JPS63185029A - ウエハ処理装置 - Google Patents

ウエハ処理装置

Info

Publication number
JPS63185029A
JPS63185029A JP1629487A JP1629487A JPS63185029A JP S63185029 A JPS63185029 A JP S63185029A JP 1629487 A JP1629487 A JP 1629487A JP 1629487 A JP1629487 A JP 1629487A JP S63185029 A JPS63185029 A JP S63185029A
Authority
JP
Japan
Prior art keywords
wafer
disk
claw
processing liquid
processing apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1629487A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0573245B2 (OSRAM
Inventor
Koichi Saisu
齋須　好一
Tatsuo Nishiyama
達夫 西山
Yasuo Watanabe
渡辺　泰男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Setsubi Engineering Co Ltd
Hitachi Ltd
Original Assignee
Hitachi Setsubi Engineering Co Ltd
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Setsubi Engineering Co Ltd, Hitachi Ltd filed Critical Hitachi Setsubi Engineering Co Ltd
Priority to JP1629487A priority Critical patent/JPS63185029A/ja
Publication of JPS63185029A publication Critical patent/JPS63185029A/ja
Publication of JPH0573245B2 publication Critical patent/JPH0573245B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Cleaning By Liquid Or Steam (AREA)
JP1629487A 1987-01-28 1987-01-28 ウエハ処理装置 Granted JPS63185029A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1629487A JPS63185029A (ja) 1987-01-28 1987-01-28 ウエハ処理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1629487A JPS63185029A (ja) 1987-01-28 1987-01-28 ウエハ処理装置

Publications (2)

Publication Number Publication Date
JPS63185029A true JPS63185029A (ja) 1988-07-30
JPH0573245B2 JPH0573245B2 (OSRAM) 1993-10-14

Family

ID=11912524

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1629487A Granted JPS63185029A (ja) 1987-01-28 1987-01-28 ウエハ処理装置

Country Status (1)

Country Link
JP (1) JPS63185029A (OSRAM)

Cited By (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02127033U (OSRAM) * 1989-03-28 1990-10-19
US5322079A (en) * 1991-09-27 1994-06-21 Dainippon Screen Mfg. Co., Ltd. Substrate holding apparatus of a simple structure for holding a rotating substrate, and a substrate processing apparatus including the substrate holding apparatus
US5349978A (en) * 1992-06-04 1994-09-27 Tokyo Ohka Kogyo Co., Ltd. Cleaning device for cleaning planar workpiece
US5421056A (en) * 1993-04-19 1995-06-06 Tokyo Electron Limited Spin chuck and treatment apparatus using same
US5927305A (en) * 1996-02-20 1999-07-27 Pre-Tech Co., Ltd. Cleaning apparatus
WO1999046065A1 (en) * 1998-03-13 1999-09-16 Semitool, Inc. Micro-environment reactor for processing a microelectronic workpiece
US6143637A (en) * 1998-03-13 2000-11-07 Nec Corporation Process for production of semiconductor device and cleaning device used therein
EP0898301A3 (en) * 1997-08-18 2000-11-22 Tokyo Electron Limited Apparatus for cleaning both sides of substrate
US6264752B1 (en) 1998-03-13 2001-07-24 Gary L. Curtis Reactor for processing a microelectronic workpiece
US6318385B1 (en) 1998-03-13 2001-11-20 Semitool, Inc. Micro-environment chamber and system for rinsing and drying a semiconductor workpiece
US6350319B1 (en) 1998-03-13 2002-02-26 Semitool, Inc. Micro-environment reactor for processing a workpiece
US6357457B1 (en) * 1998-03-16 2002-03-19 Tokyo Electron Limited Substrate cleaning apparatus and method
US6413436B1 (en) 1999-01-27 2002-07-02 Semitool, Inc. Selective treatment of the surface of a microelectronic workpiece
US6423642B1 (en) 1998-03-13 2002-07-23 Semitool, Inc. Reactor for processing a semiconductor wafer
US6492284B2 (en) 1999-01-22 2002-12-10 Semitool, Inc. Reactor for processing a workpiece using sonic energy
US6511914B2 (en) 1999-01-22 2003-01-28 Semitool, Inc. Reactor for processing a workpiece using sonic energy
JP2003045840A (ja) * 2001-07-31 2003-02-14 Shibaura Mechatronics Corp スピン処理装置およびスピン処理方法
US6536454B2 (en) * 2000-07-07 2003-03-25 Sez Ag Device for treating a disc-shaped object
US6543156B2 (en) 2000-01-12 2003-04-08 Semitool, Inc. Method and apparatus for high-pressure wafer processing and drying
US6548411B2 (en) 1999-01-22 2003-04-15 Semitool, Inc. Apparatus and methods for processing a workpiece
US6632292B1 (en) 1998-03-13 2003-10-14 Semitool, Inc. Selective treatment of microelectronic workpiece surfaces
WO2003008140A3 (en) * 2001-07-16 2003-11-06 Semitool Inc Apparatus for processing a workpiece
US6680253B2 (en) 1999-01-22 2004-01-20 Semitool, Inc. Apparatus for processing a workpiece
KR100654697B1 (ko) * 1999-07-27 2006-12-07 시바우라 메카트로닉스 가부시끼가이샤 스핀처리장치
US7217325B2 (en) 1999-01-22 2007-05-15 Semitool, Inc. System for processing a workpiece
WO2009010394A1 (en) * 2007-07-13 2009-01-22 Sez Ag Apparatus and method for wet treatment of disc-like articles
JP2009260094A (ja) * 2008-04-18 2009-11-05 Disco Abrasive Syst Ltd スピンナ洗浄装置および加工装置
JP2009290241A (ja) * 2009-09-09 2009-12-10 Renesas Technology Corp 洗浄装置およびその洗浄装置を利用した被洗浄物の洗浄方法
KR100960685B1 (ko) * 2003-02-17 2010-05-31 엘지디스플레이 주식회사 카세트세정장치
JP2014103274A (ja) * 2012-11-20 2014-06-05 Shindengen Electric Mfg Co Ltd レジスト現像装置、レジスト現像方法及び半導体装置の製造方法
US9748120B2 (en) 2013-07-01 2017-08-29 Lam Research Ag Apparatus for liquid treatment of disc-shaped articles and heating system for use in such apparatus

