- immersion boiling
- cooling container
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 6
- 238000009835 boiling Methods 0.000 claims description 4
- 238000007654 immersion Methods 0.000 claims description 4
- 238000005192 partition Methods 0.000 claims description 2
- 239000003507 refrigerant Substances 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
Description
第１図は本考案の第１の実施例を示す図、第２
図は本考案の第２の実施例を示す図、第３図は本
考案の第３の実施例を示す図、第４図は従来の浸
漬沸騰冷却用容器を示す図、第５図は従来の浸漬
沸騰冷却の不具合を示す図である。
第１図、第２図、第３図において、１０は半導
体素子、１１は素子実装基板、１２は気化液体凝
縮用冷却パイプ、１３は密閉用カバー、１４は冷
媒用液体、１５は網状の仕切り部材、１６は外部
接続用Ｉ／Ｏ端子、１７は針状突起、１８は気体
移動用パイプ、１９は液体移動用のパイプである
。
FIG. 1 is a diagram showing the first embodiment of the present invention, and FIG.
The figure shows a second embodiment of the present invention, Fig. 3 shows a third embodiment of the present invention, Fig. 4 shows a conventional immersion boiling cooling container, and Fig. 5 shows a conventional one. It is a figure showing the malfunction of immersion boiling cooling of. 1, 2, and 3, 10 is a semiconductor element, 11 is an element mounting board, 12 is a cooling pipe for condensing vaporized liquid, 13 is a sealing cover, 14 is a refrigerant liquid, and 15 is a net-like partition. The members 16 are I/O terminals for external connection, 17 are needle-shaped projections, 18 are gas transfer pipes, and 19 are liquid transfer pipes.
Claims (1)
上に、気化液体の凝縮用冷却パイプ１２を有する
密閉用カバー１３を設けた浸漬沸騰冷却用容器に
おいて、 該容器に入れる冷媒用液体１４の液面１４ａに
対し、若干の距離を隔てて網状の仕切り部材１５
を設けたことを特徴とする浸漬沸騰冷却用容器。[Claims for Utility Model Registration] In an immersion boiling cooling container in which a sealing cover 13 having a cooling pipe 12 for condensing a vaporized liquid is provided on an element mounting board 11 on which a semiconductor element 10 is mounted, the device is placed in the container. A net-shaped partition member 15 is placed at a certain distance from the liquid surface 14a of the refrigerant liquid 14.
An immersion boiling cooling container characterized by being provided with.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986013243U JPS62126843U (en) | 1986-02-03 | 1986-02-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986013243U JPS62126843U (en) | 1986-02-03 | 1986-02-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62126843U true JPS62126843U (en) | 1987-08-12 |
Family
ID=30802119
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986013243U Pending JPS62126843U (en) | 1986-02-03 | 1986-02-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62126843U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013026362A (en) * | 2011-07-20 | 2013-02-04 | Hitachi Ltd | Electronic apparatus cooling device |
-
1986
- 1986-02-03 JP JP1986013243U patent/JPS62126843U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013026362A (en) * | 2011-07-20 | 2013-02-04 | Hitachi Ltd | Electronic apparatus cooling device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS62126843U (en) | ||
| JPS62126844U (en) | ||
| JPS58126228U (en) | Fuel tank air breather | |
| JPS58122523U (en) | electric water heater | |
| JPS58123261U (en) | solar heat collector device | |
| JPS62104499U (en) | ||
| JPS5818552U (en) | Fluid retention bag | |
| JPS6312895U (en) | ||
| JPS59170114U (en) | Exhaust hot water utilization equipment | |
| JPS5920127U (en) | Temperature sensor mounting device | |
| JPS5834956U (en) | Exhaust equipment for vacuum evaporation | |
| JPS6123662U (en) | Air conditioner heat exchange coil | |
| JPS6010119U (en) | solar heat utilization equipment | |
| JPH01178578U (en) | ||
| JPS58173391U (en) | Bathtub with dirt collection mechanism | |
| JPS62104498U (en) | ||
| JPS5881458U (en) | solar collector expansion tank | |
| JPS59105433U (en) | hot water warmer | |
| JPS59135648U (en) | semiconductor cooling equipment | |
| JPS6027239U (en) | Exhaust stack drain treatment device | |
| JPS645085U (en) | ||
| JPS6063765U (en) | refrigerator | |
| JPS59117950U (en) | Cooling device for engine experiments | |
| JPS58133744U (en) | Water temperature drop prevention device for bathtubs | |
| JPS5822597U (en) | Complete steam retention type drain trap |