JPH0260837U

JPH0260837U -

Info

Publication number: JPH0260837U
Application number: JP14041288U
Authority: JP
Priority date: 1988-10-27
Filing date: 1988-10-27
Publication date: 1990-05-07
Anticipated expiration: 2003-10-27
Also published as: JPH073310Y2

Description

[Brief explanation of the drawing]

第１図は本考案の一実施例の要部構成説明図、
第２図は第１図の要部構成説明図、第３図乃至第
５図は第１図の動作説明図、第６図に本半導体差
圧測定装置を自動校正出来るように構成する場合
の一システム例、第７図は従来より一般に使用さ
れている従来例の構成説明図である。１……センサチツプ、１１……凹部、１２……
ダイアフラム、１３……半導体歪みゲージ、２…
…基板、２１……第１測定室、２２……貫通孔、
３……パイプ、４……ベース、５……ボデイ、５
１……第２測定室、５２……凹部、５３……連通
孔、６……接液ダイアフラム、６１……接液室、
６２……カバー、８１……内部空所、８２……圧
電ダイアフラム、８３……連結孔、８４……封入
液、９１……本半導体差圧測定装置、９２……圧
電ダイアフラム駆動部、９３……圧力変換部、９
４……制御部。 FIG. 1 is an explanatory diagram of the main part configuration of an embodiment of the present invention,
Fig. 2 is an explanatory diagram of the main part configuration of Fig. 1, Figs. 3 to 5 are explanatory diagrams of the operation of Fig. 1, and Fig. 6 is an illustration of the configuration of this semiconductor differential pressure measuring device so as to enable automatic calibration. One system example, FIG. 7, is a diagram illustrating the configuration of a conventional system that has been commonly used. 1...sensor chip, 11...recess, 12...
Diaphragm, 13...Semiconductor strain gauge, 2...
...Substrate, 21...First measurement chamber, 22...Through hole,
3...Pipe, 4...Base, 5...Body, 5
1... Second measurement chamber, 52... Recess, 53... Communication hole, 6... Wetted diaphragm, 61... Wetted chamber,
62...Cover, 81...Internal cavity, 82...Piezoelectric diaphragm, 83...Connecting hole, 84...Sealed liquid, 91...Semiconductor differential pressure measuring device, 92...Piezoelectric diaphragm drive unit, 93... ...Pressure converter, 9
4...Control unit.

Claims

[Scope of utility model registration request]

A sensor chip made of a semiconductor, a recess provided in the sensor chip and forming a diaphragm on the sensor chip, a semiconductor strain gauge provided in the diaphragm, and a substrate having one surface fixed to the sensor chip and forming the recess and a first measurement chamber. , a through hole that penetrates the substrate and communicates with the first measurement chamber; a pipe that has one end connected to the other surface of the substrate, communicates with the through hole, and into which one measurement pressure is introduced from the other end; a base to which is fixed; a body having one end fixed to the base and forming a second measurement chamber with the base and the sensor chip; a recess provided at the other end of the body; and a recess provided in the body. A liquid contact diaphragm that constitutes a liquid contact chamber and receives the other measurement pressure; a communication hole provided in the body that communicates the second measurement chamber and the liquid contact chamber; and an internal cavity provided in the body. , a bimorph piezoelectric diaphragm that divides the internal cavity into two chambers;
a connection hole that connects the internal cavity, the second measurement chamber, and the liquid contact chamber; an enclosure that fills the internal cavity, the second measurement chamber, the liquid contact chamber, the communication hole, and the communication hole; A semiconductor differential pressure measuring device comprising: