JPS62174247U - - Google Patents
Info
- Publication number
- JPS62174247U JPS62174247U JP6282286U JP6282286U JPS62174247U JP S62174247 U JPS62174247 U JP S62174247U JP 6282286 U JP6282286 U JP 6282286U JP 6282286 U JP6282286 U JP 6282286U JP S62174247 U JPS62174247 U JP S62174247U
- Authority
- JP
- Japan
- Prior art keywords
- pressure
- temperature
- sensor
- detection element
- deformation member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000007788 liquid Substances 0.000 claims description 3
- 238000001514 detection method Methods 0.000 claims 2
- 230000003321 amplification Effects 0.000 description 2
- 238000003199 nucleic acid amplification method Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Measuring Fluid Pressure (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
Description
第１図は本考案の一実施例を示した断面図、第
２，３図は本考案の他の実施例を示した説明図で
ある。
１：圧力センサ筐体、２：ボデイ、３：ネジ部
、４：液導入穴、５：ダイヤフラム（圧力変形部
材）、６：歪ゲージ、７：セラミツク薄板、８：
温度センサ、９：圧力用増幅部、１０：温度用増
幅部、１１：リード線、１２：温度・圧力指示計
。
FIG. 1 is a sectional view showing one embodiment of the present invention, and FIGS. 2 and 3 are explanatory diagrams showing other embodiments of the present invention. 1: Pressure sensor housing, 2: Body, 3: Threaded part, 4: Liquid introduction hole, 5: Diaphragm (pressure deformation member), 6: Strain gauge, 7: Ceramic thin plate, 8:
Temperature sensor, 9: Pressure amplification section, 10: Temperature amplification section, 11: Lead wire, 12: Temperature/pressure indicator.
Claims (1)
の反対面に歪ゲージ等の圧力検出素子を装置した
圧力センサに於いて、 前記圧力変形部材の液との接触による温度を検
知する温度検出素子を設けたことを特徴とする温
度センサ付き圧力センサ。[Claims for Utility Model Registration] In a pressure sensor in which a pressure detection element such as a strain gauge is installed on the opposite side of a pressure deformation member such as a diaphragm on which liquid pressure acts, the temperature of the pressure deformation member due to contact with liquid A pressure sensor with a temperature sensor, characterized in that it is provided with a temperature detection element that detects.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6282286U JPS62174247U (en) | 1986-04-25 | 1986-04-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6282286U JPS62174247U (en) | 1986-04-25 | 1986-04-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62174247U true JPS62174247U (en) | 1987-11-05 |
Family
ID=30897466
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6282286U Pending JPS62174247U (en) | 1986-04-25 | 1986-04-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62174247U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20220055098A1 (en) * | 2018-06-15 | 2022-02-24 | Sintokogio, Ltd. | Green sand mold molding sensor and green sand mold moldability evaluation method |
| US11660664B2 (en) | 2018-06-15 | 2023-05-30 | Sintokogio, Ltd. | Mold molding apparatus and method for controlling mold molding apparatus |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55146019A (en) * | 1979-05-01 | 1980-11-14 | Toshiba Corp | Pressure detector of semiconductor |
| JPS55146020A (en) * | 1979-05-01 | 1980-11-14 | Toshiba Corp | Pressure detector of semiconductor |
-
1986
- 1986-04-25 JP JP6282286U patent/JPS62174247U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55146019A (en) * | 1979-05-01 | 1980-11-14 | Toshiba Corp | Pressure detector of semiconductor |
| JPS55146020A (en) * | 1979-05-01 | 1980-11-14 | Toshiba Corp | Pressure detector of semiconductor |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20220055098A1 (en) * | 2018-06-15 | 2022-02-24 | Sintokogio, Ltd. | Green sand mold molding sensor and green sand mold moldability evaluation method |
| US11660664B2 (en) | 2018-06-15 | 2023-05-30 | Sintokogio, Ltd. | Mold molding apparatus and method for controlling mold molding apparatus |