JPH0468524U - - Google Patents
Info
- Publication number
- JPH0468524U JPH0468524U JP11151990U JP11151990U JPH0468524U JP H0468524 U JPH0468524 U JP H0468524U JP 11151990 U JP11151990 U JP 11151990U JP 11151990 U JP11151990 U JP 11151990U JP H0468524 U JPH0468524 U JP H0468524U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafer
- etching
- tank
- overflow
- acid solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 11
- 238000005530 etching Methods 0.000 claims description 9
- 239000007788 liquid Substances 0.000 claims description 3
- 238000011084 recovery Methods 0.000 claims description 2
- 239000002253 acid Substances 0.000 claims 3
Landscapes
- Weting (AREA)
Description
第１図及び第２図は本考案の一実施例を示す半
導体ウエーハエツチング装置の主要部の上面図及
び部分断面図、第３図及び第４図は本考案の他の
実施例を示す半導体ウエーハエツチング装置の主
要部の上面図及び部分断面図である。
１……循環槽、２……液体ポンプ、３ａ……オ
ーバフロー槽、３ｂ……回収槽、４……供給口、
５……回収口、６……半導体ウエーハ、７……モ
ータ、８……ウエーハ保持機構。
1 and 2 are top views and partial sectional views of the main parts of a semiconductor wafer etching apparatus showing one embodiment of the present invention, and FIGS. 3 and 4 are semiconductor wafer etching apparatus showing another embodiment of the present invention. FIG. 3 is a top view and a partial sectional view of the main parts of the etching device. 1... Circulation tank, 2... Liquid pump, 3a... Overflow tank, 3b... Recovery tank, 4... Supply port,
5...Collection port, 6...Semiconductor wafer, 7...Motor, 8...Wafer holding mechanism.
Claims (1)
ウエーハエツチング装置において、酸液をオーバ
フローさせるオーバフロー槽とこのオーバフロー
槽の周囲にあるとともに前記酸液を回収する回収
槽とを有するエツチング槽と、前記半導体ウエー
ハを把むとともにオーバフロー液面に前記半導体
ウエーハの一面を接触させる半導体ウエーハ保持
機構と、この半導体ウエーハ保持機構を駆動する
ことによつて前記半導体ウエーハと前記オーバフ
ロー液面とを相対移動させる駆動機構とを備える
ことを特徴とする半導体ウエーハエツチング装置
。 A semiconductor wafer etching apparatus for etching a semiconductor wafer with an acid solution includes an etching tank having an overflow tank for allowing the acid solution to overflow, a recovery tank surrounding the overflow tank for recovering the acid solution, and an etching tank for etching the semiconductor wafer. and a semiconductor wafer holding mechanism that brings one side of the semiconductor wafer into contact with the overflow liquid level, and a drive mechanism that relatively moves the semiconductor wafer and the overflow liquid level by driving the semiconductor wafer holding mechanism. A semiconductor wafer etching device characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11151990U JPH0468524U (en) | 1990-10-24 | 1990-10-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11151990U JPH0468524U (en) | 1990-10-24 | 1990-10-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0468524U true JPH0468524U (en) | 1992-06-17 |
Family
ID=31858982
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11151990U Pending JPH0468524U (en) | 1990-10-24 | 1990-10-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0468524U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009088227A (en) * | 2007-09-28 | 2009-04-23 | Shibaura Mechatronics Corp | Processing apparatus and processing method for substrate |
-
1990
- 1990-10-24 JP JP11151990U patent/JPH0468524U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009088227A (en) * | 2007-09-28 | 2009-04-23 | Shibaura Mechatronics Corp | Processing apparatus and processing method for substrate |