KR100367665B1 - 웨이퍼 고정장치 - Google Patents
웨이퍼 고정장치 Download PDFInfo
- Publication number
- KR100367665B1 KR100367665B1 KR10-2000-0042474A KR20000042474A KR100367665B1 KR 100367665 B1 KR100367665 B1 KR 100367665B1 KR 20000042474 A KR20000042474 A KR 20000042474A KR 100367665 B1 KR100367665 B1 KR 100367665B1
- Authority
- KR
- South Korea
- Prior art keywords
- wafer
- rotating plate
- rotation
- holders
- center
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
Description
Claims (6)
- 구동원에 의하여 회전하는 회전 플레이트; 그리고상기 회전 플레이트의 회전 중심으로부터 동일한 거리에 각각 교차적으로 고정되어 회전시 상기 회전 플레이트와 동일원상에서 회전하게 되며, 그 상부에 안착되는 웨이퍼가 상기 회전 플레이트의 회전중심으로부터 편심된 상태로 회전할 수 있도록 상기 웨이퍼를 고정하는 복수개의 제1 및 제2 홀더를 포함하며,상기 제1 홀더는 상기 회전 플레이트의 외주면에 고정되는 하부몸체와, 상기 하부몸체의 상부에 돌출 형성되며 그 상부에 경사면이 형성되어 상기 웨이퍼가 안착되는 상부몸체로 구성되며, 상기 제2 홀더는 상기 회전 플레이트의 외주면에 고정되는 하부몸체와, 상기 하부몸체의 상부에 돌출 형성되며 그 상부에 수직면이 형성되어 상기 웨이퍼의 이탈을 방지하는 상부몸체로 구성되고, 상기 복수개의 제1 및 제2 홀더는 그 크기를 각각 다르게 형성하므로써, 상기 회전 플레이트의 회전중심으로부터 각각 다른 길이로 이격되어 상기 웨이퍼가 안착되는 경우, 상기 웨이퍼가 상기 회전 플레이트의 회전중심에 대하여 편심되는 웨이퍼 고정장치.
- 삭제
- 제2 항에 있어서, 상기 복수개의 제1 홀더는 서로 120°각도를 유지하므로써, 상기 웨이퍼가 안정적으로 안착되는 웨이퍼 고정장치.
- 삭제
- 제1 항에 있어서, 상기 회전 플레이트의 후면에 돌출 형성되어, 세척수 분사시, 상기 회전 플레이트의 전면으로부터 후면으로 흐르는 유체의 유입을 방지하는 유입방지턱을 포함하는 웨이퍼 고정장치.
- 제5 항에 있어서, 상기 유입방지턱은 상기 회전 플레이트의 후면에 소정 곡률로 만곡되어 돌출 형성되는 프로펠러 형상이며, 회전시 원심력에 의하여 상기 유체를 외부로 비산시키는 웨이퍼 고정장치.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2000-0042474A KR100367665B1 (ko) | 2000-07-24 | 2000-07-24 | 웨이퍼 고정장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2000-0042474A KR100367665B1 (ko) | 2000-07-24 | 2000-07-24 | 웨이퍼 고정장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20020008622A KR20020008622A (ko) | 2002-01-31 |
KR100367665B1 true KR100367665B1 (ko) | 2003-01-10 |
Family
ID=19679599
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR10-2000-0042474A KR100367665B1 (ko) | 2000-07-24 | 2000-07-24 | 웨이퍼 고정장치 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR100367665B1 (ko) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100513276B1 (ko) * | 2003-05-23 | 2005-09-09 | 삼성전자주식회사 | 웨이퍼 고정 스핀 척 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR880003411A (ko) * | 1986-08-13 | 1988-05-17 | 이시다 도쿠지로오 | 웨이퍼 지지기구 |
-
2000
- 2000-07-24 KR KR10-2000-0042474A patent/KR100367665B1/ko active IP Right Grant
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR880003411A (ko) * | 1986-08-13 | 1988-05-17 | 이시다 도쿠지로오 | 웨이퍼 지지기구 |
Also Published As
Publication number | Publication date |
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KR20020008622A (ko) | 2002-01-31 |
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