JPS6320379B2 - - Google Patents

Info

Publication number
JPS6320379B2
JPS6320379B2 JP55049223A JP4922380A JPS6320379B2 JP S6320379 B2 JPS6320379 B2 JP S6320379B2 JP 55049223 A JP55049223 A JP 55049223A JP 4922380 A JP4922380 A JP 4922380A JP S6320379 B2 JPS6320379 B2 JP S6320379B2
Authority
JP
Japan
Prior art keywords
target
substrate
marks
calculated
inclination
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55049223A
Other languages
English (en)
Japanese (ja)
Other versions
JPS56146242A (en
Inventor
Toshimitsu Hamada
Mikio Ppongo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP4922380A priority Critical patent/JPS56146242A/ja
Publication of JPS56146242A publication Critical patent/JPS56146242A/ja
Publication of JPS6320379B2 publication Critical patent/JPS6320379B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/788—Means for moving parts
    • H01L2224/78801—Lower part of the bonding apparatus, e.g. XY table
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8512—Aligning
    • H01L2224/85121—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
JP4922380A 1980-04-16 1980-04-16 Positioning method of bonding position at fixed position on substrate Granted JPS56146242A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4922380A JPS56146242A (en) 1980-04-16 1980-04-16 Positioning method of bonding position at fixed position on substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4922380A JPS56146242A (en) 1980-04-16 1980-04-16 Positioning method of bonding position at fixed position on substrate

Publications (2)

Publication Number Publication Date
JPS56146242A JPS56146242A (en) 1981-11-13
JPS6320379B2 true JPS6320379B2 (enrdf_load_stackoverflow) 1988-04-27

Family

ID=12824928

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4922380A Granted JPS56146242A (en) 1980-04-16 1980-04-16 Positioning method of bonding position at fixed position on substrate

Country Status (1)

Country Link
JP (1) JPS56146242A (enrdf_load_stackoverflow)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5887838A (ja) * 1981-11-20 1983-05-25 Hitachi Ltd 位置認識方法
JPS58147037A (ja) * 1982-02-25 1983-09-01 Fuji Electric Co Ltd 混成集積回路
JPS60262432A (ja) * 1984-06-11 1985-12-25 Toshiba Corp マウント装置
JPH0738519B2 (ja) * 1985-12-27 1995-04-26 松下電器産業株式会社 電子部品実装方法
JPH02146832U (enrdf_load_stackoverflow) * 1990-05-10 1990-12-13
CN104364892B (zh) 2012-06-06 2017-11-03 Ev 集团 E·索尔纳有限责任公司 用于确定对准误差的装置和方法
JP6337179B2 (ja) * 2017-05-10 2018-06-06 エーファウ・グループ・エー・タルナー・ゲーエムベーハー 位置合わせ誤差を求めるための装置と方法

Also Published As

Publication number Publication date
JPS56146242A (en) 1981-11-13

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