JPS6298638A - ダイボンデイング装置 - Google Patents
ダイボンデイング装置Info
- Publication number
- JPS6298638A JPS6298638A JP60238196A JP23819685A JPS6298638A JP S6298638 A JPS6298638 A JP S6298638A JP 60238196 A JP60238196 A JP 60238196A JP 23819685 A JP23819685 A JP 23819685A JP S6298638 A JPS6298638 A JP S6298638A
- Authority
- JP
- Japan
- Prior art keywords
- die
- needle
- push
- thrust
- peripheral
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10P72/7414—
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60238196A JPS6298638A (ja) | 1985-10-24 | 1985-10-24 | ダイボンデイング装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60238196A JPS6298638A (ja) | 1985-10-24 | 1985-10-24 | ダイボンデイング装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6298638A true JPS6298638A (ja) | 1987-05-08 |
| JPH0354858B2 JPH0354858B2 (show.php) | 1991-08-21 |
Family
ID=17026585
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60238196A Granted JPS6298638A (ja) | 1985-10-24 | 1985-10-24 | ダイボンデイング装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6298638A (show.php) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0224549U (show.php) * | 1988-07-29 | 1990-02-19 | ||
| US4907790A (en) * | 1987-12-15 | 1990-03-13 | Kabushiki Kaisha Shinkawa | Pellet-lifting apparatus |
| JPH0376139A (ja) * | 1989-08-18 | 1991-04-02 | Nec Corp | 半導体素子突上げ方法 |
| JPH04137043U (ja) * | 1991-06-12 | 1992-12-21 | 山形日本電気株式会社 | 半導体ダイボンデイング装置のダイ突き上げ機構 |
| US7238258B2 (en) * | 2005-04-22 | 2007-07-03 | Stats Chippac Ltd. | System for peeling semiconductor chips from tape |
| US7445688B2 (en) * | 2003-07-09 | 2008-11-04 | Tdk Corporation | Method and apparatus for picking up work piece and mounting machine |
| WO2009056469A1 (en) * | 2007-10-31 | 2009-05-07 | Oerlikon Assembly Equipment Ag, Steinhausen | Foil perforating needle for detaching a small die from a foil |
| JP2010165835A (ja) * | 2009-01-15 | 2010-07-29 | Tdk Corp | 電子部品のピックアップ方法及びピックアップ装置 |
-
1985
- 1985-10-24 JP JP60238196A patent/JPS6298638A/ja active Granted
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4907790A (en) * | 1987-12-15 | 1990-03-13 | Kabushiki Kaisha Shinkawa | Pellet-lifting apparatus |
| JPH0224549U (show.php) * | 1988-07-29 | 1990-02-19 | ||
| JPH0376139A (ja) * | 1989-08-18 | 1991-04-02 | Nec Corp | 半導体素子突上げ方法 |
| JPH04137043U (ja) * | 1991-06-12 | 1992-12-21 | 山形日本電気株式会社 | 半導体ダイボンデイング装置のダイ突き上げ機構 |
| US7445688B2 (en) * | 2003-07-09 | 2008-11-04 | Tdk Corporation | Method and apparatus for picking up work piece and mounting machine |
| US7238258B2 (en) * | 2005-04-22 | 2007-07-03 | Stats Chippac Ltd. | System for peeling semiconductor chips from tape |
| WO2009056469A1 (en) * | 2007-10-31 | 2009-05-07 | Oerlikon Assembly Equipment Ag, Steinhausen | Foil perforating needle for detaching a small die from a foil |
| JP2010165835A (ja) * | 2009-01-15 | 2010-07-29 | Tdk Corp | 電子部品のピックアップ方法及びピックアップ装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0354858B2 (show.php) | 1991-08-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR20150114612A (ko) | 칩 디테칭 장치 및 칩 디테칭 방법 | |
| JP3441879B2 (ja) | チップ剥離装置 | |
| JPS6298638A (ja) | ダイボンデイング装置 | |
| KR20190126050A (ko) | 판유리의 제조 방법 및 판유리의 스냅핑 장치 | |
| CN101331601A (zh) | 芯片拾取装置、芯片拾取方法、芯片剥离装置和芯片剥离方法 | |
| JP5214421B2 (ja) | 剥離装置及び剥離方法 | |
| KR100639553B1 (ko) | 다이 픽업 장치 | |
| JPS60257537A (ja) | ダイボンデイング装置 | |
| JP5356061B2 (ja) | 剥離装置及び剥離方法 | |
| JPH0376139A (ja) | 半導体素子突上げ方法 | |
| JP6907384B1 (ja) | ピックアップ装置 | |
| JP2014165302A (ja) | 半導体チップのピックアップ装置 | |
| JP5214739B2 (ja) | チップ剥離方法、半導体装置の製造方法、及びチップ剥離装置 | |
| KR0150704B1 (ko) | 반도체 칩 분리 장치 및 분리방법 | |
| JP3509538B2 (ja) | チップの突き上げ装置 | |
| JP2619443B2 (ja) | ペレットのピックアップ方法 | |
| JP2004259811A (ja) | ダイピックアップ方法及び装置 | |
| CN108242415B (zh) | 用于剥离两基板的装置及方法 | |
| JP2002124525A (ja) | 半導体チップ剥離装置及び方法 | |
| JPS5898940A (ja) | 半導体素子取出し装置 | |
| JP2004231250A (ja) | シート剥離装置とこれを用いたシート剥離方法 | |
| JPH08309725A (ja) | 穴明け型の構造 | |
| JPH07249674A (ja) | 半導体装置の製造方法及び製造装置 | |
| CN100446651C (zh) | 机板上的柱体的装配方法及其结构 | |
| JPH0226044A (ja) | 半導体のチップのピックアップ方法 |