JPS63147395A - 高密度配線多層基板の製造法 - Google Patents
高密度配線多層基板の製造法Info
- Publication number
- JPS63147395A JPS63147395A JP29445986A JP29445986A JPS63147395A JP S63147395 A JPS63147395 A JP S63147395A JP 29445986 A JP29445986 A JP 29445986A JP 29445986 A JP29445986 A JP 29445986A JP S63147395 A JPS63147395 A JP S63147395A
- Authority
- JP
- Japan
- Prior art keywords
- copper
- weight
- manufacture
- high density
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title description 6
- 239000010949 copper Substances 0.000 claims description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 17
- 229910052802 copper Inorganic materials 0.000 claims description 17
- 239000004020 conductor Substances 0.000 claims description 13
- 239000011521 glass Substances 0.000 claims description 6
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 claims description 4
- 239000005751 Copper oxide Substances 0.000 claims description 4
- 229910000431 copper oxide Inorganic materials 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 3
- 239000000758 substrate Substances 0.000 description 8
- 239000002245 particle Substances 0.000 description 6
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical group O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 229910017770 Cu—Ag Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000002241 glass-ceramic Substances 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29445986A JPS63147395A (ja) | 1986-12-10 | 1986-12-10 | 高密度配線多層基板の製造法 |
| US07/133,817 US4871608A (en) | 1986-12-10 | 1987-12-10 | High-density wiring multilayered substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29445986A JPS63147395A (ja) | 1986-12-10 | 1986-12-10 | 高密度配線多層基板の製造法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63147395A true JPS63147395A (ja) | 1988-06-20 |
| JPH0455557B2 JPH0455557B2 (enrdf_load_stackoverflow) | 1992-09-03 |
Family
ID=17808055
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29445986A Granted JPS63147395A (ja) | 1986-12-10 | 1986-12-10 | 高密度配線多層基板の製造法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63147395A (enrdf_load_stackoverflow) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60170286A (ja) * | 1984-02-14 | 1985-09-03 | 富士通株式会社 | ガラスセラミツク基板の製造方法 |
| JPS61163696A (ja) * | 1985-01-11 | 1986-07-24 | 日本特殊陶業株式会社 | 多層回路基板 |
| JPS61196599A (ja) * | 1985-02-26 | 1986-08-30 | 日本特殊陶業株式会社 | 結晶化ガラス多層回路基板 |
-
1986
- 1986-12-10 JP JP29445986A patent/JPS63147395A/ja active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60170286A (ja) * | 1984-02-14 | 1985-09-03 | 富士通株式会社 | ガラスセラミツク基板の製造方法 |
| JPS61163696A (ja) * | 1985-01-11 | 1986-07-24 | 日本特殊陶業株式会社 | 多層回路基板 |
| JPS61196599A (ja) * | 1985-02-26 | 1986-08-30 | 日本特殊陶業株式会社 | 結晶化ガラス多層回路基板 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0455557B2 (enrdf_load_stackoverflow) | 1992-09-03 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |