JPS627045U - - Google Patents
Info
- Publication number
- JPS627045U JPS627045U JP9858085U JP9858085U JPS627045U JP S627045 U JPS627045 U JP S627045U JP 9858085 U JP9858085 U JP 9858085U JP 9858085 U JP9858085 U JP 9858085U JP S627045 U JPS627045 U JP S627045U
- Authority
- JP
- Japan
- Prior art keywords
- pressure
- semiconductor
- conducting
- semiconductor substrate
- sensor chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 5
- 239000011521 glass Substances 0.000 claims description 3
- 239000010409 thin film Substances 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 4
- 238000010276 construction Methods 0.000 description 2
Landscapes
- Measuring Fluid Pressure (AREA)
- Pressure Sensors (AREA)
Description
第１図は本考案の一実施例の構成説明図、第２
図は第１図の製作説明図、第３図は本考案の他の
実施例の構成説明図、第４図は従来より一般に使
用されている従来例の構成説明図である。
１…センサチツプ、１１…ダイアフラム部、１
２…導圧室、２…ピエゾ抵抗ゲージ、５…導圧パ
イプ、７…半導体基板本体、７１…ガラス薄膜、
７２…半導体基板、７３…導圧孔。
Figure 1 is an explanatory diagram of the configuration of one embodiment of the present invention;
The drawings are an explanatory diagram of the production of FIG. 1, FIG. 3 is an explanatory diagram of the construction of another embodiment of the present invention, and FIG. 4 is an explanatory diagram of the construction of a conventional example that has been commonly used. 1...sensor chip, 11...diaphragm part, 1
2... Pressure chamber, 2... Piezo resistance gauge, 5... Pressure guide pipe, 7... Semiconductor substrate body, 71... Glass thin film,
72...Semiconductor substrate, 73...Pressure hole.
Claims (1)
、該センサチツプに取付けられ前記導圧室に圧力
を導入する導入孔を有する半導体基板本体と、前
記導圧孔に取付けられた導圧パイプとを具備する
半導体圧力センサにおいて、前記半導体基板本体
が片面にガラス薄膜が形成された少くとも二個の
半導体基板を該ガラス薄膜の一方を介して陽極接
合されることにより組み立てられたことを特徴と
する半導体圧力センサ。 A semiconductor comprising: a sensor chip made of a semiconductor having a pressure-conducting chamber; a semiconductor substrate main body having an introduction hole attached to the sensor chip for introducing pressure into the pressure-conducting chamber; and a pressure-conducting pipe attached to the pressure-conducting hole. A pressure sensor, characterized in that the semiconductor substrate body is assembled by anodic bonding of at least two semiconductor substrates each having a glass thin film formed on one side via one of the glass thin films. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9858085U JPS627045U (en) | 1985-06-28 | 1985-06-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9858085U JPS627045U (en) | 1985-06-28 | 1985-06-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS627045U true JPS627045U (en) | 1987-01-16 |
Family
ID=30966646
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9858085U Pending JPS627045U (en) | 1985-06-28 | 1985-06-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS627045U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012002810A (en) * | 2010-06-18 | 2012-01-05 | General Electric Co <Ge> | Sensor and sensor manufacturing method |
-
1985
- 1985-06-28 JP JP9858085U patent/JPS627045U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012002810A (en) * | 2010-06-18 | 2012-01-05 | General Electric Co <Ge> | Sensor and sensor manufacturing method |