JPH0455557B2 - - Google Patents

Info

Publication number
JPH0455557B2
JPH0455557B2 JP61294459A JP29445986A JPH0455557B2 JP H0455557 B2 JPH0455557 B2 JP H0455557B2 JP 61294459 A JP61294459 A JP 61294459A JP 29445986 A JP29445986 A JP 29445986A JP H0455557 B2 JPH0455557 B2 JP H0455557B2
Authority
JP
Japan
Prior art keywords
weight
copper
conductor
mno
airtightness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61294459A
Other languages
English (en)
Japanese (ja)
Other versions
JPS63147395A (ja
Inventor
Kazuo Kondo
Hiroshi Iwata
Yoshimasa Shibata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Niterra Co Ltd
Original Assignee
NGK Spark Plug Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Spark Plug Co Ltd filed Critical NGK Spark Plug Co Ltd
Priority to JP29445986A priority Critical patent/JPS63147395A/ja
Priority to US07/133,817 priority patent/US4871608A/en
Publication of JPS63147395A publication Critical patent/JPS63147395A/ja
Publication of JPH0455557B2 publication Critical patent/JPH0455557B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Parts Printed On Printed Circuit Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP29445986A 1986-12-10 1986-12-10 高密度配線多層基板の製造法 Granted JPS63147395A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP29445986A JPS63147395A (ja) 1986-12-10 1986-12-10 高密度配線多層基板の製造法
US07/133,817 US4871608A (en) 1986-12-10 1987-12-10 High-density wiring multilayered substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP29445986A JPS63147395A (ja) 1986-12-10 1986-12-10 高密度配線多層基板の製造法

Publications (2)

Publication Number Publication Date
JPS63147395A JPS63147395A (ja) 1988-06-20
JPH0455557B2 true JPH0455557B2 (enrdf_load_stackoverflow) 1992-09-03

Family

ID=17808055

Family Applications (1)

Application Number Title Priority Date Filing Date
JP29445986A Granted JPS63147395A (ja) 1986-12-10 1986-12-10 高密度配線多層基板の製造法

Country Status (1)

Country Link
JP (1) JPS63147395A (enrdf_load_stackoverflow)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60170286A (ja) * 1984-02-14 1985-09-03 富士通株式会社 ガラスセラミツク基板の製造方法
JPS61163696A (ja) * 1985-01-11 1986-07-24 日本特殊陶業株式会社 多層回路基板
JPS61196599A (ja) * 1985-02-26 1986-08-30 日本特殊陶業株式会社 結晶化ガラス多層回路基板

Also Published As

Publication number Publication date
JPS63147395A (ja) 1988-06-20

Similar Documents

Publication Publication Date Title
US4861646A (en) Co-fired metal-ceramic package
JPH0361359B2 (enrdf_load_stackoverflow)
JPS6244879B2 (enrdf_load_stackoverflow)
EP0276004B1 (en) Multilayer ceramic substrate and method for making the same
JP2002226259A (ja) セラミック電子部品の基体用組成物、セラミック電子部品および積層型セラミック電子部品の製造方法
JPH0728128B2 (ja) セラミック多層配線基板とその製造方法
JPH04243962A (ja) 多層セラミックパッケージ用低誘電性無機組成物、及びその調製方法
EP1717858A1 (en) Thick film conductor paste compositions for LTCC tape in microwave applications
JP3528037B2 (ja) ガラスセラミック基板の製造方法
CA2050095A1 (en) Dielectric composition containing cordierite and glass
US20100200283A1 (en) Insulation paste for a metal core substrate and electronic device
US4837408A (en) High density multilayer wiring board and the manufacturing thereof
US4871608A (en) High-density wiring multilayered substrate
JPS6248097A (ja) 多層回路基板の製造法
US5011530A (en) Metallizing composition for use with ceramics
US5120473A (en) Metallizing composition for use with ceramics
JPH0455557B2 (enrdf_load_stackoverflow)
JPH11186727A (ja) 配線基板およびその製造方法
JPH068189B2 (ja) 酸化物誘電体材料
JPH0552078B2 (enrdf_load_stackoverflow)
JP3222296B2 (ja) 導電性インキ
JPS59162169A (ja) セラミック多層配線板
JP3426920B2 (ja) 配線基板
JPH0534311B2 (enrdf_load_stackoverflow)
EP0242226A2 (en) Glass-ceramic materials with low firing temperature

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees