JPH0127577B2 - - Google Patents

Info

Publication number
JPH0127577B2
JPH0127577B2 JP55099943A JP9994380A JPH0127577B2 JP H0127577 B2 JPH0127577 B2 JP H0127577B2 JP 55099943 A JP55099943 A JP 55099943A JP 9994380 A JP9994380 A JP 9994380A JP H0127577 B2 JPH0127577 B2 JP H0127577B2
Authority
JP
Japan
Prior art keywords
pellet
recognition
bonding head
predetermined
head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55099943A
Other languages
Japanese (ja)
Other versions
JPS5726448A (en
Inventor
Tatsuo Sugimoto
Masakazu Ozawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP9994380A priority Critical patent/JPS5726448A/en
Publication of JPS5726448A publication Critical patent/JPS5726448A/en
Publication of JPH0127577B2 publication Critical patent/JPH0127577B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/83801—Soldering or alloying
    • H01L2224/83805—Soldering or alloying involving forming a eutectic alloy at the bonding interface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Image Processing (AREA)
  • Die Bonding (AREA)
  • Image Analysis (AREA)

Description

【発明の詳細な説明】 本発明は認識機構を備えたペレツト付け方法お
よび装置に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a pelletizing method and apparatus with a recognition mechanism.

一般に、たとえばいわゆるデユアルインライン
（DIL）形のパツケージにおいて、半導体チツプ
であるペレツトを該パツケージのペレツトマウン
ト部に取り付ける場合、第１図および第２図に示
すように、まずフレーム１４をガラス１６により
パツケージ１０のベース１２に取り付けてからペ
レツトマウント部であるキヤビテイ１８にペレツ
ト付けを行う方式と、ペレツトをベース１２に取
り付けた後にフレーム１４を該ベース１２に取り
付ける方式とがある。 Generally, when attaching a pellet, which is a semiconductor chip, to the pellet mount portion of a so-called dual-in-line (DIL) package, the frame 14 is first attached to the glass 16 as shown in FIGS. 1 and 2. There are two methods: one is to attach the pellets to the base 12 of the package 10 and then attach the pellets to the cavity 18 which is the pellet mount part, and the other is to attach the frame 14 to the base 12 after attaching the pellets to the base 12.

いずれの方式においても、ペレツトをキヤビテ
イ内に取り付けることは、パツケージの寸法精度
にばらつきがあること等により非常に困難なもの
であり、特に集積度の増大によりペレツトの寸法
が大型化している今日では、従来のままでペレツ
トをキヤビテイの中に取り付けることは機械的位
置決めのみでは実際的に極めて困難になつて来て
いる。 In either method, it is extremely difficult to install the pellets inside the cavity due to variations in the dimensional accuracy of the packages, especially in today's world where the dimensions of pellets are becoming larger due to the increase in the degree of packing. In practice, it has become extremely difficult to mount pellets into cavities using only mechanical positioning.

本発明はこのような課題に鑑みてなされたもの
で、ペレツト付けの精度を向上させ、ペレツト付
けの自動化を実現できる認識機構を備えたペレツ
ト付け装置およびペレツト付け方法を提供するこ
とを目的とするものである。 The present invention was made in view of the above problems, and an object thereof is to provide a pellet attaching device and a pellet attaching method equipped with a recognition mechanism that can improve the accuracy of pellet attaching and realize automation of pellet attaching. It is something.

以下、本発明を図面に示す実施例に即してさら
に説明する。 The present invention will be further described below with reference to embodiments shown in the drawings.

第３図は本発明による認識機構を備えたペレツ
ト付け装置の一実施例を示す平面図、第４図はそ
の正面図である。 FIG. 3 is a plan view showing an embodiment of a pelletizing device equipped with a recognition mechanism according to the present invention, and FIG. 4 is a front view thereof.

