JPS6358731U - - Google Patents

Info

Publication number
JPS6358731U
JPS6358731U JP15356086U JP15356086U JPS6358731U JP S6358731 U JPS6358731 U JP S6358731U JP 15356086 U JP15356086 U JP 15356086U JP 15356086 U JP15356086 U JP 15356086U JP S6358731 U JPS6358731 U JP S6358731U
Authority
JP
Japan
Prior art keywords
sensor chip
diaphragm
sensor
semiconductor
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15356086U
Other languages
Japanese (ja)
Other versions
JPH0526983Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986153560U priority Critical patent/JPH0526983Y2/ja
Publication of JPS6358731U publication Critical patent/JPS6358731U/ja
Application granted granted Critical
Publication of JPH0526983Y2 publication Critical patent/JPH0526983Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Measuring Fluid Pressure (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案の一実施例の構成説明図、第２
図は第１図の要部構成説明図、第３図は第１図の
動作説明図、第４図は本考案の他の実施例の要部
構成説明図、第５図は本考案の別の実施例の要部
構成説明図、第６図は従来より一般に使用されて
いる従来例の構成説明図である。 １……センサチツプ、１１……ダイアフラム部
、１２……導圧部、２……ピエゾ抵抗ゲージ、３
１……導圧孔、４……低融点ガラス、６……接着
剤、７……半導体基板、７１……絶縁溝、８……
筐体部。 Figure 1 is an explanatory diagram of the configuration of one embodiment of the present invention;
The figure is an explanatory diagram of the main part configuration of FIG. 1, FIG. 3 is an explanatory diagram of the operation of FIG. 1, FIG. 4 is an explanatory diagram of the main part configuration of another embodiment of the present invention, and FIG. FIG. 6 is an explanatory diagram of the configuration of a conventional example that has been generally used. DESCRIPTION OF SYMBOLS 1...Sensor chip, 11...Diaphragm part, 12...Pressure pressure part, 2...Piezo resistance gauge, 3
1... Pressure conducting hole, 4... Low melting point glass, 6... Adhesive, 7... Semiconductor substrate, 71... Insulating groove, 8...
Housing part.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体からなるセンサチツプと、該センサチツ
プに設けられダイアフラムを形成する凹部と、前
記ダイアフラムに設けられたピエゾ抵抗ゲージと
、前記チツプに取付けられ前記凹部と導圧室を構
成する基板とを具備する半導体圧力センサにおい
て、前記基板に設けられ前記センサチツプを中心
に同心閉曲線状に設けられ力の伝達を防止する絶
縁溝を具備したことを特徴とする半導体圧力セン
サ。 A semiconductor pressure sensor comprising a sensor chip made of a semiconductor, a recess provided in the sensor chip and forming a diaphragm, a piezoresistance gauge provided in the diaphragm, and a substrate attached to the chip and forming a pressure chamber with the recess. 1. A semiconductor pressure sensor, comprising: an insulating groove provided on the substrate in a concentric closed curve shape around the sensor chip to prevent force transmission.
JP1986153560U 1986-10-06 1986-10-06 Expired - Lifetime JPH0526983Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986153560U JPH0526983Y2 (en) 1986-10-06 1986-10-06

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986153560U JPH0526983Y2 (en) 1986-10-06 1986-10-06

Publications (2)

Publication Number Publication Date
JPS6358731U true JPS6358731U (en) 1988-04-19
JPH0526983Y2 JPH0526983Y2 (en) 1993-07-08

Family

ID=31072557

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986153560U Expired - Lifetime JPH0526983Y2 (en) 1986-10-06 1986-10-06

Country Status (1)

Country Link
JP (1) JPH0526983Y2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004045424A (en) * 2003-09-22 2004-02-12 Tadahiro Omi Mounting structure of pressure detector
JP2005040601A (en) * 2003-07-18 2005-02-17 Radi Medical Systems Ab Sensor-guide wire assembly and its manufacturing method
WO2008062694A1 (en) * 2006-11-20 2008-05-29 Toyota Jidosha Kabushiki Kaisha Pressure sensor

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3494594B2 (en) * 1999-08-05 2004-02-09 忠弘 大見 Pressure detector mounting structure

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52141594A (en) * 1977-01-31 1977-11-25 Hitachi Ltd Semiconductor type pressure transmittor
JPS53109483U (en) * 1977-02-08 1978-09-01

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52141594A (en) * 1977-01-31 1977-11-25 Hitachi Ltd Semiconductor type pressure transmittor
JPS53109483U (en) * 1977-02-08 1978-09-01

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005040601A (en) * 2003-07-18 2005-02-17 Radi Medical Systems Ab Sensor-guide wire assembly and its manufacturing method
JP4590547B2 (en) * 2003-07-18 2010-12-01 ラディ・メディカル・システムズ・アクチェボラーグ Sensor / guide wire assembly and manufacturing method thereof
JP2004045424A (en) * 2003-09-22 2004-02-12 Tadahiro Omi Mounting structure of pressure detector
WO2008062694A1 (en) * 2006-11-20 2008-05-29 Toyota Jidosha Kabushiki Kaisha Pressure sensor
US8015880B2 (en) 2006-11-20 2011-09-13 Toyota Jidosha Kabushiki Kaisha Pressure sensor

Also Published As

Publication number Publication date
JPH0526983Y2 (en) 1993-07-08

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