JPS6367266U - - Google Patents
Info
- Publication number
- JPS6367266U JPS6367266U JP16256486U JP16256486U JPS6367266U JP S6367266 U JPS6367266 U JP S6367266U JP 16256486 U JP16256486 U JP 16256486U JP 16256486 U JP16256486 U JP 16256486U JP S6367266 U JPS6367266 U JP S6367266U
- Authority
- JP
- Japan
- Prior art keywords
- sensor chip
- diaphragm
- semiconductor
- recess
- sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 2
- 239000011521 glass Substances 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 5
Landscapes
- Pressure Sensors (AREA)
- Measuring Fluid Pressure (AREA)
Description
第１図は本考案の一実施例の構成説明図、第２
図は第１図の動作説明図、第３図は本考案の別の
実施例の構成説明図、第４図は従来より一般に使
用されている他の従来例の構成説明図、第５図は
従来より一般に使用されている別の従来例の構成
説明図である。
１……センサチツプ、１１……凹部、１２……
ダイアフラム部、１３……ピエゾ抵抗ゲージ、１
４……導圧室、４……ハウジング、６……支持体
。
Figure 1 is an explanatory diagram of the configuration of one embodiment of the present invention;
1 is an explanatory diagram of the operation of FIG. 1, FIG. 3 is an explanatory diagram of the configuration of another embodiment of the present invention, FIG. 4 is an explanatory diagram of the configuration of another conventional example commonly used, and FIG. FIG. 2 is a diagram illustrating the configuration of another conventional example that has been commonly used. 1...sensor chip, 11...recess, 12...
Diaphragm section, 13...Piezo resistance gauge, 1
4... Pressure chamber, 4... Housing, 6... Support body.
Claims (1)
プにダイアフラムを形成する凹部と、前記ダイア
フラムに設けられたピエゾ抵抗ゲージと、前記セ
ンサチツプに一端側が取付けられ前記凹部と導圧
室を構成し他端側が前記一端側より剛性が弱くな
るように断面積が小さく形成されたガラス材より
なる支持体とを具備してなる半導体圧力センサ。 A sensor chip made of a semiconductor, a recess forming a diaphragm in the sensor chip, a piezoresistance gauge provided on the diaphragm, one end of which is attached to the sensor chip and forms a pressure chamber with the recess, the other end of which is connected to the one end. A semiconductor pressure sensor comprising a support made of a glass material and having a small cross-sectional area so as to have low rigidity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16256486U JPS6367266U (en) | 1986-10-23 | 1986-10-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16256486U JPS6367266U (en) | 1986-10-23 | 1986-10-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6367266U true JPS6367266U (en) | 1988-05-06 |
Family
ID=31089945
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16256486U Pending JPS6367266U (en) | 1986-10-23 | 1986-10-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6367266U (en) |
-
1986
- 1986-10-23 JP JP16256486U patent/JPS6367266U/ja active Pending