JPS5726448A - Pellet attaching device with recognizing mechanism - Google Patents

Pellet attaching device with recognizing mechanism

Info

Publication number
JPS5726448A
JPS5726448A JP9994380A JP9994380A JPS5726448A JP S5726448 A JPS5726448 A JP S5726448A JP 9994380 A JP9994380 A JP 9994380A JP 9994380 A JP9994380 A JP 9994380A JP S5726448 A JPS5726448 A JP S5726448A
Authority
JP
Japan
Prior art keywords
pellet
time
head
base
cavity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9994380A
Other languages
Japanese (ja)
Other versions
JPH0127577B2 (en
Inventor
Tatsuo Sugimoto
Masakazu Ozawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP9994380A priority Critical patent/JPS5726448A/en
Publication of JPS5726448A publication Critical patent/JPS5726448A/en
Publication of JPH0127577B2 publication Critical patent/JPH0127577B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/83801—Soldering or alloying
    • H01L2224/83805—Soldering or alloying involving forming a eutectic alloy at the bonding interface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor

Abstract

PURPOSE:To improve the pellet attaching accuracy by recognizing the pellet attaching position and controlling the position of a junction head in accordance with the result to mount the pellet in the cavity. CONSTITUTION:A junction head 26 is moved forwardly and downwardly in a time A, and absorbs the pellet from a tray 32 and rises in a time B. The head 26 then retards in a time C and returns to the original position. A head 40 optically recognizes by a recognition unit 36 the position of the recognizing position 44 at the end of a gold dot surface 42 in a cavity 18 formed in the base 12 in a package 10 in a time D approximately corresponding to the time C. An arithmetic unit 36 will calculate the displacement from the original based on the recognized result, drives and controls an X-Y base 20, and corrects the position of a head 26. Then, the head 26 moves down, scrubes the pellet in a time E, and mounts it in a time F. After the pellet is attached, the head 26 rises, and the base 20 returns to the original position. According to this configuration, the pellet can be precisely attached to the gold dot surface 42 in the cavity 18 of the base 12 by the Au-Si eutectic reaction.
JP9994380A 1980-07-23 1980-07-23 Pellet attaching device with recognizing mechanism Granted JPS5726448A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9994380A JPS5726448A (en) 1980-07-23 1980-07-23 Pellet attaching device with recognizing mechanism

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9994380A JPS5726448A (en) 1980-07-23 1980-07-23 Pellet attaching device with recognizing mechanism

Publications (2)

Publication Number Publication Date
JPS5726448A true JPS5726448A (en) 1982-02-12
JPH0127577B2 JPH0127577B2 (en) 1989-05-30

Family

ID=14260786

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9994380A Granted JPS5726448A (en) 1980-07-23 1980-07-23 Pellet attaching device with recognizing mechanism

Country Status (1)

Country Link
JP (1) JPS5726448A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58216428A (en) * 1982-06-11 1983-12-16 Toshiba Corp Semiconductor chip supply apparatus
JPS6127239U (en) * 1984-07-20 1986-02-18 日本電気株式会社 mounting device
JPH01183127A (en) * 1988-01-18 1989-07-20 Shinkawa Ltd Die bonding method
JPH02146832U (en) * 1990-05-10 1990-12-13

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000041443A1 (en) 1998-12-28 2000-07-13 Idemitsu Kosan Co., Ltd. Organic electroluminescence device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5174576A (en) * 1974-12-25 1976-06-28 Shinkawa Seisakusho Kk
JPS51149781A (en) * 1975-06-17 1976-12-22 Agency Of Ind Science & Technol Device for mounting semiconductor laserelement
JPS5423564U (en) * 1977-07-18 1979-02-16

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5174576A (en) * 1974-12-25 1976-06-28 Shinkawa Seisakusho Kk
JPS51149781A (en) * 1975-06-17 1976-12-22 Agency Of Ind Science & Technol Device for mounting semiconductor laserelement
JPS5423564U (en) * 1977-07-18 1979-02-16

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58216428A (en) * 1982-06-11 1983-12-16 Toshiba Corp Semiconductor chip supply apparatus
JPS6127239U (en) * 1984-07-20 1986-02-18 日本電気株式会社 mounting device
JPH01183127A (en) * 1988-01-18 1989-07-20 Shinkawa Ltd Die bonding method
JPH02146832U (en) * 1990-05-10 1990-12-13

Also Published As

Publication number Publication date
JPH0127577B2 (en) 1989-05-30

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