JPS6322463B2 - - Google Patents
Info
- Publication number
- JPS6322463B2 JPS6322463B2 JP56061069A JP6106981A JPS6322463B2 JP S6322463 B2 JPS6322463 B2 JP S6322463B2 JP 56061069 A JP56061069 A JP 56061069A JP 6106981 A JP6106981 A JP 6106981A JP S6322463 B2 JPS6322463 B2 JP S6322463B2
- Authority
- JP
- Japan
- Prior art keywords
- oxide film
- silicon oxide
- silicon
- diffusion layer
- type diffusion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Local Oxidation Of Silicon (AREA)
- Bipolar Transistors (AREA)
- Element Separation (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56061069A JPS57176742A (en) | 1981-04-21 | 1981-04-21 | Semiconductor device and manufacture thereof |
US06/369,235 US4564997A (en) | 1981-04-21 | 1982-04-16 | Semiconductor device and manufacturing process thereof |
CA000401294A CA1204883A (en) | 1981-04-21 | 1982-04-20 | Semiconductor device and manufacturing process thereof |
DE8282302044T DE3271995D1 (en) | 1981-04-21 | 1982-04-21 | Method of manufacturing a semiconductor device |
EP82302044A EP0063917B1 (en) | 1981-04-21 | 1982-04-21 | Method of manufacturing a semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56061069A JPS57176742A (en) | 1981-04-21 | 1981-04-21 | Semiconductor device and manufacture thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57176742A JPS57176742A (en) | 1982-10-30 |
JPS6322463B2 true JPS6322463B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1988-05-12 |
Family
ID=13160481
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP56061069A Granted JPS57176742A (en) | 1981-04-21 | 1981-04-21 | Semiconductor device and manufacture thereof |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57176742A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59123266A (ja) * | 1982-12-28 | 1984-07-17 | Toshiba Corp | Misトランジスタ及びその製造方法 |
JPS59178773A (ja) * | 1983-03-30 | 1984-10-11 | Toshiba Corp | 半導体装置の製造方法 |
JPH065680B2 (ja) * | 1984-09-03 | 1994-01-19 | 富士通株式会社 | 半導体装置の製法 |
JPS6184866A (ja) * | 1984-10-02 | 1986-04-30 | Nec Corp | 半導体集積回路装置 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5396766A (en) * | 1977-02-04 | 1978-08-24 | Nec Corp | Semiconductor device |
JPS54591A (en) * | 1977-06-03 | 1979-01-05 | Hitachi Ltd | Element isolating method |
JPS55130140A (en) * | 1979-03-30 | 1980-10-08 | Toshiba Corp | Fabricating method of semiconductor device |
-
1981
- 1981-04-21 JP JP56061069A patent/JPS57176742A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS57176742A (en) | 1982-10-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4543592A (en) | Semiconductor integrated circuits and manufacturing process thereof | |
US4502913A (en) | Total dielectric isolation for integrated circuits | |
US4757028A (en) | Process for preparing a silicon carbide device | |
JP2780986B2 (ja) | 集積回路の製造方法 | |
KR0171582B1 (ko) | 배선 구조를 갖는 반도체 디바이스 및 그 제조 방법 | |
EP0444836B1 (en) | Process for forming semiconductor device isolation regions | |
JPH0362024B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | ||
EP0540446B1 (en) | Self-aligned contact studs for semiconductor structures | |
EP0076105B1 (en) | Method of producing a bipolar transistor | |
JP2002512736A (ja) | トレンチで分離されたバイポーラデバイス | |
JPS6072268A (ja) | バイポ−ラ・トランジスタ構造の製造方法 | |
KR100437451B1 (ko) | 트랩형 비휘발성 메모리 장치의 제조 방법 | |
US4661832A (en) | Total dielectric isolation for integrated circuits | |
US5897359A (en) | Method of manufacturing a silicon/silicon germanium heterojunction bipolar transistor | |
JPS61501668A (ja) | 集積回路構成要素の電気的絶縁領域製造方法 | |
JPS6322463B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | ||
US4980739A (en) | Self-aligned bipolar transistor using selective polysilicon growth | |
JP3483090B2 (ja) | 半導体装置の製造方法 | |
JPH05226466A (ja) | 半導体装置の製造方法 | |
JP2969722B2 (ja) | 半導体集積回路装置及びその製造方法 | |
KR0172546B1 (ko) | 반도체 소자의 저장전극 콘택홀 형성방법 | |
KR100416813B1 (ko) | 반도체소자의필드산화막형성방법 | |
JPS58108753A (ja) | 半導体装置の製造方法 | |
TW465035B (en) | Manufacture method of extremely narrow bit line without sidewall spacer | |
JPS6021539A (ja) | 半導体装置の製造方法 |