JPH02146832U - - Google Patents

Info

Publication number
JPH02146832U
JPH02146832U JP4877790U JP4877790U JPH02146832U JP H02146832 U JPH02146832 U JP H02146832U JP 4877790 U JP4877790 U JP 4877790U JP 4877790 U JP4877790 U JP 4877790U JP H02146832 U JPH02146832 U JP H02146832U
Authority
JP
Japan
Prior art keywords
mounting points
unit
fixed point
substrate
actual position
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4877790U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP4877790U priority Critical patent/JPH02146832U/ja
Publication of JPH02146832U publication Critical patent/JPH02146832U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)
JP4877790U 1990-05-10 1990-05-10 Pending JPH02146832U (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4877790U JPH02146832U (enrdf_load_stackoverflow) 1990-05-10 1990-05-10

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4877790U JPH02146832U (enrdf_load_stackoverflow) 1990-05-10 1990-05-10

Publications (1)

Publication Number Publication Date
JPH02146832U true JPH02146832U (enrdf_load_stackoverflow) 1990-12-13

Family

ID=31565892

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4877790U Pending JPH02146832U (enrdf_load_stackoverflow) 1990-05-10 1990-05-10

Country Status (1)

Country Link
JP (1) JPH02146832U (enrdf_load_stackoverflow)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5563836A (en) * 1978-11-06 1980-05-14 Chiyou Lsi Gijutsu Kenkyu Kumiai Defect detection device for insulating film
JPS56146242A (en) * 1980-04-16 1981-11-13 Hitachi Ltd Positioning method of bonding position at fixed position on substrate
JPS5726448A (en) * 1980-07-23 1982-02-12 Hitachi Ltd Pellet attaching device with recognizing mechanism
JPS5753950A (ja) * 1980-09-17 1982-03-31 Fujitsu Ltd Peretsutobondeingusochi
JPS5763836A (en) * 1980-10-04 1982-04-17 Shinkawa Ltd Die bonding apparatus

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5563836A (en) * 1978-11-06 1980-05-14 Chiyou Lsi Gijutsu Kenkyu Kumiai Defect detection device for insulating film
JPS56146242A (en) * 1980-04-16 1981-11-13 Hitachi Ltd Positioning method of bonding position at fixed position on substrate
JPS5726448A (en) * 1980-07-23 1982-02-12 Hitachi Ltd Pellet attaching device with recognizing mechanism
JPS5753950A (ja) * 1980-09-17 1982-03-31 Fujitsu Ltd Peretsutobondeingusochi
JPS5763836A (en) * 1980-10-04 1982-04-17 Shinkawa Ltd Die bonding apparatus

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