JPS63127137U - - Google Patents

Info

Publication number
JPS63127137U
JPS63127137U JP1987018110U JP1811087U JPS63127137U JP S63127137 U JPS63127137 U JP S63127137U JP 1987018110 U JP1987018110 U JP 1987018110U JP 1811087 U JP1811087 U JP 1811087U JP S63127137 U JPS63127137 U JP S63127137U
Authority
JP
Japan
Prior art keywords
terminal
mold
semiconductor device
utility
scope
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987018110U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987018110U priority Critical patent/JPS63127137U/ja
Publication of JPS63127137U publication Critical patent/JPS63127137U/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W90/756

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1987018110U 1987-02-09 1987-02-09 Pending JPS63127137U (cg-RX-API-DMAC10.html)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987018110U JPS63127137U (cg-RX-API-DMAC10.html) 1987-02-09 1987-02-09

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987018110U JPS63127137U (cg-RX-API-DMAC10.html) 1987-02-09 1987-02-09

Publications (1)

Publication Number Publication Date
JPS63127137U true JPS63127137U (cg-RX-API-DMAC10.html) 1988-08-19

Family

ID=30811490

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987018110U Pending JPS63127137U (cg-RX-API-DMAC10.html) 1987-02-09 1987-02-09

Country Status (1)

Country Link
JP (1) JPS63127137U (cg-RX-API-DMAC10.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0385650U (cg-RX-API-DMAC10.html) * 1989-12-21 1991-08-29

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0385650U (cg-RX-API-DMAC10.html) * 1989-12-21 1991-08-29

Similar Documents

Publication Publication Date Title
JPS63127137U (cg-RX-API-DMAC10.html)
JPS5827934U (ja) 半導体装置
JPS5977241U (ja) 樹脂封止型半導体装置
JPS58440U (ja) プラスチツクパツケ−ジ
JPH0526760Y2 (cg-RX-API-DMAC10.html)
JPS619840U (ja) 樹脂封止型半導体装置
JPS6033452U (ja) 樹脂封止型半導体装置
JPS606232U (ja) 半導体装置の樹脂外装体
JPS63124759U (cg-RX-API-DMAC10.html)
JPS59112951U (ja) 絶縁物封止半導体装置
JPS59195751U (ja) 樹脂封止型半導体装置
JPS6016553U (ja) 樹脂封止型半導体装置
JPS6073243U (ja) 樹脂封止形半導体装置
JPS6081652U (ja) 樹脂封止型半導体装置
JPS60129134U (ja) 樹脂封止構造
JPS5840843U (ja) 樹脂封止型半導体装置
JPS596844U (ja) 樹脂封止型半導体装置
JPS59164241U (ja) セラミツクパツケ−ジ
JPS60144241U (ja) 樹脂封止型半導体装置
JPS63108641U (cg-RX-API-DMAC10.html)
JPS59111052U (ja) 混成集積回路装置
JPS60125730U (ja) 半導体装置の樹脂封止金型
JPS63108648U (cg-RX-API-DMAC10.html)
JPS6073249U (ja) 樹脂封止半導体装置
JPH0224555U (cg-RX-API-DMAC10.html)