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51132972A (en) * 1975-04-28 1976-11-18 Ibm Method of etching
JPS57194070A (en) * 1981-05-22 1982-11-29 Hitachi Ltd Double side coating device
JPS5898733A (ja) * 1981-12-09 1983-06-11 Nec Corp 現像装置
JPS6079724A (ja) * 1983-10-07 1985-05-07 Hitachi Ltd 回転処理装置
JPS61125129A (ja) * 1984-11-22 1986-06-12 Hitachi Ltd 処理装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51132972A (en) * 1975-04-28 1976-11-18 Ibm Method of etching
JPS57194070A (en) * 1981-05-22 1982-11-29 Hitachi Ltd Double side coating device
JPS5898733A (ja) * 1981-12-09 1983-06-11 Nec Corp 現像装置
JPS6079724A (ja) * 1983-10-07 1985-05-07 Hitachi Ltd 回転処理装置
JPS61125129A (ja) * 1984-11-22 1986-06-12 Hitachi Ltd 処理装置

Cited By (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02127033U (OSRAM) * 1989-03-28 1990-10-19
US5322079A (en) * 1991-09-27 1994-06-21 Dainippon Screen Mfg. Co., Ltd. Substrate holding apparatus of a simple structure for holding a rotating substrate, and a substrate processing apparatus including the substrate holding apparatus
US5349978A (en) * 1992-06-04 1994-09-27 Tokyo Ohka Kogyo Co., Ltd. Cleaning device for cleaning planar workpiece
US5421056A (en) * 1993-04-19 1995-06-06 Tokyo Electron Limited Spin chuck and treatment apparatus using same
US5927305A (en) * 1996-02-20 1999-07-27 Pre-Tech Co., Ltd. Cleaning apparatus
EP0898301A3 (en) * 1997-08-18 2000-11-22 Tokyo Electron Limited Apparatus for cleaning both sides of substrate
US6276378B1 (en) 1997-08-18 2001-08-21 Tokyo Electron Limited Apparatus for cleaning both sides of substrate
US6695914B2 (en) 1998-03-13 2004-02-24 Semitool, Inc. System for processing a workpiece
US6558470B2 (en) 1998-03-13 2003-05-06 Semitool, Inc. Reactor for processing a microelectronic workpiece
US6143637A (en) * 1998-03-13 2000-11-07 Nec Corporation Process for production of semiconductor device and cleaning device used therein
US6318385B1 (en) 1998-03-13 2001-11-20 Semitool, Inc. Micro-environment chamber and system for rinsing and drying a semiconductor workpiece
US6350319B1 (en) 1998-03-13 2002-02-26 Semitool, Inc. Micro-environment reactor for processing a workpiece
US6997988B2 (en) 1998-03-13 2006-02-14 Semitool, Inc. System for processing a workpiece
WO1999046065A1 (en) * 1998-03-13 1999-09-16 Semitool, Inc. Micro-environment reactor for processing a microelectronic workpiece
US6423642B1 (en) 1998-03-13 2002-07-23 Semitool, Inc. Reactor for processing a semiconductor wafer
US6447633B1 (en) 1998-03-13 2002-09-10 Semitdol, Inc. Reactor for processing a semiconductor wafer
US6446643B2 (en) 1998-03-13 2002-09-10 Semitool, Inc. Micro-environment chamber and system for rinsing and drying a semiconductor workpiece
