JPH0296726U - - Google Patents
Info
- Publication number
- JPH0296726U JPH0296726U JP489189U JP489189U JPH0296726U JP H0296726 U JPH0296726 U JP H0296726U JP 489189 U JP489189 U JP 489189U JP 489189 U JP489189 U JP 489189U JP H0296726 U JPH0296726 U JP H0296726U
- Authority
- JP
- Japan
- Prior art keywords
- cleaning tank
- ultrasonic
- tank
- ultrasonic waves
- cleaning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004140 cleaning Methods 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 2
- 238000004506 ultrasonic cleaning Methods 0.000 claims 2
- 230000001678 irradiating effect Effects 0.000 claims 1
- 230000010355 oscillation Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 1
Landscapes
- Cleaning By Liquid Or Steam (AREA)
Description
第１図、第２図は本考案の実施例を示す構成図
、第３図は従来例を示す構成図である。
１……洗浄槽、２……洗浄液、３……キヤリア
、４……半導体ウエハー、５……発振板、６……
上下機構、６ａ……モータ、７……ワイヤー、８
……シヤフト、９……ノズル、１０……ポンプ、
１１……フイルター。
FIGS. 1 and 2 are block diagrams showing an embodiment of the present invention, and FIG. 3 is a block diagram showing a conventional example. 1... Cleaning tank, 2... Cleaning liquid, 3... Carrier, 4... Semiconductor wafer, 5... Oscillator plate, 6...
Vertical mechanism, 6a...Motor, 7...Wire, 8
...Shaft, 9...Nozzle, 10...Pump,
11...Filter.
Claims (1)
納された半導体ウエハーを浸し、超音波にて洗浄
を行う超音波洗浄槽において、超音波を照射する
発振板を槽上部に設けたことを特徴とする超音波
洗浄槽。 An ultrasonic cleaning tank in which a semiconductor wafer stored in a carrier is immersed in a cleaning tank containing a cleaning solution and cleaned with ultrasonic waves, is characterized by having an oscillation plate installed at the top of the tank for irradiating ultrasonic waves. Ultrasonic cleaning tank.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP489189U JPH0296726U (en) | 1989-01-19 | 1989-01-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP489189U JPH0296726U (en) | 1989-01-19 | 1989-01-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0296726U true JPH0296726U (en) | 1990-08-01 |
Family
ID=31207799
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP489189U Pending JPH0296726U (en) | 1989-01-19 | 1989-01-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0296726U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1996021242A1 (en) * | 1995-01-06 | 1996-07-11 | Tadahiro Ohmi | Cleaning method |
| TWI824469B (en) * | 2021-04-21 | 2023-12-01 | 南韓商杰宜斯科技有限公司 | Wafer cleaning apparatus |
| TWI824420B (en) * | 2020-08-25 | 2023-12-01 | 南韓商杰宜斯科技有限公司 | Wafer cleaning apparatus and controlling method thereof |
-
1989
- 1989-01-19 JP JP489189U patent/JPH0296726U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1996021242A1 (en) * | 1995-01-06 | 1996-07-11 | Tadahiro Ohmi | Cleaning method |
| TWI824420B (en) * | 2020-08-25 | 2023-12-01 | 南韓商杰宜斯科技有限公司 | Wafer cleaning apparatus and controlling method thereof |
| TWI824469B (en) * | 2021-04-21 | 2023-12-01 | 南韓商杰宜斯科技有限公司 | Wafer cleaning apparatus |
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