本実施例のペレツト付け装置はXY両方向に移
動可能なXYテーブル２０を有し、ここのXYテ
ーブル２０の上には取付板２２を介してボンデイ
ングヘツド駆動部２４が載置され、該ボンデイン
グヘツド駆動部２４の側面上部にはボンデイング
ヘツド２６が前後進および上下動可能に取り付け
られている。ボンデイングヘツド２６は、XYテ
ーブル２８上のペレツト皿３０により保持された
半導体チツプすなわちペレツト３２をたとえば真
空で吸着し、パツケージ搬送用のシユート３４上
のパツケージ１０のペレツトマウント部のキヤビ
テイ１８内に取り付けるためのものである。 The pellet attaching device of this embodiment has an XY table 20 that is movable in both the X and Y directions, and a bonding head drive unit 24 is placed on the XY table 20 via a mounting plate 22. A bonding head 26 is attached to the upper side of the portion 24 so as to be movable back and forth and up and down. The bonding head 26 uses, for example, vacuum to adsorb a semiconductor chip, that is, a pellet 32 held by a pellet tray 30 on an XY table 28, and attaches it to the cavity 18 of the pellet mount portion of the package 10 on a chute 34 for transporting the package. It is for.

前記取付板２２の後部（第３図と第４図の右側
部分）には、パツケージ１０のペレツト付け位置
を認識するための光学式の認識機構３６が設置さ
れ、この認識機構３６の一側部（第３図と第４図
の左側部）には、支持板３８で支持された認識用
光学系を構成する認識ヘツド４０が延設されてい
る。さらに具体的には、本実施例における認識機
構３６の認識ヘツド４０は第５図および第６図か
ら明らかなように、パツケージ１０のベース１２
に形成されたペレツトマウント部用のキヤビテイ
１８内の金（Au）ドツト面４２の端部に位置す
る４つの認識点４４の位置を認識し、その認識結
果に基づいて精度の良いペレツト付けを行うため
のものである。そのため、本実施例の認識機構３
６はたとえばマイクロコンピユータを内蔵した制
御装置４６に接続され、該制御装置４６は前記
XYテーブル２０に接続され、認識機構３６から
認識結果に基づいて該XYテーブル２０を制御
し、該XYテーブル２０上に載置されたボンデイ
ングヘツド駆動部２４およびボンデイングヘツド
２６を所望位置に移動させて精度の良いペレツト
付けを行うことができる。 An optical recognition mechanism 36 for recognizing the pellet attaching position of the package 10 is installed at the rear of the mounting plate 22 (the right side in FIGS. 3 and 4), and one side of this recognition mechanism 36 A recognition head 40 constituting a recognition optical system supported by a support plate 38 is extended (on the left side in FIGS. 3 and 4). More specifically, the recognition head 40 of the recognition mechanism 36 in this embodiment is attached to the base 12 of the package 10, as is clear from FIGS. 5 and 6.
The positions of the four recognition points 44 located at the ends of the gold (Au) dot surface 42 in the cavity 18 for the pellet mount portion formed in the pellet mount part are recognized, and the pellets can be attached with high accuracy based on the recognition results. It is meant to be done. Therefore, the recognition mechanism 3 of this embodiment
6 is connected to a control device 46 having a built-in microcomputer, for example, and the control device 46 is connected to the
It is connected to the XY table 20, controls the XY table 20 based on the recognition result from the recognition mechanism 36, and moves the bonding head drive unit 24 and the bonding head 26 placed on the XY table 20 to a desired position. Accurate pelleting can be performed.

次に、本実施例の作用について説明する。第４
図から明らかなように、ボンデイングヘツド２６
は前後動および上下動可能であるが、該ボンデイ
ングヘツド２６はまず時間Ａで示す範囲では原点
位置から前進し、次いで前進の終了と同時に下降
して時間Ｂでペレツト皿３０からペレツト３２を
真空吸着した後、上昇する。上昇の終了と同時
に、ボンデイングヘツド２６は時間Ｃだけ後退
し、元の位置すなわち原点位置に戻る。 Next, the operation of this embodiment will be explained. Fourth
As is clear from the figure, the bonding head 26
The bonding head 26 can move back and forth and up and down, but the bonding head 26 first moves forward from the origin position in the range shown at time A, then descends at the same time as the end of the forward movement, and vacuum sucks the pellet 32 from the pellet tray 30 at time B. After that, it rises. At the end of the rise, the bonding head 26 is retracted by a time C and returns to its original or home position.

前記時間Ｃとほぼ対応する時間Ｄが認識ヘツド
４０による認識タイミングであり、該認識ヘツド
４０は、パツケージ１０内のベース１２に形成さ
れたペレツトマウント部用のキヤビテイ１８内の
金ドツト面４２の端部の４つの認識点４４の位置
を光学的に認識する。 Time D, which approximately corresponds to the time C, is the recognition timing by the recognition head 40, and the recognition head 40 detects the gold dot surface 42 in the cavity 18 for the pellet mount formed in the base 12 in the package 10. The positions of the four recognition points 44 at the end are optically recognized.