US6666922B2 (en) 1998-03-13 2003-12-23 Semitool, Inc. System for processing a workpiece
US6494956B2 (en) 1998-03-13 2002-12-17 Semitool, Inc. System for processing a workpiece
US6660098B2 (en) 1998-03-13 2003-12-09 Semitool, Inc. System for processing a workpiece
US6632292B1 (en) 1998-03-13 2003-10-14 Semitool, Inc. Selective treatment of microelectronic workpiece surfaces
US6264752B1 (en) 1998-03-13 2001-07-24 Gary L. Curtis Reactor for processing a microelectronic workpiece
US6357457B1 (en) * 1998-03-16 2002-03-19 Tokyo Electron Limited Substrate cleaning apparatus and method
US6511914B2 (en) 1999-01-22 2003-01-28 Semitool, Inc. Reactor for processing a workpiece using sonic energy
US6680253B2 (en) 1999-01-22 2004-01-20 Semitool, Inc. Apparatus for processing a workpiece
US7217325B2 (en) 1999-01-22 2007-05-15 Semitool, Inc. System for processing a workpiece
US6548411B2 (en) 1999-01-22 2003-04-15 Semitool, Inc. Apparatus and methods for processing a workpiece
US6492284B2 (en) 1999-01-22 2002-12-10 Semitool, Inc. Reactor for processing a workpiece using sonic energy
US6413436B1 (en) 1999-01-27 2002-07-02 Semitool, Inc. Selective treatment of the surface of a microelectronic workpiece
KR100654697B1 (ko) * 1999-07-27 2006-12-07 시바우라 메카트로닉스 가부시끼가이샤 스핀처리장치
US6543156B2 (en) 2000-01-12 2003-04-08 Semitool, Inc. Method and apparatus for high-pressure wafer processing and drying
US6536454B2 (en) * 2000-07-07 2003-03-25 Sez Ag Device for treating a disc-shaped object
KR100528741B1 (ko) * 2000-07-07 2005-11-15 제츠 아게 디스크형 물체 처리 장치
WO2003008140A3 (en) * 2001-07-16 2003-11-06 Semitool Inc Apparatus for processing a workpiece
JP2003045840A (ja) * 2001-07-31 2003-02-14 Shibaura Mechatronics Corp スピン処理装置およびスピン処理方法
KR100960685B1 (ko) * 2003-02-17 2010-05-31 엘지디스플레이 주식회사 카세트세정장치
WO2009010394A1 (en) * 2007-07-13 2009-01-22 Sez Ag Apparatus and method for wet treatment of disc-like articles
US8821681B2 (en) 2007-07-13 2014-09-02 Lam Research Ag Apparatus and method for wet treatment of disc-like articles
JP2009260094A (ja) * 2008-04-18 2009-11-05 Disco Abrasive Syst Ltd スピンナ洗浄装置および加工装置
JP2009290241A (ja) * 2009-09-09 2009-12-10 Renesas Technology Corp 洗浄装置およびその洗浄装置を利用した被洗浄物の洗浄方法
JP2014103274A (ja) * 2012-11-20 2014-06-05 Shindengen Electric Mfg Co Ltd レジスト現像装置、レジスト現像方法及び半導体装置の製造方法
US9748120B2 (en) 2013-07-01 2017-08-29 Lam Research Ag Apparatus for liquid treatment of disc-shaped articles and heating system for use in such apparatus

Also Published As

Publication number Publication date
JPH0573245B2 (OSRAM) 1993-10-14

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