JPH0361545U - - Google Patents
Info
- Publication number
- JPH0361545U JPH0361545U JP12223289U JP12223289U JPH0361545U JP H0361545 U JPH0361545 U JP H0361545U JP 12223289 U JP12223289 U JP 12223289U JP 12223289 U JP12223289 U JP 12223289U JP H0361545 U JPH0361545 U JP H0361545U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- plate
- sensor chip
- mount member
- convex portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 7
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000011810 insulating material Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
Landscapes
- Measuring Fluid Pressure (AREA)
Description
第１図は本考案の一実施例の要部構成説明図、
第２図は第１図の要部拡大図、第３図は従来より
一般に使用されている従来例の構成説明図である
。
１……センサチツプ、１１……凹部、１２……
ダイアフラム、１３……歪み検出センサ、２……
半導体基板、２１……大気圧基準室、２２……貫
通孔、３……大気導通パイプ、４……ベース、５
……ボデイ、５１……測定室、５２……接液ダイ
アフラム室、５３……連通孔、６１……接液ダイ
アフラム、６２……封入液、６３……ケース、６
４……ケーブル、７１……凸部、７２……プレー
ト、７３……シールド板。
FIG. 1 is an explanatory diagram of the main part configuration of an embodiment of the present invention,
FIG. 2 is an enlarged view of the main part of FIG. 1, and FIG. 3 is an explanatory diagram of the configuration of a conventional example that has been generally used. 1...sensor chip, 11...recess, 12...
Diaphragm, 13... Distortion detection sensor, 2...
Semiconductor substrate, 21...Atmospheric pressure reference chamber, 22...Through hole, 3...Atmospheric conduction pipe, 4...Base, 5
... Body, 51 ... Measurement chamber, 52 ... Wetted diaphragm chamber, 53 ... Communication hole, 61 ... Wetted diaphragm, 62 ... Filled liquid, 63 ... Case, 6
4... Cable, 71... Convex portion, 72... Plate, 73... Shield plate.
Claims (1)
と、 該マウント部材の他端が接続されたベースとを
具備する半導体圧力計において、 該基板の他面側に設けられた凸部と、 前記基板の他面に一面が対向して配置され該凸
部に一面の一部が接続され絶縁材からなるプレー
トと、 該プレートの前記基板に対向する面に設けられ
該基板をシールドするシールド板と、 前記プレートに一端が接続されたマウント部材
と、 を具備したことを特徴とする半導体圧力計。[Scope of Claim for Utility Model Registration] A sensor chip made of a semiconductor, a pressure sensor provided on the sensor chip, a substrate that holds the sensor chip on one side, a mount member whose one side is connected to the other side of the substrate, A semiconductor pressure gauge comprising a base to which the other end of the mount member is connected, comprising: a convex portion provided on the other surface of the substrate; and a convex portion disposed with one surface facing the other surface of the substrate. A plate made of an insulating material and connected to a part of one surface thereof; a shield plate provided on a surface of the plate facing the substrate to shield the substrate; and a mount member connected at one end to the plate. A semiconductor pressure gauge characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12223289U JPH0361545U (en) | 1989-10-20 | 1989-10-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12223289U JPH0361545U (en) | 1989-10-20 | 1989-10-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0361545U true JPH0361545U (en) | 1991-06-17 |
Family
ID=31670242
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12223289U Pending JPH0361545U (en) | 1989-10-20 | 1989-10-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0361545U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014178125A (en) * | 2013-03-13 | 2014-09-25 | Fuji Koki Corp | Pressure sensor |
-
1989
- 1989-10-20 JP JP12223289U patent/JPH0361545U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014178125A (en) * | 2013-03-13 | 2014-09-25 | Fuji Koki Corp | Pressure sensor |
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