認識ヘツド４０による認識結果は認識機構３６
から制御装置４６に送られ、該制御装置４６はそ
の認識結果に基づいて所望の精密なペレツト付け
位置を原点位置からのずれ量の演算により求め、
その結果にしたがつてXYテーブル２０を駆動制
御し、該XYテーブル２０上のボンデイングヘツ
ド２６を原点位置からのずれ量分だけ適正なペレ
ツト付け位置に移動させる。 The recognition result by the recognition head 40 is sent to the recognition mechanism 36.
Based on the recognition result, the control device 46 determines a desired precise pellet placement position by calculating the amount of deviation from the origin position.
According to the result, the XY table 20 is driven and controlled, and the bonding head 26 on the XY table 20 is moved to a proper pellet attaching position by the amount of deviation from the original position.

その後、ボンデイングヘツド２６は下降し、時
間Ｅでペレツトのスクラビングを行いながら、時
間Ｆでペレツト付けを行うことにより、ペレツト
３２はベース１２のキヤビテイ１８内の金ドツト
面４２に対して金（Au）―シリコン（Si）共晶
反応により精度良くペレツト付けされる。 Thereafter, the bonding head 26 is lowered, and the pellets 32 are deposited with gold (Au) on the gold dot surface 42 in the cavity 18 of the base 12 by scrubbing the pellets at time E and applying pellets at time F. - Precisely pelletized by silicon (Si) eutectic reaction.

ペレツト付けを終了した後、ボンデイングヘツ
ド２６は上昇し、XYテーブル２０は原点位置に
復帰し、再び前記操作を繰り返す。 After pelleting is completed, the bonding head 26 is raised, the XY table 20 returns to its original position, and the above operation is repeated again.

なお、本実施例では、ボンデイングヘツド２６
と認識ヘツド４０とが垂直方向に同軸的に整合し
て設置されているので、認識ヘツド４０による認
識によつてボンデイングヘツド２６とパツケージ
１０との位置合せは自動的に完了することにな
り、極めて有利である。 Note that in this embodiment, the bonding head 26
Since the bonding head 26 and the recognition head 40 are installed coaxially aligned in the vertical direction, the alignment between the bonding head 26 and the package 10 is automatically completed by recognition by the recognition head 40, which is very easy. It's advantageous.

以上説明したように、本発明によれば、認識機
構によるペレツト付け位置の認識によりペレツト
付けの精度を大幅に向上させることができ、ペレ
ツト付けの自動化も可能となる。 As explained above, according to the present invention, the accuracy of pellet attachment can be greatly improved by recognizing the pellet attachment position by the recognition mechanism, and it is also possible to automate pellet attachment.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本発明を適用できるパツケージの一例
の平面図、第２図はその側面図、第３図は本発明
による認識機構を備えたペレツト付け装置の一実
施例の平面図、第４図はその正面図、第５図はパ
ツケージのペレツトマウント部の部分断面図、第
６図は認識点の一例を示す図、第７図は本発明の
動作を示す図である。 １０……パツケージ、１２……ベース、１４…
…キヤビテイ、２０……XYテーブル、２６……
ボンデイングヘツド、３２……ペレツト、３６…
…認識機構、４０……認識ヘツド、４２……金ド
ツト面、４４……認識点、４６……制御装置。 FIG. 1 is a plan view of an example of a package to which the present invention can be applied, FIG. 2 is a side view thereof, FIG. 3 is a plan view of an example of a pellet applicator equipped with a recognition mechanism according to the present invention, and FIG. 5 is a front view thereof, FIG. 5 is a partial sectional view of the pellet mount portion of the package, FIG. 6 is a diagram showing an example of a recognition point, and FIG. 7 is a diagram showing the operation of the present invention. 10...Package, 12...Base, 14...
...Cavity, 20...XY table, 26...
Bonding head, 32... Pellet, 36...
... recognition mechanism, 40 ... recognition head, 42 ... gold dot surface, 44 ... recognition point, 46 ... control device.

