JPS63153839A - 基板の回転保持装置 - Google Patents

基板の回転保持装置

Info

Publication number
JPS63153839A
JPS63153839A JP61285752A JP28575286A JPS63153839A JP S63153839 A JPS63153839 A JP S63153839A JP 61285752 A JP61285752 A JP 61285752A JP 28575286 A JP28575286 A JP 28575286A JP S63153839 A JPS63153839 A JP S63153839A
Authority
JP
Japan
Prior art keywords
movable
claw
substrate
pawl
shaft
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61285752A
Other languages
English (en)
Japanese (ja)
Other versions
JPH039607B2 (enExample
Inventor
Kaoru Niihara
薫 新原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dainippon Screen Manufacturing Co Ltd
Original Assignee
Dainippon Screen Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Screen Manufacturing Co Ltd filed Critical Dainippon Screen Manufacturing Co Ltd
Priority to US07/084,336 priority Critical patent/US4788994A/en
Priority to KR1019870008806A priority patent/KR920000673B1/ko
Publication of JPS63153839A publication Critical patent/JPS63153839A/ja
Publication of JPH039607B2 publication Critical patent/JPH039607B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
    • B05C11/08—Spreading liquid or other fluent material by manipulating the work, e.g. tilting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP61285752A 1986-08-13 1986-11-29 基板の回転保持装置 Granted JPS63153839A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US07/084,336 US4788994A (en) 1986-08-13 1987-08-11 Wafer holding mechanism
KR1019870008806A KR920000673B1 (ko) 1986-08-13 1987-08-11 웨이퍼 지지기구

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP19024686 1986-08-13
JP61-190246 1986-08-13

Publications (2)

Publication Number Publication Date
JPS63153839A true JPS63153839A (ja) 1988-06-27
JPH039607B2 JPH039607B2 (enExample) 1991-02-08

Family

ID=16254941

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61285752A Granted JPS63153839A (ja) 1986-08-13 1986-11-29 基板の回転保持装置

Country Status (2)

Country Link
JP (1) JPS63153839A (enExample)
KR (1) KR920000673B1 (enExample)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0245951A (ja) * 1988-08-08 1990-02-15 Kyushu Electron Metal Co Ltd 半導体基板の保持装置
US5916366A (en) * 1996-10-08 1999-06-29 Dainippon Screen Mfg. Co., Ltd. Substrate spin treating apparatus
JP2002174502A (ja) * 2000-12-07 2002-06-21 Ulvac Japan Ltd 軸出し装置、膜厚測定装置、成膜装置、軸出し方法及び膜厚測定方法
JP2003100850A (ja) * 2001-09-21 2003-04-04 Assist Japan Kk ウェハのアライナー装置
US6921466B2 (en) 2000-04-27 2005-07-26 Ebara Corporation Revolution member supporting apparatus and semiconductor substrate processing apparatus
US7354481B2 (en) 2004-09-14 2008-04-08 Dainippon Screen Mfg. Co., Ltd. Substrate holding and rotating apparatus
JP2009055046A (ja) * 2008-09-26 2009-03-12 Hitachi Kokusai Electric Inc 半導体製造方法及びその装置
JP2009060063A (ja) * 2007-09-04 2009-03-19 Tokyo Electron Ltd 処理装置、処理方法および記憶媒体
JP2012004310A (ja) * 2010-06-16 2012-01-05 Tokyo Electron Ltd 基板液処理装置
JP2013187490A (ja) * 2012-03-09 2013-09-19 Tokyo Electron Ltd 液処理装置
KR20150000417A (ko) * 2013-06-24 2015-01-02 가부시키가이샤 에바라 세이사꾸쇼 기판 유지 장치 및 기판 세정 장치
TWI611501B (zh) * 2016-09-23 2018-01-11 Screen Holdings Co Ltd 基板處理裝置
JP2023123665A (ja) * 2018-01-10 2023-09-05 ラム リサーチ コーポレーション 追加の回転軸を有する回転インデクサ

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100367665B1 (ko) * 2000-07-24 2003-01-10 (주)케이.씨.텍 웨이퍼 고정장치
KR100829923B1 (ko) 2006-08-30 2008-05-16 세메스 주식회사 스핀헤드 및 이를 이용하는 기판처리방법
KR100873153B1 (ko) * 2007-10-05 2008-12-10 세메스 주식회사 스핀 헤드

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0245951A (ja) * 1988-08-08 1990-02-15 Kyushu Electron Metal Co Ltd 半導体基板の保持装置
US5916366A (en) * 1996-10-08 1999-06-29 Dainippon Screen Mfg. Co., Ltd. Substrate spin treating apparatus
US6921466B2 (en) 2000-04-27 2005-07-26 Ebara Corporation Revolution member supporting apparatus and semiconductor substrate processing apparatus
JP2002174502A (ja) * 2000-12-07 2002-06-21 Ulvac Japan Ltd 軸出し装置、膜厚測定装置、成膜装置、軸出し方法及び膜厚測定方法
JP2003100850A (ja) * 2001-09-21 2003-04-04 Assist Japan Kk ウェハのアライナー装置
US7354481B2 (en) 2004-09-14 2008-04-08 Dainippon Screen Mfg. Co., Ltd. Substrate holding and rotating apparatus
JP2009060063A (ja) * 2007-09-04 2009-03-19 Tokyo Electron Ltd 処理装置、処理方法および記憶媒体
JP2009055046A (ja) * 2008-09-26 2009-03-12 Hitachi Kokusai Electric Inc 半導体製造方法及びその装置
JP2012004310A (ja) * 2010-06-16 2012-01-05 Tokyo Electron Ltd 基板液処理装置
JP2013187490A (ja) * 2012-03-09 2013-09-19 Tokyo Electron Ltd 液処理装置
KR20130103378A (ko) * 2012-03-09 2013-09-23 도쿄엘렉트론가부시키가이샤 액 처리 장치
US9272310B2 (en) 2012-03-09 2016-03-01 Tokyo Electron Limited Liquid processing apparatus
TWI562260B (en) * 2012-03-09 2016-12-11 Tokyo Electron Ltd Liquid processing device
KR20150000417A (ko) * 2013-06-24 2015-01-02 가부시키가이샤 에바라 세이사꾸쇼 기판 유지 장치 및 기판 세정 장치
JP2015005689A (ja) * 2013-06-24 2015-01-08 株式会社荏原製作所 基板保持装置および基板洗浄装置
US9558971B2 (en) 2013-06-24 2017-01-31 Ebara Corporation Substrate holding apparatus and substrate cleaning apparatus
JP2017163162A (ja) * 2013-06-24 2017-09-14 株式会社荏原製作所 基板保持装置
TWI611501B (zh) * 2016-09-23 2018-01-11 Screen Holdings Co Ltd 基板處理裝置
JP2023123665A (ja) * 2018-01-10 2023-09-05 ラム リサーチ コーポレーション 追加の回転軸を有する回転インデクサ

Also Published As

Publication number Publication date
JPH039607B2 (enExample) 1991-02-08
KR880003411A (ko) 1988-05-17
KR920000673B1 (ko) 1992-01-20

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