JPH0224555U - - Google Patents

Info

Publication number
JPH0224555U
JPH0224555U JP1988102040U JP10204088U JPH0224555U JP H0224555 U JPH0224555 U JP H0224555U JP 1988102040 U JP1988102040 U JP 1988102040U JP 10204088 U JP10204088 U JP 10204088U JP H0224555 U JPH0224555 U JP H0224555U
Authority
JP
Japan
Prior art keywords
leadless electronic
electronic component
resin
bent
resin molded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988102040U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988102040U priority Critical patent/JPH0224555U/ja
Publication of JPH0224555U publication Critical patent/JPH0224555U/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W72/60
    • H10W72/0198
    • H10W72/076
    • H10W72/07653
    • H10W74/00
    • H10W90/756
    • H10W90/766

Landscapes

  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
JP1988102040U 1988-08-04 1988-08-04 Pending JPH0224555U (cg-RX-API-DMAC10.html)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988102040U JPH0224555U (cg-RX-API-DMAC10.html) 1988-08-04 1988-08-04

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988102040U JPH0224555U (cg-RX-API-DMAC10.html) 1988-08-04 1988-08-04

Publications (1)

Publication Number Publication Date
JPH0224555U true JPH0224555U (cg-RX-API-DMAC10.html) 1990-02-19

Family

ID=31331580

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988102040U Pending JPH0224555U (cg-RX-API-DMAC10.html) 1988-08-04 1988-08-04

Country Status (1)

Country Link
JP (1) JPH0224555U (cg-RX-API-DMAC10.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011249395A (ja) * 2010-05-24 2011-12-08 Mitsubishi Electric Corp 半導体装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60161646A (ja) * 1984-02-01 1985-08-23 Hitachi Ltd 半導体装置用リ−ドフレ−ム
JPS61236144A (ja) * 1985-04-12 1986-10-21 Hitachi Ltd レジンモ−ルド型半導体装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60161646A (ja) * 1984-02-01 1985-08-23 Hitachi Ltd 半導体装置用リ−ドフレ−ム
JPS61236144A (ja) * 1985-04-12 1986-10-21 Hitachi Ltd レジンモ−ルド型半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011249395A (ja) * 2010-05-24 2011-12-08 Mitsubishi Electric Corp 半導体装置

Similar Documents

Publication Publication Date Title
JPH0224555U (cg-RX-API-DMAC10.html)
JPS5878654U (ja) モ−ルド型半導体素子
JPS58191645U (ja) 半導体装置のパツケ−ジ
JPS63137954U (cg-RX-API-DMAC10.html)
JPH0361354U (cg-RX-API-DMAC10.html)
JPS6389253U (cg-RX-API-DMAC10.html)
JPS6448051U (cg-RX-API-DMAC10.html)
JPH0336141U (cg-RX-API-DMAC10.html)
JPS6416640U (cg-RX-API-DMAC10.html)
JPS619849U (ja) 回路基板
JPS59164251U (ja) 半導体装置用リ−ドフレ−ム
JPH032650U (cg-RX-API-DMAC10.html)
JPH0334228U (cg-RX-API-DMAC10.html)
JPS6128611U (ja) ゲ−ジピン
JPS58138351U (ja) 半導体パツケ−ジ
JPS6117689U (ja) 時計ケ−ス
JPS63108648U (cg-RX-API-DMAC10.html)
JPS5827971U (ja) 樹脂封止型電子機器
JPH0377461U (cg-RX-API-DMAC10.html)
JPS59111052U (ja) 混成集積回路装置
JPH01107150U (cg-RX-API-DMAC10.html)
JPH0292667U (cg-RX-API-DMAC10.html)
JPS583038U (ja) リ−ドフレ−ム
JPH0231147U (cg-RX-API-DMAC10.html)
JPS599534U (ja) 電子部品