Claims (1)

【特許請求の範囲】 １ 所定のペレツト付け部にペレツトを取り付け
るボンデイングヘツドと、前記所定のペレツト付
け部を認識する認識機構と、該認識機構の認識結
果に基づいて前記所定のペレツト付け部の所定位
置からのずれ量を求め、このずれ量に応じて前記
ボンデイングヘツドの位置をXYテーブルにより
制御する制御装置を備えたペレツト付け装置。 ２ 前記ボンデイングヘツドと前記認識機構の認
識ヘツドとが垂直方向に同軸位置に設置されてい
ることを特徴とする特許請求の範囲第１項記載の
ペレツト付け装置。 ３ ボンデイングヘツドに吸着させたペレツトを
所定のペレツト付け部に接続するペレツト付け方
法において、ペレツト付け部の位置を所定の認識
手段により認識し、前記認識手段による認識結果
に基づき前記ペレツト付け部の所定位置からのず
れ量を演算によつて求め、前記演算結果に基づき
XYテーブルを制御して前記XYテーブル上のボ
ンデイングヘツドを前記ずれ量に応じて移動させ
ることを特徴とするペレツト付け方法。[Scope of Claims] 1. A bonding head that attaches a pellet to a predetermined pellet attachment portion, a recognition mechanism that recognizes the predetermined pellet attachment portion, and a recognition mechanism that recognizes the predetermined pellet attachment portion based on the recognition result of the recognition mechanism. A pellet attaching device comprising a control device that determines the amount of deviation from the position and controls the position of the bonding head using an XY table according to this amount of deviation. 2. The pelletizing apparatus according to claim 1, wherein the bonding head and the recognition head of the recognition mechanism are installed in a vertically coaxial position. 3. In a pellet attaching method in which pellets adsorbed on a bonding head are connected to a predetermined pellet attaching section, the position of the pellet attaching section is recognized by a predetermined recognition means, and the predetermined position of the pellet attaching section is determined based on the recognition result by the recognition means. The amount of deviation from the position is determined by calculation, and based on the calculation result,
A pellet attaching method comprising controlling an XY table to move a bonding head on the XY table according to the amount of deviation.
JP9994380A 1980-07-23 1980-07-23 Pellet attaching device with recognizing mechanism Granted JPS5726448A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9994380A JPS5726448A (en) 1980-07-23 1980-07-23 Pellet attaching device with recognizing mechanism

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9994380A JPS5726448A (en) 1980-07-23 1980-07-23 Pellet attaching device with recognizing mechanism

Publications (2)

Publication Number Publication Date
JPS5726448A JPS5726448A (en) 1982-02-12
JPH0127577B2 true JPH0127577B2 (en) 1989-05-30

Family

ID=14260786

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9994380A Granted JPS5726448A (en) 1980-07-23 1980-07-23 Pellet attaching device with recognizing mechanism

Country Status (1)

Country Link
JP (1) JPS5726448A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2270117A2 (en) 1998-12-28 2011-01-05 Idemitsu Kosan Co., Ltd. Organic electroluminescence device

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58216428A (en) * 1982-06-11 1983-12-16 Toshiba Corp Semiconductor chip supply apparatus
JPH0642341Y2 (en) * 1984-07-20 1994-11-02 日本電気株式会社 Mount device
JPH0793328B2 (en) * 1988-01-18 1995-10-09 株式会社新川 Die bonding method
JPH02146832U (en) * 1990-05-10 1990-12-13

Citations (2)

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Publication number Priority date Publication date Assignee Title
JPS5174576A (en) * 1974-12-25 1976-06-28 Shinkawa Seisakusho Kk
JPS51149781A (en) * 1975-06-17 1976-12-22 Agency Of Ind Science & Technol Device for mounting semiconductor laserelement

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Publication number Priority date Publication date Assignee Title
JPS5744687Y2 (en) * 1977-07-18 1982-10-02

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5174576A (en) * 1974-12-25 1976-06-28 Shinkawa Seisakusho Kk
JPS51149781A (en) * 1975-06-17 1976-12-22 Agency Of Ind Science & Technol Device for mounting semiconductor laserelement

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2270117A2 (en) 1998-12-28 2011-01-05 Idemitsu Kosan Co., Ltd. Organic electroluminescence device

Also Published As

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JPS5726448A (en) 1982-02-12

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